Bringing you the latest in research and development for the electronics manufacturing industry! http://www.empf.org/empfasis/index.html http://www.empf.org/empfasis/2007/Apr07/aff.html The U.S. Navy continuously seeks to deploy new technology in order to increase the mission capabilities of surface ships and submarines. Shipboard electronic systems must support multiple mission scenarios. This includes intelligence gathering, reconnaissance, mine hunting, interdiction of enemy ships, as well as the transport of personnel. Integration of emerging wireless technology, such as network-centric warfare and precision weaponry, will enable successful execution of these diverse service requirements.    http://www.empf.org/empfasis/2007/Apr07/dfm.html The application of DFMA principles in the manufacturing and assembly of printed wiring boards can manifest in the form of reduced cost and assembly time. It is important to start defining the critical process path during the design stages of the PWB, to avoid potential manufacturing problems encountered during the course of assembly. As an example cited in a previous issue of the Empfasis, the transitions from a Eutectic Tin/Lead to a Lead-Free soldering process is a prime example of the value of a DFMA undertaking. A customer contacted the EMPF helpline concerning a solder wetting problem that was observed during a lead-free, SMT wave soldering process with a gold plated PCB. http://www.empf.org/empfasis/2007/Apr07/help-407.html Electronics packaging and assembly typically involve the use of many vendors within a support chain. They provide wafer sort, wafer dice, die packaging, package sealing and final testing. This business is very competitive, and pricing based on high volumes provides an economy of scale that enables the purchase of dedicated process equipment for each step in the sequence. http://www.empf.org/empfasis/2007/Apr07/pack.html Precision Guided Munitions (PGMs) incorporate an active guidance system within the munition to meet increasingly stringent mission requirements for lethality and collateral damage. This active guidance system relies on highly miniaturized electronics modules. PGMs require the development of packaging techniques that allow electronics modules to withstand the high-g forces encountered during a gun launch. Honeywell’s deeply integrated Inertial Navigation System – Global Positioning System with Anti-Jam capability (INS-GPS/AJ) product has been baselined as the primary production of navigation, flight control, and mission computer for a major DoD weapons program. http://www.empf.org/empfasis/2007/Apr07/highg.html http://www.empf.org/empfasis/2007/Apr07/tech_tips-407.html X-ray systems provide the capability to look inside opaque/solid substances. Many of today’s microfocus x-ray system manufacturers offer either open-tube or sealed-tube technologies. A sealed-tube x-ray source is generally sealed in a glass tube containing a vacuum (analogous to a light bulb). An open-tube source is generally all-metal and maintains a vacuum with a two-stage pumping process. http://www.empf.org/empfasis/2007/Apr07/manf_corner-407.html The term ‘popcorning’, within the electronic manufacturing industry, is often defined as a catastrophic failure created by the presence of moisture within a component. Common ‘popcorning’ will occur when a small amount of moisture is heated during the wave solder/reflow process and turns to steam. As electronic manufacturing service providers transition to lead-free processes which require higher reflow temperatures, the potential for ‘popcorning’ increases substantially. Less common and more difficult to trace is ‘popcorning’ failures during power-up of the circuit board, as the failures may be intermittent. When ‘popcorning’ occurs, regardless of the contributing conditions, the component damage is internal and may not be recognized by visual inspection procedures. http://www.empf.org/html/empfasis/emlcupcoming.pdf Train at ACI's learning center in Philadelphia for electronics manufacturing skills and certifications!