The American Competitiveness Institute (ACI) offers solder content analyses of solder pot samples. Samples from the solder pot mailed to ACI are analyzed spectrographically to determine concentrations for the following elements: arsenic, antimony, gold, iron, nickel, bismuth, aluminum, copper, silver, zinc, cadmium, indium, sulfur, and phosphorus in addition to tin and lead.

This solder analytical service is used to assure that the solder pot has not become contaminated. Periodic testing will insure the correct balance of tin/lead for tin/lead solders and the correct balance of metals in lead free solders. Maintaining proper metal levels in the solder bath will reduce production rejects.

Solder Contamination Issues:

The solder pot can become contaminated from component finishes leaching into the solder pot, from improper maintenance of the solder pot, or from poor operator training. For example, an operator may mistakenly scrape SnPb solder splash and / or put a SnPb solder bar into a lead-free solder pot. Two SnPb solder bars are enough to raise the lead content of an 800 pound lead-free solder pot over the 0.1% RoHS directive limit.

Impurities can affect melting point, solder tension, and wetting of the solder. Typical production defects possibly resulting from contaminated solder pots are icicling, bridging, pin-holing, webbing, and poor joint connections. To gain control of contamination in wave soldering, ACI recommends performing solder alloy analysis on a weekly basis to determine the rate at which the solder pot becomes contaminated. After 2 - 3 months of gathering data, the solder pot analysis may be reduced to once a month, depending on usage and the rate at which the solder pot is contaminated.

Increase Cost-Effectiveness and Profitability

Printed circuit board fabricators and assemblers are assured of high quality solder in the pot, constantly kept within specification ranges. Rates of rejection are reduced, thereby creating a more cost-effective and profitable manufacturing process. Many other solder manufacturers provide analytical services, but often charge the customer and take at least a week to provide analytical results; in the meantime, if the pot is contaminated, a week’s worth of production using contaminated solder may result.

Report: The “Solder Analysis Report” will compare measurements of the solder sample against industry standards IPC- J-STD-001. The report will be emailed to the customer three (3) business days after receipt of solder sample.

Cost: $150

Turn Time: 3 business days from receipt of materials and credit card purchase

Directions to take solder samples from a wave solder machine:

1. De-dross the machine by removing all dross which has accumulated on the top of the solder.
2. Using a ladle, thoroughly mix the pot metal for a minute or so to assure a homogenous mixture.
3. If there isn’t an existing solder mold, take a metal soft drink can, cut off the top so that 3/4" (approx.) is left, rinse out and dry the can.
4. Take a sample from the middle of the solder pot that is half way over, half way across, and half way down. Dip the ladle into the pot half way down and bring the ladle up. Do not take a sample from the top of the pot.
5. Pour the molten solder into the soda pop can and let cool. When banged on the floor, the solder in the can will release.

Identify the sample on the metal.

Download printer friendly PDF here
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Fill out and print the Solder Analysis Form here You will need to one complete form with each sample.