As with any production line, performance is only as good as the sum of its parts. The EMPF has not just one machine from Manncorp, but an entire Manncorp line showing the full capability of a lower cost, but not lower performance SMT system. The line includes the Manncorp 1400 Automatic Stencil Printer, the MC-391V2V Dual-Head Pick and Place, a 3-Stage Conveyor, and the CR5000 Lead-Free Reflow Oven. For example, the stencil printer provides precision printing for fine pitch surface mount devices (SMDs) to 12mils, identical to the fine pitch specification of the pick and place that it interfaces. If this were not the case, the printer would not be capable of printing the pads for the complete range of components that the MC-391 is capable of mounting.

Automatic Stencil Printer with Programmable Controls
The stencil printer features a dual squeegee and dual stroke control system for the most efficient use of solder paste. All control parameters, print speed, stroke length, and squeegee pressure are fully programmable. In addition, the MC1400 can automatically align the stencil to the board with a high degree of accuracy. The printer is equipped with a flexible mounting table for quick setup and changeover of single and double-sided printed circuit boards (PCBs). Because all movements, PCB position, mounting table, and the squeegee head rely on precision linear guides, high levels of accuracy and repeatability are achieved.

Dual-Head Pick and Place with 160 Feeder Capacity
Designed for medium- to high-volume assemblers, the dual-head pick and place provides high-precision placement of the full range of SMDs, from the smallest 0201 devices through chip scaled packages (CSPs), ball grid arrays (BGAs), flip-chips, and ultra-fine-pitch (0.3mm lead pitch) quad flat packs (QFPs). Even odd-form components can be placed at rates of approximately 5500 components per hour (cph). The MC-391 features Cognex vision processing and head-mounted vision cameras for non-contact, “vision-on-the-fly” alignment of all components up to 16mm x 14mm. A bottom vision camera is used for large components up to 38mm x 38mm and devices with alignment features on their bottom side. Unlike systems that utilize laser centering methods, the Cognex vision processor, combined with a fine-resolution, linear-encoded X-Y drive mechanism, allow the MC-391 to deliver a remarkable ±.05mm placement accuracy. Not only can this system mount a wide range of parts, it also can surround the work area with up to 160 smart tape feeders, fulfilling enormous production flexibility requirements for high-mix assemblies.

One-, Two- or Three-Stage Surface Mount Equipment Manufacturer’s Association (SMEMA) Inspection Conveyor
Linking the pick and place to the reflow stage is Manncorp’s inline SMEMA-compatible conveyor, which is available as a one, two or three-stage transport for inspection, buffer, or pass-through. Each stage includes a programmable logic controller (PLC) 25W motor with adjustable speed control and can be used for board widths from 50mm to 400mm. Available conveyor lengths are 500mm, 1m or 1.5m.

Small-Footprint Lead-Free Reflow Oven
The CR-5000F is well suitable for medium to high volume lead-free reflow. Its small footprint of just 10ft. long, is 20-30% shorter than comparable systems, yet has five full zones of hot-air convection heating, each with independent upper and lower temperature controls. In addition, it includes a combination adjustable 550mm edge-pin/stainless steel mesh belt conveyor, three thermocouple inputs, and a computer controller with a user-friendly Windows-based operating system for precision temperature profiling. Another important feature is its timed automatic startup and shutdown modes for power management and energy conservation.

The Manncorp line is representative of high innovation at a low acquisition cost. For more information related to this article, or to schedule a demonstration at the EMPF, contact Ken Friedman, 610-362-1200 x279 or via email at kfriedman@aciusa.org.