One of the most comprehensive courses offered at the EMPF Training Center is the Electronics Manufacturing Boot Camp. This two week course is designed to provide information on all aspects of electronics manufacturing for personnel who may not be up to date with the current state of the industry.

Component identification is the first presentation. This lecture provides students with the information necessary to identify and understand the different types of parts used in soldered electronic assemblies. They are also introduced to the considerations necessary when choosing or working with various types of components. Real examples of a variety of components are used during the lecture, and students work with a number of different components during the hands-on portions of the two week course.

The presentation begins by defining nomenclature such as the difference between active components and passive components, the difference between discrete and integrated components, the concept of polarity and the ways polarity can be indicated on parts and printed circuit boards (PCBs), and the concept of lead pitch distances.

Next, the students are introduced to through-hole components. Simple axial and radial leaded components are introduced and compared. Single in-line, dual in-line packages, pin grid array, and connectors are also discussed. The advantages and disadvantages of the different types of through-hole components are presented and the preferred types are identified.

Surface mount technology (SMT) parts are also introduced. The three types of interconnects present on SMT parts (terminations, leads, solder bumps) are demonstrated. Rectangular chip components and cylindrical metal electrode face (MELF) components are compared, and the size code system used to describe rectangular chip components is presented. Also included in the discussion of termination type components, are castellated and quad flat no-lead components.

Leaded components are introduced by showing the various types of gull-wing and J-leaded components, both integrated and discrete. The various package body types and sizes of small outline integrated circuits (SOICs) and small outline transistors (SOTs) are shown, so the students can understand their differences.

Area array components are presented as the last SMT component type. This discussion covers both ball grid array (BGA) packages (including plastic BGAs and ceramic BGAs), column grid arrays, tape bonded grid arrays, and micro BGAs. Also presented are direct chip attach packages, including flip chip, chip on board, and chip on flex components.

The lecture is completed with presentations on understanding part value markings and packaging types. Both numerical value markings and color band markings are included in the marking discussion. The various types of delivery media (tape and reel, matrix tray, tube) are compared and contrasted.

After attending this lecture, students have a greater familiarity with the variety of parts used in electronics manufacturing. Students also have a greater comfort level with the acronyms used to identify components, which allows them to become more involved in discussions with manufacturing personnel back at their place of employment.

For additional information on the Boot Camp course, please contact the Registrar at 610.362.1289 or via email at registrar@empf.org. A complete roster and descriptions of all of the courses offered at the EMPF can be found at www.aciusa.org/courses.