Who Should Attend:
Engineers, Quality Managers, Technicians and Designers who want to gain an understanding of the fundamentals of material properties.

Benefits:

• Receive industry-based, hands-on training using state-of-the-art equipment in our demonstration factory.
• Identify and perform critical process steps when manufacturing assemblies with BGAs, micro BGAs, flip chips, wire bonding and chip scale packages.
• Identify and implement process control methods and practices with the manufacturing process.

Course Content:

• Basic overview of die fabrication
• Manufacturing with BGA & micro BGA
• Manufacturing with flip chip and chip scale packages
• Wire bonding techniques
• Inspection technologies
• Rework processes

Duration: 3 days

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