The increasing demand to properly train rework and repair operators is felt by many in today’s electronic manufacturing industry. Manufacturers cannot afford to risk scrapping expensive assemblies. As a result, the need for qualified operators to perform the most tedious rework and repair operations is greater than ever.

In IPC7711/7721, operators will receive hands-on training in the correct methods for reworking, restoring, and modifying electronic boards and assemblies. Candidates who successfully complete the course will receive a certification that is valid for two years. Selected candidates should have above- average soldering skills and possess sound reasoning capabilities.

If you wish, you may customize your training to select the modules that will best serve your company’s and your operators’ needs. (Note, however, that Module 1 is a prerequisite for all of the other modules that comprise IPC-7711 and IPC-7721.) For example, a company that only uses through-hole technology, and only needs their workers to be proficient in rework of through-hole components, need only select Modules 1 and 3 of IPC-7711. Similarly, companies manufacturing surface mount devices need only select the modules that pertain to their manufacturing needs.

IPC-7711: Duration 2-5 Days
IPC-7711 focuses on rework of electronic assemblies. Students will learn and practice the techniques necessary to properly remove through-hole and/or surface mount components utilizing the latest tools, materials, and technology. All component acceptability criteria based on IPC-A-610C are reviewed for each module. Upon successful completion, students will obtain IPC Operator Certification in the areas where proficiency has been demonstrated.

Module 1 is a prerequisite for all other modules and must be completed satisfactorily prior to training in any other modules. In Module 1, students will be taught the general requirements and basic terminology of IPC-7711/21. This module will also teach students basic considerations used in analyzing rework and repair, tool and material considerations, proper handling techniques, and basic cleaning procedures. The duration is one day.

Module 2 teaches students the proper procedure for performing wire splicing. Students will learn to determine the feasibility of repair, the four types of splices used, and tinning and soldering considerations. The approximate duration is five hours.

Module 3 concentrates on through-hole technology. In this module, students will learn the skills for removing, land preparation, and reinstalling axial-leaded, radial-leaded, and multi-leaded components on PWAs utilizing the continuous vacuum and wicking method. The duration for Module 3 is one day.

In Module 4, students develop the skills necessary to remove chip and MELF components, clean and prepare pads, and reinstall components. The use of various tips and techniques used in industry is taught. The duration for Module 4 is approximately six hours.

Removing SOIC and SOT components, cleaning and preparing termination areas, and replacing components are covered in Module 5. The duration for Module 5 is about six hours.

Module 6 focuses on the removal, pad preparation, and reinstallation of fine pitched (20-30 mil), multi-leaded, J-leaded, and gull/L wing devices. Students who successfully complete this module will be capable of demonstrating their skill at the advanced level. The approximate duration of this module is one day.

IPC-7721: Duration 2-3 Days
IPC-7721 concentrates on the repair of electronic assemblies. Students will learn the latest techniques used to repair circuits and laminates, including conformal coating/solder resist removal and reapplication. Upon successful completion, students will obtain IPC-7721 Operator Certification in the areas they have demonstrated proficiency.

In Module 7 of IPC-7721, students will learn PWB circuit repair. This includes learning the applicable procedures, and demonstrating the skills, used to fix a lifted pad/land repair, install an eyelet into a damaged plated through hole, repair a damaged trace, and install a surface jumper wire. The duration is one day.

Module 8 focuses on laminate rework and repair. Students will learn the procedures, and develop and demonstrate the skills, for repairing damaged laminate materials using the newest materials and tools available to the electronic manufacturing industry. The duration for Module 8 is six hours.

The procedures and processes for the removal and replacement of conformal coating is covered in Module 9. Students will learn about various conformal coating removal techniques, including mechanical, thermal, and solvent methods. The duration for this module is five hours.

Please contact the registrar at (610) 362-1320, or via email at registrar@empf.org, for more information on multiple student discounts and on-site training.