Given the current economy, the demand for qualified rework and repair technicians in the field of electronics manufacturing is more important than ever. Today’s competitive environment makes it more and more difficult to justify scrapping expensive assemblies and components (see Figure 6-1), when reclaiming or modifying existing product may be more economically feasible. The EMPF Learning Center is pleased to offer the newest version (Revision B) of IPC 7711/7721 training in rework, repair, and modification. The EMPF offers courses designed for both trainers and operators, and provides a hands-on approach to learning effective methods for the restoration of electronic assemblies.

Responding to feedback from previous classes, the latest revision of the course provides greater focus on student workmanship skills and lead-free concerns. Students will learn and practice techniques necessary to properly remove through-hole and surface mount (SMT) components with more emphasis placed on practical lab time than the in previous course. Additionally, at the Certified IPC Trainer level, a session is also devoted to giving the fledgling trainer tips and guidance on how to teach their students.

The course is broken down into nine training modules. The first module is mandatory and all others are optional after successful completion of the first.

Module 1 teaches general requirements and basic terminology used in analyzing rework and repair. Additionally, this module gives guidelines on tools and material considerations. The new revision of the course also provides a discussion of lead-free concerns. Guidelines are given to students on how to adjust rework and repair techniques to accommodate the higher tip temperatures and longer dwell times necessary when working with newer alloys in an increasingly lead-free environment.

Module 2 covers the four most common methods of wire splicing including guidelines on the feasibility of repair versus replacement, and the proper tinning and preparation of wires before splicing.

Module 3 focuses on through-hole technology. Within this session the methods of component removal and land preparation are taught utilizing the continuous vacuum and wicking methods. Axial-leaded, radial-leaded, and multi-leaded components are then reinstalled on the PWA in accordance with IPC 610D Class 3 criteria.

Modules 4, 5, and 6 are all concerned with SMT components. Throughout these sessions students will develop the skills to remove components, clean and prepare land pads, and subsequently reinstall components using safe, nondestructive methods. The modules are designated as follows:

• Module 4: Chip and Metal Electrode Face (MELF) components.
  
• Module 5: Gull-wing leaded components, small outline transistors (SOTs), small outline integrated circuits (SOICs), quad flat packs (QFPs).
  
• Module 6: J-leaded components.

It is worth noting that Modules 5 and 6 have been restructured in the new revision in order to accommodate more hands-on practice with the traditionally difficult J-leaded components. These component techniques are now contained within their own module.

Modules 7, 8, and 9 concentrate on techniques used to repair circuit boards and laminates as well as methods for conformal coating/ solder resist removal and reapplication. These modules include techniques as follows:

• Module 7: Skills used to fix lifted pads, install eyelets into a damaged plated through-hole, fix damaged traces; install a surface jumper wire.
  
• Module 8: Skills used to excavate and refill burned/damaged laminate.
  
• Module 9: Skills for identifying the five general categories of conformal coating; removal of conformal coating using mechanical, thermal, or solvent methods; and the reapplication of conformal coating.

There is also a session on ball grid array (BGA) rework and discussions on topics such as auxiliary heating (for overcoming the heat-sink effect of connections to ground planes) and preheating/baking (to remove moisture and avoid blowholes and voids).

The EMPF Learning Center is proud to announce the introduction of Vision Engineering microscopes to provide the latest technology in magnification and new PACE rework stations to provide the most state of the art equipment for our student’s training experience.

This course is ideal for individuals who possess strong reasoning capabilities and above average soldering skills. A Certified IPC Specialist (CIS) can complete the course in nine days while a Certified IPC Trainer (CIT) can complete it in five days. An IPC certification valid for two years is earned upon successful completion of the course. Please contact the Registrar by phone at 610.362.1295 or via email at registrar@empf.org for more details.