Overview:
The Objective of this course is to prepare the participant to make informed decisions when troubleshooting a manufacturing problem or collaborating with an analytical laboratory. The course is designed so that case studies will provide a forum for formulation, investigation and resolution.

Who Should Attend:
Materials and process engineers, managers interested in learning about failure analysis and the benefits, quality control and manufacturing engineering looking to determine root causes for failure issues in electronics manufacturing.

Attendees are encouraged to bring sample problems from their companies to use as examples for the case studies.

What will you learn?

• Communicating with the test lab and interpreting test results
• Analytical test methods and equipment
  • Capabilities
  • Limitations
  • Selection
• Reliability testing methods and equipment
  • Choosing the right test
  • Interpreting the results
• Common failure modes and root causes in electronics manufacturing
  

Three-Day Course Outline

• Analytical tools used to investigate failures
• Laboratory: Demonstration and hands-on use of analytical test equipment to evaluate actual failures:
  • Scanning Electron Microscopy
  • Energy Dispersive X-Ray
  • Fourier Transform Infrared Spectroscopy
  • Ion Chromatography
  • Differential Scanning Calorimetry
• Contamination: ionic and non-ionic
• Common failure modes and reliability
  • Mechanical
  • Electrical
  • Chemical
• · Laboratory: Micro-sectioning:
  • Plating thickness
  • Cracks
  • Voids and other failures
• How to logically approach complex problems
• Case Studies: Put your new skills to work. Attendees will be guided through case studies and then will solve a problem using what they have learned and the equipment available in the laboratory.

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