X- ray inspection is recognized as a vital step in the test regime of the PCB and semiconductor industries. Fault finding on current package designs is extremely demanding so X-ray systems must provide, as a minimum, high resolution, high magnification and high contrast X-ray images, at the largest and different angular views. Fast inspection throughput and user-friendliness are also essential when specifying an X-ray system. Dage’s XD7500VR (Figure 5-1) X-ray system exceeds these requirements with its Dage “Image Wizard” software, 0.95 micron (950 nm) feature recognition, automated inspection, video capture, user-friendly operating system, and much more. By providing highly improved digital real-time x-ray images, enhanced resolution, extensive grayscale definition and oblique angle views of up to 70°, all as standard machine features, new levels for the best investigation of joint quality can be assured.

The Dage XD7500VR provides very strong and clear image quality for PCB and device X-ray with a choice of using either an open or a sealed transmissive feature.

The XD7500VR comes standard with the Dage VR160 x-ray tube offering sub-micron feature recognition to 950 nanometers, real-time digital inspection achieved at 1.3 mega pixel viewed on a 20” flat panel LCD display and system magnification up to 5,650X. As an available option, the XD7500VR is available with the Dage XiDAT (x-ray integrated digital acquisition technology) 2.0 image acquisition system providing real-time digital inspection at 2.0 mega pixel viewed on a 24” flat panel LCD display with up to 7,400X system magnification. As with all Dage X-ray inspection systems, the XD7500VR is equipped with easy to use ImageWizard software providing world class inspection quality.

With the XD7500VR, Dage is a leader in the industry with their superior X- ray quality to inspect the continually shrinking and very demanding environments affecting PCB product quality. These advancements were achieved through the improved feature recognition of the Dage VR open X -ray tube, with its minimum feature recognition below 1 micron and providing oblique angle views of up to 70 degrees so that joint interfaces can be investigated more easily. However, using an open X-ray tube system in production has been questioned by some becausesensitive internal tube components must be exposed to the local environment during the necessary and regular filament changes. To address that concern, Dage offers the XD7500NT system. This system comes with the sealed transmissive NT950 tube technology. This feature removes this concern and allows zero down time as apposed to the warm up periods needed when replacing filaments.

The machine and tube performance of the Dage X-ray systems together with the ease of use and sophistication of the Dage Image Wizard software takes X-Ray inspection to new levels of image quality and clarity for BGA, flip chip, QFN and chip scale package inspection on PCBs.

X-ray inspection is a vital and integral part of any manufacturing facility and the Dage XD7500VR is an outstanding choice for this very important procedure.

For more information related to this article, or to schedule a demonstration of Dage XD7500VR located at the EMPF, contact Ken Friedman,
610-362-1200 x 279 or via email at kfriedman@aciusa.org.