EMPFasis - A publication of the National Electronics Manufacturing Center of Excellence
Electronics Manufacturing Productivity Facility
A publication of the National Electronics Manufacturing Center of Excellence
April 2005

Empfasis is a publication of the American Competitiveness Institute and the EMPF. The EMPF is the U.S. Navy’s National Center of Excellence dedicated to advancing the state-of-the-art in electronics and increasing domestic productivity in electronics manufacturing. Our efforts in the field of electronics manufacturing, analytical services, and our work with government and industry, yield the knowledge that we present to you here.
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January 2006 empfasis
  • Re-engineering and Re-packaging of the AN/TRN-30 Beacon
    The EMPF is assisting the U.S. Army to overcome the aging and potential obsolescence of the AN/TRN-30 Non-Directional Radio Beacon. The AN/TRN-30 benefits all U.S. Armed Forces by supplying a Non-Directional Radio Beacon for aircraft to navigate. The primary goal of the project is to extend its useful life for another 15 years. A secondary objective is to enhance the reliability and serviceability of the unit. By using current, more reliable technology and commercial-off-the-shelf (COTS) parts, the EMPF is able to reduce the overall cost and weight of the AN/TRN-30 and ensure that the customer is no longer tied to a sole supplier.[Full Article]

  • Boot Camp
    With the rapid changes in technology that engineers and technicians face, keeping up with the latest process methods, packaging changes, business goals, time to market, and scheduling, can become a daunting task. Manufacturing personnel, who have an understanding of the manufacturing process as a whole, can help to make a company more successful. This expertise is typically built over time and exposure to many different methodologies and disciplines. Very few colleges and universities provide actual "hands on" electronics manufacturing demonstrations and exercises as part of their curriculum.[Full Article]

  • Printed Wiring Board (PWB) Repair Techniques: 7721
    This month’s Demo/Lab reviews the basic steps in performing a successful printed wiring board (PWB) repair. A through-hole, ½-watt-resistor in a circuit of a power supply module severely overheated and eventually burned out. During the component removal process, the land pattern separated from the board surface due to breakdown of the annular ring’s adhesive bond. The land connection to the plated hole was also destroyed.[Full Article]

  • Ask the EMPF Helpline!
    The EMPF Helpline received a call requesting analysis of a surface mount fast rectifier diode component soldered to a printed circuit board (PCB) that failed. To resolve the customer’s inquiry, the EMPF performed failureanalysis to identify evidence of the failure site, determine the failure mode and complete a report of the findings.
    The customer was asked to provide key pieces of information prior to failure analysis to assist with selection of analytical techniques to save time and to prevent errors. This included the component’s data sheet, electrical test information upon failure (if available), external physical conditions at the time of failure (temperature, etc.), whether removal of the device from the PCB is required, and whether additional good components are available for comparison. [Full Article]

  • Tech Tips... IPC-J-STD-001 Vendor Survey
    The term “survey” as applied to the manufacturing process implies an audit, and when a standard is the topic of the audit, the audit takes the form of a compliance audit. The compliance audit in this instance is the comparison of the requirements of IPC-J-STD-001, The Requirements for Soldered Electrical and Electronic Assemblies to the manufacturing process that is in place. In order to accomplish this task, audit procedures are used to compare the manufacturing process to the requirements of the standard.[Full Article]

  • Wide Band Gap Devices in Power Systems
    Silicon carbide (SiC) is a wide band gap semiconductor material which is ideal for the production of power switching devices. It has excellent power handling and high-temperature operation capabilities. The defense industry has long been interested in the use of SiC technology for its high power applications, such as electric ships, high power weapon systems, hybrid electric vehicles, and More Electric Aircrafts (MEAs). Power electronics converter systems with SiC-based power semiconductor switching devices are lighter, more compact, and more efficient, making them ideal for high-voltage power electronic applications. [Full Article]

  • Manufacturer's Corner - McDry Air Drying Cabinet
    At the EMPF, all military and commercially-built printed circuit board (PCB) assemblies are treated with special care. Moisture build-up in components can have a detrimental effect when reflow temperatures are applied. The proper storage of components and PCBs is an essential function of any assembly house. The EMPF utilizes a McDry Air Drying Cabinet by Seika Machinery, Inc. [Full Article]

  • Upcoming EMLC Courses
    Check out up coming courses available from the EMPF.