Overview:
The Electronics Manufacturing Boot Camp is a comprehensive program designed to educate participants on the many different processes and materials used in through hole and surface mount technologies. It is an intensive two week program that provides students with the opportunity to learn and understand the processes, tools, and materials used to properly manufacture electronic assemblies. In addition, it is taught by a team of experienced and knowledgeable engineers and technicians that have worked in a variety of electronics manufacturing related fields.

The course is designed to teach students through classroom lectures coupled with lab exercises. The goal is to provide students with 40% in-class lecture accompanied by 60% hands-on lab. The labs allow the opportunity for students to immediately apply the lessons learned during lecture. The 10,000 square foot demonstration factory used during the labs provides students with access to a wide variety of the latest manufacturing and processing equipment. The following paragraphs highlight some of the topics included in the Boot Camp curriculum.

Design for Manufacturability (DFM)
The DFM module teaches students the basics of circuit board fabrication and general circuit board design considerations. Students are introduced to the applicable industry specifications currently used in various circuit board designs. Future design considerations such as flip-chip, chip on board, wire bonding, micro-vias and component embedding are discussed as well. Students will gain a basic knowledge and understanding of the importance of proper circuit design which will enable them to improve current designs, and to reduce the amount of wasted time.

Bare Board Fabrication
The bare board fabrication module teaches students the details of board fabrication. Students will learn about the variety of board materials that are commonly used, the different chemical process used during fabrication, the solder-resist application, and drilling processes. The lecture is followed by a trip to a local bare board fabricator where students have the opportunity to ask questions and to see many of the in-process steps as they are being performed.

Component ID
The component ID module will introduce students to the more commonly used components in manufacturing. Component marking, polarity, and orientations are just few of the lessons taught. A copy of the IPC Component ID desk reference is given to each student.

Materials
The materials module addresses the more commonly used materials in the industry such as adhesives, solder paste, flux and solder. Students learn the different classifications and test methods related to some of these materials.

Inspection/Specifications and Standards
During the inspection/specifications and standards module, students are introduced to industry consensus specifications IPC-A-610C and J-STD-001C. The students will learn how these documents relate to inspection and process control methods. Students will receive a copy of IPC J-STD-00C for future reference.

Electrostatic Discharge (ESD)
The importance, understanding, and need for ESD control is demonstrated using some of the more commonly used ESD test equipment. Students will see for themselves the generation of damaging electrostatic charges by common sources found at workstations.

Design of Experiment (DOE)
The DOE module helps students understand the need for modern methods of experimentation. Lecture is coupled with hands-on lab excercises where students conduct simple experiments. Students will leave with the ability to identify areas of opportunity within processes for the use of designed experiments, plan and organized experiments, select appropriate designs for various scenarios, conduct analysis of designs, draw conclusions, and confirm results.

Process Control Tools
The process control tools module presents the unique equipment used to determine the effectiveness of the process such as X-ray equipment, inspection equipment and PCB testing systems.

Reliability
Mechanical and thermal stress, corrosion and contamination all have a major impact on electronic assemblies. Students will learn the long-term effects these conditions can have. Identifying reliability issues associated with SMT packaging, failure mechanisms of SMT packaging and the introduction of reliability testing equipment, methods, and models are all part of the reliability module. Students will have an opportunity to acquire hands-on experience using state-of-the-art manufacturing equipment. Dispensing, solder paste printing, component placement, thermal profiling, reflow soldering, and wave soldering equipment are all used in lab exercises in which students build their own electronic assemblies. In addition to the automated processes, students spend one day in a hand soldering and rework lab. These hands-on exercises tie together many key points learned during the lectures and provide students with a much clearer understanding of the lessons taught in class.

Classes are limited in size in order to provide students with ample opportunities to participate in a hands-on approach to learning the operation of the process equipment used.

Additional areas of focus include proper assembly cleaning methods, cleanliness testing, and the use of no-clean fluxes. Various cleaning methods and common test methods are taught in class, and are followed up by demonstrations on some of the frequently used equipment in electronics manufacturing facilities.

Who Should Attend:
Boot Camp benefits engineers, supervisors, technicians, quality assurance personnel, and many others. It is ideal for individuals that need to increase their knowledge of electronics manufacturing processes beyond a basic understanding. Furthermore, it enables students to acquire a true sense and understanding of the various processes, analytical tools, materials, and common test methods used in today’s electronics manufacturing industry.

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