Overview:
Lead-Free Manufacturing is an initiative to eliminate lead from the electronic assembly process. Legislation as well as commercial market pressure from Asia and Europe, is forcing electronic manufacturers to consider new processing materials and techniques to meet this challenge. ACI, as the National Center of Excellence in Electronics Manufacturing, has developed a Lead Free training program that provides a combination of lecture and hands on factory experience, all housed in the same facility. The objective is to introduce participants to the technical challenges of developing and implementing Lead-Free Soldering in a production environment.

Benefits:
Participants will gain an understanding on the technical and legislative issues surrounding the implementation of Lead-Free solders in an Electronic Manufacturing Environment. The Student will acquire the technical insight necessary to select the proper choices of components, alloys, substrates, finishes, design, and environmental tests to achieve the level of reliability needed for Lead-Free Assemblies.

Who Should Attend:
Engineering managers, manufacturing engineers, design engineers, process engineers, quality engineers, and technicians who are responsible for developing, implementing, and working on manufacturing and rework production using Lead-Free materials.

Duration:
Two Days

Day 1 Lecture

• Introduction:
  • Introduction of ACI
  • Course Goals and Objectives
• State of the Market Concerns:
  • Market drivers and pressures
  • Legislative Initiatives
• Materials:
  • Lead-Free Solder Alloys
  • Board Finishes
  • Substrate Impact
  • How Lead-Free alloys affects components
  • How to select the Appropriate Lead-Free materials
• Manufacturing:
  • Understanding the Process variable requirements for Lead-Free
  • Designing Experiments for introduction of Lead Free in manufacturing.
  • SMT Reflow
  • Wave Soldering
  • Hand Soldering for rework and repair

Day 1 Lab Exercises

• DOE for SMT
  • Paste Screening of Lead-Free solder on various Surface Finishes
  • Component Placement
  • Reflow Experiment using various profiles
• Failure Analysis
  • Visual demonstration of metallurgical Lead-Free Interface using SEM
  • Demonstration of and examples of tin whisker formations
  • Demonstration of XRF as an analytical tool for Lead-Free components
• Rework and Repair of BGA assemblies
  • Demonstration of reworking Lead-Free BGA’s
  • Demonstrate X-Ray technology to detect BGA voids
  • Examples of various methods of rework
  • Real time visual of BGA reflow using Lead-Free solder balls

DAY 2 Lectures

• Reliability
  • Designing for Harsh Environments
  • The Mechanics of Failure
  • Thermal Cycling behavior of Lead free solder joints
  • Shock and Combined Environment behavior of Lead-Free
  • Modeling for Reliability
  • Mitigating the effects of Tin Whiskers
• Case Study-
  • Critical Findings
  • Failure Modes
  • Largest cause of Variability
  • Case Histories
• Tin Whiskers
  • Defining Tin whiskers
  • Conditions which promote Tin whiskers
  • Threat to reliability
  • Mitigating the effects
• Additional Considerations
  • Configuration management
  • Program Sustainment
  • Recommendations for Lead-Free Implementation

Day 2 Lab Exercises

• Hand Soldering exercises
• Hand Solder with various Lead-Free solders
• Understanding the IPC requirements for soldering
• Visual Inspection of solder joints

• Wave Soldering
• Wave Soldering of experimental boards with Lead-Free solder
• Demonstration of Ultra-sonic fluxing
• Demonstration of switching from Lead-Free to SnPb solder pots
• Demonstration of Lead-Free cleaning process

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