A publication of the National Electronics Manufacturing Center of Excellence
March 2008
ACI EMPF

ISO 9001-2000
Certified
American Competitiveness
Institute
One International Plaza
Suite 600
Philadelphia, PA 19113
(610) 362-1200
FAX: (610) 362-1290
HELPLINE: (610) 362-1320
WEBSITE: www.empf.org
www.aciusa.org

The EMPF is a U.S. Navy-sponsored National
Electronics Manufacturing Center of Excellence focused on the development, application, and transfer of new electronics manufacturing technology by partnering with industry, academia, and government centers and laboratories in the U.S

Michael D. Frederickson
EMPF Director

Barry Thaler, PhD., bthaler@aciusa.org
EMPF Technical Editor



In This Issue

Development of a Digital Receiver Exciter RF Architecture

 

Ask the EMPF Helpline!

 

Head on Pillow Defects on BGA Assemblies

 

DoD Workforce Development

 

Manufacturer’s Corner: PACE

 

Tech Tips: Conformal Coating
Inspection

 

EMTC Course Schedule

 

EMTC Online Registration

IAB
Industrial Advisory Board
Gerald R. Aschoff, The Boeing Company
Dennis M. Kox, Raytheon
Gregory X. Krieger, BAE Systems
Edward A. Morris, Lockheed Martin
Jack R. Harris, Rockwell Collins
Gary Kirchner, Honeywell
Andrew Paradise, Northrop Grumman
Art Smedberg, ITT Industries, Avionics Division


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The EMPF is frequently asked for guidance in selecting the appropriate electronic manufacturing skills that are suitable for a customer’s particular application. An employee may request course guidance for personal skill growth, subsequently adding value to their company. A manager may need to train a number of manufacturing associates to meet their quality needs. A training director may be required to start a program which will meet the skill needs across the various departments of the company. The EMPF, in cooperation with many of its partners, has initiated training programs that include many of the elements of our engineering courses (Boot Camp, Design For Manufacturability, and Lead Free), as well as the standardized IPC certifications (IPC 610, J-STD-001, 7711/7721, IPC 620, and IPC 600). These partnerships are created with our customer’s trust to act as an advocate in validating their path forward for a successful training program.

The EMPF has always been in the forefront of instructing IPC
and engineering courses to the electronics industry for both the DOD and industry related ventures. Our latest offering includes three levels of training classes that were developed for government personnel who manufacture electronics, at various skill levels, and across various government positions.

Level I Intern/Pre Journeyman

This level is focused on a one week experience for the intern and pre journeyman engineer/technologist, GS-12 or below. The session was conducted at both the EMPF facility and at the customer site. The students start with design concepts and end with a good hands-on experience on the manufacturing of electronic assemblies. Some of the topics that are covered include:

  • Manufacturing and documentation review
  • Computer-aided Design files
  • Review of various design techniques
  • Reviewing Manufacturing bill of materials
  • Review Standards and Specifications
  • Validation of revision compliance
  • Understanding product requirements
  • Fundamentals of Surface Mount Technology (SMT) and Mixed technology Manufacturing

Additionally, the student builds his own assembly using the manufacturing methods and equipment employed in SMT, and plated through hole processes.

Level II Journeyman Course

Level II is a comprehensive program designed to educate participants on the many different processes and materials used in through hole and surface mount technologies. The course is designed to give an overview of the critical skills, requirements, and technical attributes needed for the working level staff in the Department of Defense, while acquiring the necessary training for an electronic manufacturing operation. The student also gains an understanding of the skill sets needed for career advancement to a Level III certification pertinent to the defense acquisition process. It is an intensive program that provides students with the opportunity to learn and understand the processes, tools, and materials used to properly manufacture electronic assemblies. It includes topics such as Design For Manufacturing, Lead Free, Design of Experimentation, and Statistical Process Controls for electronics, Chip Scale and Ball Grid Array technology, and other leading-edge electronic technologies that are presently used.

Level III Manager’s Course

A one day course developed to provide training for senior level personnel (GS14 to SES/GO), this course provides an overview which will identify the key functional and physical characteristics critical to the infrastructure of an electronic assembly and manufacturing plant. The course covers the three main sections dealing with material management, new technologies, and critical legislation. The course is designed to help the individual clarify the significance of implementing controls in various areas such as configuration management, sustainment of product, control change, documentation, prohibitive material process, and the effects of Commercial Off The Shelf (COTS) products on the material infrastructure.

This program was a response to a need that helped our partners maintain the necessary skilled personnel to effectively produce quality products. The EMPF has worked diligently to invest its expertise for such projects, and will continue into the future.

 


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