X-ray inspection is recognized as a vital step in the test regime of the printed circuit board (PCB) and semiconductor industries. Inspection of current package designs is extremely demanding so x-ray systems must provide high resolution, high magnification, and high contrast x-ray images, at the largest angular views. Fast inspection throughput and user-friendliness are also essential when specifying an x-ray system. Dage’s XD7500VR X-ray System (Figure 5-1) exceeds these requirements with its “Image Wizard” software, 0.95 micron (950 nm) feature recognition, automated inspection, video capture, user-friendly operating system, and much more. By providing high quality digital real-time x-ray images, enhanced resolution, extensive grayscale definition, and oblique angle views of up to 70°, joint quality can be assured.

The Dage comes standard with the VR160 x-ray tube offering a 1.3 mega pixel image viewed on a 20" flat panel LCD display and system magnification up to 5,650X. The optional XiDAT (x-ray integrated digital acquisition technology) provides a 2.0 mega pixel image when viewed on a 24" flat panel LCD display with up to 7,400X system magnification.
The advanced performance of the XD7500VR provides the superior x-ray quality needed to inspect the continually shrinking and very demanding environments affecting PCB product quality. These advancements were achieved through the improved feature recognition of the Dage VR open x-ray tube. Dage also offers the XD7500NT system which comes with a sealed transmissive NT950 x-ray tube technology. This eliminates the exposure of sensitive internal tube components during the regular filament changes and allows zero down time as opposed to the warm up periods needed when replacing filaments.

The machine and tube performance of the Dage x-ray systems --- together with the ease of use and sophistication of the Dage Image Wizard software --- takes x-ray inspection to new levels of image quality and clarity for BGA (ball grid array), flip chip, QFN (quad flat no leads), and chip scale package inspection on PCBs. X-ray inspection is a vital and integral part of any manufacturing facility and Dage XD7500VR is an outstanding choice for this very important procedure.

For more information related to this article, or to schedule a demonstration of the Dage XD7500VR located at the EMPF, contact Ken Friedman, 610.362.1200 extension 279 or via email at kfriedman@aciusa.org.