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ISO 9001-2008
Certified
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ACI Technologies Inc.
One International Plaza
Suite 600
Philadelphia, PA 19113
(610) 362-1200
FAX: (610) 362-1290
HELPLINE: (610) 362-1320
WEBSITE: www.empf.org
www.aciusa.org |
The EMPF is a U.S. Navy-sponsored
National Electronics Manufacturing Center
of Excellence focused on the development,
application, and transfer of new electronics
manufacturing technology by partnering with
industry, academia, and government centers
and laboratories in the U.S
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Michael D. Frederickson
EMPF Director
Barry Thaler, PhD., bthaler@aciusa.org
EMPF Technical Editor
In This Issue |

Industrial Advisory Board
Gerald R. Aschoff, The Boeing Company
Dennis M. Kox, Raytheon
Gregory X. Krieger, BAE Systems
Edward A. Morris, Lockheed Martin
Jack R. Harris, Rockwell Collins
Gary Kirchner, Honeywell
Andrew Paradise, Northrop Grumman
Richard Kidwell , ITT Industries
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There are two key issues facing electronic cleaning processes today as assemblies, and the modern solder materials we use to assemble them, continue to evolve.
First, modern assemblies involve a wide range of component sizes that often share one thing in common – they are placed at very low, near zero standoff heights. This presents a real challenge for cleaning materials to remove all residues from such tight spaces.
Kyzen Corporation, a cleaning chemistry partner to the EMPF, is an expert in providing cleaning solutions to both military and commercial customers. Several years ago, they developed a low standoff test card to study the effects of different cleaning agents and mechanical energy configuration to achieve what they call z-axis cleaning. As component geometries decrease, the challenges for successful removal of flux and other contamination caught under the z-axis increases. After thousands of low standoff cards and several technology generations, cleaning these difficult z-axis areas is simply routine. Whether the use of these chemistries are introduced in batch or in an inline process, the improved cleanliness results in higher quality, better first pass yields, and lower operating costs.

The second key issue is that as manufacturers work with changing components and materials, the cleaning processes parameters have gradually changed to keep pace. To address these changes, process temperatures often increase and exposure time to the cleaning materials may increase as well. This is where modern cleaning agent design, including a robust inhibition package to protect the various materials on an assembly, is critical. In the mid 90s, Kyzen developed a proprietary test card to evaluate surface cleanliness, as well as surface finish, following a cleaning process. Their proven success – after almost two decades of dedication to board and system cleaning technology – makes Kyzen a valuable partner to the EMPF and the industry as a whole.
Of course, not every board is a new design or new production. A few years ago in the aftermath of Hurricane Katrina, the EMPF was tasked to recover some important assemblies that had been in storage in the greater New Orleans area. The goal was to clean and remove any contamination risk due to the ill effects of the storm. Using the Kyzen chemistry in an inline process, the EMPF was able to achieve that goal in a single pass. This, and countless other successes, show the value and necessity of cleaning chemistry manufacturers like Kyzen.
To learn more about the various cleaning chemistries of Kyzen or to schedule a live demonstration, please contact Ken Friedman at 610.362.1200, extension 279 or via email at kfriedman@aciusa.org.
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