Today’s manufacturing processes continue to improve manufacturing yields. This is due in part to manufacturing personnel being well trained and equipped with the best equipment and tools available on the market.  However, due to constant evolving manufacturing technologies and the inevitable PCB defects caused by varying factors, there will always be a need for qualified and trained personnel to properly disposition assemblies that require rework or repair.  The EMPF offers a comprehensive certification course that is part of the overall IPC certification program designed to meet these training needs.

The IPC 7711/7721 courses have been designed to meet the needs of manufacturing personnel with PCB rework, repair, or modification responsibilities.  Participants will receive hands-on training in the correct methods for reworking, restoring, and modifying electronic boards and assemblies. Those who successfully complete the course will receive a certification that is valid for two years. Pre-requisites for the course include above-average soldering skills and analytical capabilities.

Students will be taught the general requirements and basic terminology of IPC-7711/7721. Additionally, students will also learn the basic considerations used in analyzing rework and repair, tool and material considerations, proper handling
techniques, and basic cleaning procedures. Additional topics include:

Wire Splicing:  Students will learn to determine the feasibility of repair, the four types of splices used, and tinning and soldering considerations.

Through-Hole Technology: In this module, students will learn the skills for removing, land preparation, and reinstalling
axial-leaded, radial-leaded, and multi-leaded components on PWAs utilizing the continuous vacuum and wicking method.

Chip and MELF Components:  Students will learn how to properly remove this component family and how to clean and prepare pads, and reinstall components.

SOIC and SOT Components:  Students are instructed in the industry accepted procedures for removal, cleaning and prepping termination areas, and replacing components.

Quad Flat Paks (J-Leads & Gull Wing):  Students focus on the removal, pad preparation, and reinstallation of fine pitched (20-30 mil), multi-leaded, J-leaded, and gull/L wing devices.

Laminate Rework and Repair:  Students will learn the procedures, and develop and demonstrate the skills for repairing damaged laminate materials using the newest materials and tools available to the electronic manufacturing industry.

Conformal Coatings:  Students focus on the procedures and processes for the removal and replacement of conformal coating.  Students will learn about various conformal coating removal techniques, including mechanical, thermal, and solvent methods.

The modularized curriculum allows you to customize your training to select the modules that will best serve your
specific needs.  For example, a customized course would be best for a company that uses only through-hole technology and only needs their workers to be proficient in rework of through-hole components.  Similarly, companies manufacturing surface mount devices need only select the modules that pertain to their specific manufacturing needs.

Courses are available in our classroom or on-site at your facility. For additional information, class schedules, or to register for a course, please contact the Registrar at (610) 362-1295 or via email at registrar@empf.org.