A publication of the National Electronics Manufacturing Center of Excellence
January 2008
ACI EMPF

ISO 9001-2000
Certified
American Competitiveness
Institute
One International Plaza
Suite 600
Philadelphia, PA 19113
(610) 362-1200
FAX: (610) 362-1290
HELPLINE: (610) 362-1320
WEBSITE: www.empf.org
www.aciusa.org

The EMPF is a U.S. Navy-sponsored National
Electronics Manufacturing Center of Excellence focused on the development, application, and transfer of new electronics manufacturing technology by partnering with industry, academia, and government centers and laboratories in the U.S

Michael D. Frederickson
mfrederickson@aciusa.org
EMPF Director

Barry Thaler, PhD., bthaler@aciusa.org
EMPF Technical Editor;
Technical Editor, Empfasis


Carmine Meola, cmeola@aciusa.org
Factory and Training Services


In This Issue

Flip Chip Assembly with Stud Bumping

 

Ask the EMPF Helpline!

 

Wire and Die Bonding

 

Customized Training: Failure Analysis

 

Manufacturer’s Corner: Hesse & Knipps WireBonder

 

Tech Tips..Repairing PCB’s built with underfill

 

Upcoming Training Center Courses

 

IAB
Industrial Advisory Board
Gerald R. Aschoff, The Boeing Company
Dennis M. Kox, Raytheon
Gregory X. Krieger, BAE Systems
Edward A. Morris, Lockheed Martin
Jack R. Harris, Rockwell Collins
Gary Kirchner, Honeywell
Andrew Paradise, Northrop Grumman
Art Smedberg, ITT Industries, Avionics Division


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title

 

A customer called the EMPF Helpline with a question regarding the screening of an assembled circuit board for lead-free compliance...

The EMPF Helpline fields a number of questions regarding lead-free components and RoHS (Restriction of Hazardous Substances) compliance concerns. Recently, an EMPF customer wanted to conduct screening of a particular assembly according to the lead-free RoHS directive. This directive specifies that, in order to be compliant, each component within an assembly must meet the specified RoHS maximum concentration limit of 1000 ppm, by weight.

The EMPF staff has the capability to quickly perform lead-free screening, using the X-Ray Fluorescence (XRF) technique. XRF is a primary non-destructive test method to ensure lead-free RoHS compliance. XRF is also advantageous in that it does not require sample preparation, and only minimal operator training. Furthermore, RoHS compliance by component suppliers is neither universal, nor standardized; thus a part number or descriptor may not specify whether or not the part meets the RoHS directive.  Use of XRF can help alleviate such an uncertainty. Figure
2-1 shows a sample spectrum of a component using the Fischer Scope XRF. Note that for the sample shown, the component contains an amount of lead which exceeds the RoHS maximum concentration limit.

The customer’s assembly contained many components mounted to a circuit board. The EMPF utilized the XRF technique to determine that one of the components mounted to the board did in fact contain a SnPb finish. According to the RoHS directive, this assembly was deemed non-compliant with RoHS. The EMPF staff was then able to recommend a lead-free replacement for the specified component, allowing the assembly to meet the lead-free RoHS directive specifications.

The EMPF also offers a comprehensive lead-free training seminar. This course provides an extensive overview of RoHS legislation, and discusses materials, manufacturing processes, and reliability differences associated with lead-free soldering. Understanding the most recent RoHS legislation is essential in remaining competitive in the High-Tech industry.  Likewise, misunderstanding or non-compliance of the RoHS directive can potentially subject a company to penalties and potential legal consequences. Many considerations must be taken into account when choosing the material and manufacturing process in order for an assembly to be considered lead-free RoHS compliant. The EMPF training course offers the necessary training for the student to become fully capable of lead-free implementation in the design and manufacturing environments.



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