Overview:
Manufacturing with Ball Grid Array (BGA) packages generally offers high, first-pass process yields. However, process errors do occur and the likelihood of a solder joint defect (insufficient solder, bridging, solder balling, etc.) under the BGA will require the need to remove and replace the BGA component. Because BGA rework will require the removal of the component, special considerations must be taken into account. For instance, excessive heat or improper removal techniques used during the BGA component removal step has the potential to cause damage to surrounding lands, other components or the PCB itself. In short, proper rework requires sound practices, proper tools and quality training.

Who Should Attend:
This course is geared toward Manufacturing, Process and Quality Engineers responsible for implementing and/or controlling the BGA application and inspection process. Others who would benefit from this course are those person(s) responsible for training operator and technicians to perform BGA assembly inspection or control the manufacturing process.

Benefits:

• Perform individual BGA rework techniques in the EMPF Demonstration Factory
• Gain experience developing removal and replacement profiles during the hands-on portion of the instruction in the EMPF Demonstration Factory.

Course Content:
Introduction to BGAs

Upon the completion of the instruction, the learner will be able to correctly identify the different types of BGA components and the different assembly considerations that must be taken into account when using a specific type of BGA component.

BGA Rework Practices

Upon the completion of the instuction, the learner will be able to correctly perform rework procedures on assemblies with BGA components. Proper rework techniques covered will include the developement of a removal and replacement profile, component removal, PWB site preparation, solder paste application, component placement and component reattachment.

Duration: 2 Days

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