A publication of the National Electronics Manufacturing Center of Excellence
July 2009
ACI EMPF

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ACI Technologies Inc.
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WEBSITE: www.empf.org
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The EMPF is a U.S. Navy-sponsored National
Electronics Manufacturing Center of Excellence focused on the development, application, and transfer of new electronics manufacturing technology by partnering with industry, academia, and government centers and laboratories in the U.S

Michael D. Frederickson
EMPF Director

Barry Thaler, PhD., bthaler@aciusa.org
EMPF Technical Editor



In This Issue

Automated Testing with Boundary Scan

 

Ask the EMPF Helpline!

 

Advanced High Power, High Density Electronic Connectors

 

Tech Tips: COTS Challenges in a Military Environment

 

Manufacturer’s Corner: Kyzen Corporation

 

IPC J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

 

EMTC Online Registration

 

Upcoming Training Center Courses

IAB
Industrial Advisory Board
Gerald R. Aschoff, The Boeing Company
Dennis M. Kox, Raytheon
Gregory X. Krieger, BAE Systems
Edward A. Morris, Lockheed Martin
Jack R. Harris, Rockwell Collins
Gary Kirchner, Honeywell
Andrew Paradise, Northrop Grumman
Richard Kidwell , ITT Industries


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Boundary scan is a method for testing interconnects on printed circuit boards (PCBs) or sub-blocks inside an integrated circuit. It has rapidly become the technology of choice
for building reliable high technology electronic products with a high degree of testability.

Due to the low-cost and integrated circuit (IC) level access capabilities of boundary scan, its use has expanded beyond traditional board test applications into product design and service.

What is Boundary Scan?
Boundary scan, as defined by the IEEE Std.-1149.1 standard developed by the Joint Test Action Group (JTAG), is an integrated method for testing
interconnects on PCBs that are implemented at the IC level. The inability to test highly complex and dense printed circuit boards using traditional in-
circuit testers and bed of nail fixtures was already evident in the mid 1980s. Due to physical space constraints and loss of physical access to fine pitch components and BGA (ball grid array) devices, fixturing cost increased dramatically while fixture reliability decreased at the same time.

Testing with Boundary Scan
The boundary scan architecture provides a means to test interconnects and clusters of logic, memories, etc. without using physical test probes. It adds one or more so called “test cells” connected to each pin of the device that can selectively override the functionality of that pin. These cells can be programmed via the JTAG scan chain to drive a signal onto a pin and across an individual trace on the board. The cell at the destination of the board trace can then be programmed to read the value at the pin, verifying the board trace properly connects the two pins. If the trace is shorted to another signal or if the trace has been cut, the correct signal value will not show up at the destination pin, and the board will be known to have a fault.

When performing boundary scan inside integrated circuits, cells are added between logical design blocks in order to be able to control them in the same manner as if they were physically independent circuits. For normal operation, the added boundary scan latch cells are set so that they have no effect on the circuit, and are therefore effectively invisible. However, when the circuit is set into a test mode, the latches enable a data stream to be passed from one latch to the next. Once the complete data word has been passed into the circuit under test, it can be latched into place. Since the cells can be used to force data into the board, they can set up test conditions. The relevant states can then be fed back into the test system by clocking the data word back so that it can be analyzed.

The principles of interconnect test using boundary scan are illustrated in Figure 1-1 depicting two boundary scan compliant devices, U1 and U2, which are connected with four nets. U1 includes four outputs that are driving the four inputs of U2 with various values. In this case, we assume that the circuit includes two faults: a short between Nets 2 and 3, and an open on Net 4. We will also assume that a short between two nets behaves as a wired-AND and an open is sensed as logic 1. To detect and isolate the above defects, the tester is shifting the patterns shown in Figure 1-1 into the U1 boundary scan register and applying these patterns to the inputs of U2. The inputs values of U2 boundary scan register are shifted out and compared to the expected results. In this case, the results (marked in red) on Nets 2, 3, and 4 do not match the expected values and, therefore, the tester detects the faults on Nets 2, 3, and 4.


By adopting this technique, it is possible for a test system to gain test access to a board. As most of today’s boards are very densely populated with components and tracks, it is very difficult for test systems to access the relevant areas of the board to enable them to test the board. Boundary scan makes this possible.

Debugging with Boundary Scan
While it is obvious that boundary-scan based testing can be used in the production phase of a product, new developments and applications of the IEEE-1149.1 standard have enabled the use of boundary scan in many other product life cycle phases. Specifically, boundary scan technology is now applied to product design, prototype debugging and field service.

A large proportion of high end embedded systems have a JTAG port. ARM [Advanced RISC (reduced instruction set computer) Machine] processors come with JTAG support, as do most FPGAs (field-programmable gate arrays). Modern 8-bit and 16-bit microcontroller chips, such as Atmel AVR and TI MSP430 chips, rely on JTAG to
support in-circuit debugging and firmware reprogramming (except on the very smallest chips, which don’t have enough pins to spare and thus rely on proprietary single-wire programming interfaces).

The PCI (Peripheral Component Interconnect) bus connector standard contains optional JTAG signals on pins 1-5; PCI-Express contains JTAG signals on pins 5-9. A special JTAG card can be used to re-flash corrupted BIOS (Basic Input/Output System). In addition, almost all complex programmable logic device (CPLD) and FPGA manufacturers, such as Altera, Lattice and Xilinx, have incorporated boundary scan logic into their components, including additional circuitry that uses the boundary scan four-wire JTAG interface to program their devices in-system.

Boundary Scan Applications at the EMPF

The EMPF has successfully incorporated boundary scan, or JTAG into its numerous designs for U.S. Army and NavAir projects. The use of onboard JTAG ports in the designs involving Xilinx CPLDs and FPGAs allows design engineers at the EMPF to have the flexibility to program the parts and change their logic on-the-fly without powering down the board. Additionally, by utilizing Xilinx ChipScope, an embedded software based logic analyzer and virtual input and output controller through JTAG, the EMPF engineers have great convenience in examining, analyzing and manipulating the internal logic of their FPGA designs.

Summary
Boundary scan is a widely practiced test methodology that is reducing costs, speeding development, and improving product quality for electronics manufacturers around the world. By relying on an industry standard (IEEE 1149.1), it is relatively quick, easy, and inexpensive to deploy a highly effective test procedure. It saves design time and adds new value added capabilities to the design, which contributes to the overall effect of significantly reduced product development and support costs.

For more information about boundary scan or any other services offered at the EMPF, contact Ken Friedman at 610.362.1200, extension 279 or via email at kfriedman@aciusa.org.





References:
http://standards.ieee.org/reading/ieee/std_public/description/testtech/1149.1-1990_desc.html
http://www.jtag.com/
http://www.corelis.com/products/Boundary-Scan_Tutorial.htm
http://www.xilinx.com/support/documentation/topicfpgafeaturedesign_bscanjtag.htm


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