The EMPF is actively engaged in the Joint Defense Manufacturers Technology Panel (JDMTP), through the RF Module Technical Working Group (TWG), to improve on RF Module technologies. This will include generation of a roadmap by the TWG to help guide selection of RF Module technologies gaps in need of development. As part of this support, EMPF representatives participated along with key government and industry contributors in a week-long RF Module Manufacturing symposium in the summer of 2005 at Redstone Arsenal and a RF Module roadmapping effort in Knoxville TN in spring of 2006.
Planning for both of these events was undertaken with the help of much government and industry support. The TWG was instrumental in both of these activities. RF Modules are multiple component electronic assemblies that perform Radio Frequency (RF) functions. Examples include the cellular telephone, TV tuner, electronic automobile keyless entry device, as well as critical military RF Modules such as the Transmit/ Receive module of a Phased Array radar (Figure 4-1) or the electronic fuze of a munition. Although many of these modules are the familiar “solid state” devices, vacuum devices in the form of high RF power Travelling Wave Tubes(TWTs) are also addressed by the TWG and various Mantech projects.
The RF Module TWG is chartered by the JDMTP to “identify and integrate requirements, conduct joint program planning, and develop a joint strategy for Manufacturing Technology (Man- Tech) efforts conducted by the Army, Navy, Air Force, Missile Defense Agency (MDA) and Defense Logistics Agency” and to “facilitate knowledge sharing, coordination, and formulation of solutions to ManTech issues related to RF Modules at the engineer working level.”
The scope of the RF Module TWG includes RF Module applications in systems such as radar, electronic warfare, and communications. Platforms within the scope of the TWG range from airborne, space based, surface radar, ground based, under sea, and weapon systems.
EMPF contributed in the Electronic Packaging/Materials and Manufacturing sessions at both the 2005 and 2006 conferences. Areas of development that were suggested by EMPF include:
- Near Hermetic Packaging
This is a topic of great interest that will undoubtedly occupy a prominent place in RF Module development efforts, and was the subject of a recently completed EMPF/ Raytheon ManTech project that evaluated near hermetic hydrophobic coatings applied in wafer form to the chip components of the RF Module. Such coatings can render the individual chips making up the RF assembly inherently “near hermetic” and thus eliminate the need for costly, heavy, glassto- metal sealed traditional hermetic enclosure used today. (Figure 4-2)
- Wide Band Gap Components
These integrated circuit materials, including Silicon Carbide (SiC) and Gallium Nitride (GaN), will allow higher RF power devices to be made. However, the packaging materials that will withstand the higher operating temperatures for these devices do not yet exist. The EMPF is already engaged in assessment of new packaging technologies for high temperature electronic assemblies, both in the RF and the high power electronic technologies needed for DDG-1000 applications.
- Liquid Crystal Polymer Materials
This is a class of polymer materials that are becoming available as conventional laminates from the existing printed cicuit laminate suppliers. They have a wide range of attractive RF properties, such as low RF loss and low water absorption. They are potentially useful in the near-hermetic applications and could, combined with the near-hermetic coated chip, constitute an important part of the future affordable, lightweight, reliable RF Module. The EMPF is not currently engaged in the Liquid Crystal material validation.
- Silicon Germanium System-On-A-Chip (SiGe SOC)
This is the next step in RF Module integration presently being pursued on a ManTech program by the EMPF and one of its Industrial Advisory Board (IAB) members. Novel new interconnection of these new unique integrated SiGe SOC RF components will be incorporated, with the first application scheduled for DDG-1000. This is a potential gap-filler, as it represents a level of electronic integration in RF Modules that could lower the parts count for a given assembly thus lowering cost and increasing reliability. (Figure 4-3)
- Thermal Management
This is another roadmap area that arises in any discussion of RF Modules. There are several ongoing EMPF/ManTech programs on thermal management, any of which can be applied to RF modules. These include the EMPF thrusts on Integrated Power Systems for Integrated Fight Through Power. The EMPF has been specifically involved in RF Packaging thermal management comparisons from RF Packaging programs conducted in recent years.
The EMPF continues to support the RF Module TWG of the JDMTP in their efforts in RF Roadmapping. Current and proposed Navy ManTech projects will continue to help identify potential critical issues in RF Module packaging and manufacturing issues.
|
