A publication of the National Electronics Manufacturing Center of Excellence
December 2006

ISO 9001-2008
American Competitiveness
One International Plaza
Suite 600
Philadelphia, PA 19113
(610) 362-1200
FAX: (610) 362-1290
HELPLINE: (610) 362-1320
WEBSITE: www.empf.org

The EMPF is a U.S. Navy-sponsored National
Electronics Manufacturing Center of Excellence focused on the development, application, and transfer of new electronics manufacturing technology by partnering with industry, academia, and government centers and laboratories in the U.S

Technical Editor

Michael D. Frederickson,
EMPF Director

Please direct comments
and/or questions to the Editor at

In This Issue

Silicon-Germanium Flip Chip for RF Applications


Migration of Wirebonding to Flip-Chip


Ask the EMPF Helpline!


RF Modules Technology Roadmap


IPC 610 Electronic Assembly Acceptability


Tech Tips...S Parameter Testing for RF Applications


Manufacturer’s Corner: Seica Functional Test Equipment


Upcoming Training Center Courses

Industrial Advisory Board
Gerald R. Aschoff, The Boeing Company
Dennis M. Kox, Raytheon
Gregory X. Krieger, BAE Systems
Edward A. Morris, Lockheed Martin
Jack R. Harris, Rockwell Collins
Gary Kirchner, Honeywell
Andrew Paradise, Northrop Grumman
Art Smedberg, ITT Industries, Avionics Division

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Specifications have been used in the manufacturing process since the introduction of the idea of “part interchangeability” and the demise of the practice of having the master craftsman complete the entire manufacturing process by himself. This was the “real beginning” of the Industrial Revolution as we know it today. During the period of the 1990’s and the growth of the “Communications and Information Age”, commercial specifications came into common use in electronics manufacturing for both civilian and military products, thus the publication of IPC-A-610, “Acceptability of Electronic Assemblies”.

The IPC-A-610D Revision was published in February 2005 and reflects changes primarily in the form of newly introduced components and processes. It was also re-organized to more readily reflect both the importance of the section and the flow of the process.

Section One: contains information specific to the document’s make-up: scope, purpose, design references, terms & definitions and general applications.

Section Two: contains a listing of applicable IPC documents.

Section Three: contains references and recommendations to manufacturing practices such the application of ESD control and handling practices in order to prevent contamination and physical damage during the manufacturing process.

Section Four: contains information for the proper application of hardware, torque and wiring stress.

Section Five: addresses soldering and the application of solder and is specific about anomalies or defects within the soldered connections, including the introduction of those particular to the use of lead free solder alloys and the acceptance of some types of abnormal conditions.

Section Six: illustrates terminal connections addressing the installation of various terminals, the attachment of wiring, the application of solder and the mechanics of dress and physical protection.

Section Seven: presents the requirements for through-hole technology and addresses component mounting, the use of heatsinks and the securing of components. The section also details the assembly and application of solder to both supported and unsupported holes.

Section Eight: details the requirements for placement and soldered connections of fifteen component configurations including leadless components, (those having metallized contacts), and various styles of leaded components. There are two new component types and additional criteria for BGA attachment and acceptance guidelines for chip component “billboarding”.

Section Nine: addresses component damage as well as assembly processing damage to connectors, printed circuit boards and assemblies.

Section Ten: lists the requirements and describes the defect condition for gold plated edge contacts, laminate defects, marking, cleanliness and coatings.

Section Eleven: details the requirements for “discrete wiring” including those particular to “solderless wire wrap” and “jumper wires”, (additive wiring).

Section Twelve: addresses the requirements for wiring and the application of solder to “high voltage” terminations. (Certain high frequency applications might demand similar configurations).

Certification to one or more of the IPC specifications has filled the training/certification gap within the industry since the cancellation of the MIL-STD-2000 in 1995. The EMPF IPC-A-610D Revision Training/Certification program, released in late summer of 2005, contained a different approach as compared to the previous program: (1) the programs for certification and re-certification are now the same (2) the program for the Certified IPC Specialist (CIS) is now presented in modular form with modules 1 & 2 being prerequisite for all optional modules as well as modules 4 & 8 being a requirement for certification to either module 5, 6 or 7.

On-site classes for CIS can be scheduled in Philadelphia or custom classes, for both Certified IPC Trainers (CIT) and Certified IPC Specialists (CIS), can be scheduled for presentation at customer facilities. For additional information on registration and scheduling for IPC-A-610D Training/Certification, please contact the Training Center Registrar. Email: registrar@aciusa.org, phone: 610-362-1320 or sign up on the web site at www.aciusa.org.

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