A publication of the National Electronics Manufacturing Center of Excellence
June 2007
ACI EMPF

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The EMPF is a U.S. Navy-sponsored National
Electronics Manufacturing Center of Excellence focused on the development, application, and transfer of new electronics manufacturing technology by partnering with industry, academia, and government centers and laboratories in the U.S

Technical Editor

Michael D. Frederickson,
EMPF Director

Please direct comments
and/or questions to the Editor at
empfasis-editor@aciusa.org
610-362-1336


In This Issue

Flip Chip Packaging for US Navy Electronic Systems

 

Wedge Bonding

 

Ask the EMPF Helpline!

 

Chip Scale Packaging

 

Integrated Passive Components

 

Tech Tips...Control of ESD Events in Flip-Chip, COB and CSP Manufacturing and Handling

 

Manufacturer’s Corner: Samsung SMT Assembly System

 

Upcoming Training Center Courses

IAB
Industrial Advisory Board
Gerald R. Aschoff, The Boeing Company
Dennis M. Kox, Raytheon
Gregory X. Krieger, BAE Systems
Edward A. Morris, Lockheed Martin
Jack R. Harris, Rockwell Collins
Gary Kirchner, Honeywell
Andrew Paradise, Northrop Grumman
Art Smedberg, ITT Industries, Avionics Division


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Dynatech Technology has recently placed the Samsung SM321 pick and place machine in the EMPF demonstration factory.  This machine has the capabilities to place up to 19,000 components per hour and has a size handling range from the smallest chip (10 x 5 mils) through the larger square components such as BGAs (55 mm2). The SM321 uses a frame and gantry system, allowing a twin-servo motor design to provide the stability necessary to achieve extremely accurate placements at increased speeds. Automatic mapping enables the unit to respond quickly to changes in the working environment, allowing the user to gain more production and maintain high levels of quality.

The SM321 augments the twin servo capability with Samsung’s very accurate alignment and centering system. This system aligns components in transit from the feeder to the board, eliminating the need for an intermediate stop at a fixed vision system. At the same time, the system identifies the leads of the component to ensure accurate placement. This reduces the risk of missing, bent or damaged leads, which go undetected when aligning solely on the body of the device.

The slim format tape feeder system is designed to handle industry standard tape sizes and holds a maximum of 120 8mm feeders. The tape feeder monitors the inventory on its supply reel and notifies the operator before replenishment is needed. A one-touch clamping feature allows users to replace tape feeders during operations to maximize productivity, while the system’s endless-discharge method for non-stop operation provides efficiency, reliability and repeatability of component pickups. Operators can choose to splice a new reel of components to the existing feeder without interrupting production.

The SM321 operates under Windows   XP  which requires little or no training and allows machine operators to concentrate on the assembly process without worrying about how to use the software.  Built-in Optimizer software ensures high-efficiency machine operation by automatically optimizing the placement sequence. The optional EasyOLP (off line programming) line balancing software increases overall line productivity by balancing feeders across multiple assembly systems while optimizing placement routines.

In addition to the ease of operation, the software can provide the operator with the following information which can be used for error detection as well as production traceability:

  • Real time inventory control: The pick and place machine  can keep track of component inventory and provide up to the minute counts at any time. The built-in software can estimate part usage for future builds and can predict shortages prior to the beginning of a build. The data can be shared with factory-wide MRP systems to improve parts flow from the stock room to the production line.

  • Capture of production data: The software constantly monitors utilization and error data during production, providing board run times and vision defect data for every product, for any period of time. Managers can compare statistics for different shifts, or analyze build performance over time to see trends. Performance data can be collected for each nozzle, head, and feeder, allowing early detection of maintenance needs that can be proactively scheduled to keep the equipment operating at peak efficiency.

  • Component level traceability:   Bar code readers at the input of each machine can read serial number information from the PCB at the beginning of the build.  The inventory management system can track components from the reel to specific boards and create a record file for each board. Record files contain the PCB serial number and component lot information. If a faulty component is discovered, the system can locate the suspect reel, restrict its future use, and give a list of the PCB serial numbers already built with the part.

For additional information or to schedule a demonstration of the Samsung equipment located at the EMPF, contact Ken Friedman, 610-362-1200 x 279 or via email at kfriedman@aciusa.org.

 

 

 


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