In today’s complex manufacturing environments, a great deal of thought is given to the lean concepts of day-to-day production. Although lean manufacturing techniques are reducing process costs, growing electricity prices are increasing manufacturing costs overall.

Developing the most accurate reflow thermal profiles is a critical component of long term cost savings and production accuracy. Using a thermal profiler is the first step in this process. The thermal profiler measures the time and temperature as the product travels through the reflow oven. The data acquired typically includes statistics such as peak temperature, soak, time above liquidus, and more. This profile is crucial for understanding the “success” of the thermal process relative to the factors that limit the process (i.e., the process window).

The Explorer is a new generation of thermal profiler from KIC (Figure 5-1). It features a very compact design which will easily move through the restrictive process dimensions encountered in today’s thermal applications. It incorporates state-of-the-art surface mount technology (SMT) components and the high-temperature rated components that are necessary to endure the harsh conditions of real-world factory use. KIC’s thermal profilers measure all relevant data of the process. By combining this data into a matrix, a process window is defined to assure product reliability. The closer to the center of this window, the more robust the process profile, and the lower the Process Window Index (PWI). This unique and vital statistic measures how well the actual product profile matches the established process window. The PWI not only helps ensure correct wetting and cooling, but will help reduce long-term energy costs.

Studies have been conducted at numerous electronics manufacturing facilities to observe the effect of power use on varying reflow oven settings. The KIC profilers were key to these investigations. It was theorized that by reducing the heat and increasing the dwell time in each zone of the oven, considerable energy can be saved. This may seem counter-intuitive to the standard profile of using higher reflow temperatures for shorter times; however, the average reflow oven has many alternative recipes that can produce a correct profile. In fact, for any given application, a number of these recipes are capable of processing the product within specification. But the manual setup and investigation of many profiles is very slow and expensive. Software tools are now available to automate process optimization using modern simulation algorithms. Even optimizing on low power consumption can now be performed. The KIC tools can consider millions of available recipes and select the appropriate oven setup that yields the lowest energy use, all within seconds.

The profiling expertise of the KIC Explore is a valuable tool, not only to find the perfect thermal recipe, but also as a means to cut wasted energy and production costs.
For more information related to this article, or to schedule a demonstration of the KIC thermal profiler located at the EMPF, contact Ken Friedman at 610.362.1200, extension 279 or via email at kfriedman@aciusa.org.