Given the current climate of affordability, it has never been more important to get the most for your money. In electronics manufacturing the most cost effective way to utilize resources is to invest in the proper training of personnel; but how do you match an adequate amount of training to the task being performed? Training personnel to the IPC-7711B/7721B provides two levels of cost effectiveness and affordability. First, the ability to rework or repair an assembly will eliminate the costly practice of scrapping every piece that does not comply with quality standards. Second, the IPC-7711B/7721B, CIS (Certified IPC Applications Specialist) level class is currently taught in modules that allow the selection of only those topics relevant to a specific job.
The CIS is defined under the IPC policy and procedures1 as a manager, supervisor, inspector/quality program administrator, operator or any other individual that needs a consistent understanding of the criteria contained within the standard. Module one of IPC-7711B/7721B includes an overview of IPC policies and procedures and teaches the student common practices that are to be utilized in any rework or repair operation. It is a mandatory module that is required before training to any optional modules which are much more specific in nature.
The following is an overview of the remaining eight optional modules.
Module Two. Wire Splicing contains criteria and procedural requirements for utilizing the four most common types of wire splices.
Module Three. Through-Hole contains criteria and procedural recommendations for the removal and reinstallation of through-hole components.
Module Four. Chip and MELF contains criteria and procedural requirements for the removal and reinstallation of surface mounted chip and MELF (metal electrode face) components.
Module Five. Gull Wing Lead contains criteria and procedural requirements for the removal and reinstallation of surface mount gull wing leaded components [including small outline transistors (SOTs), small outline integrated circuits (SOICs), and quad flat packs (QFPs)].
Module Six. J-Lead contains criteria and procedural requirements for the removal and reinstallation of PLCC (plastic leaded chip carrier) components (commonly called J-leads).
Module Seven. PWB Circuit Repair contains criteria and procedural requirements, for the repair of damaged land/pads or foil runs (i.e. conductive traces), as well as for the installation of jumper wires.
Module Eight. Laminate Repair contains criteria and procedural requirements for the repair of burnt or damaged board material.
Module Nine. Conformal Coating contains criteria and procedural requirements for the removal and reinstallation of conformal coating. Also discussed are guidelines for identifying an unknown sample by comparing its physical characteristics to the physical characteristics of the five basic types of conformal coatings.
The benefit of the modular approach is obvious! A manufacturer can tailor a custom made course to suit the specific needs of their processes without the added expense of having to train personnel to criteria that is not relevant to the task at hand. The EMPF Learning Center is proud to offer on-site training of the modular CIS level IPC-7711B/7721B course which can be custom fit to specific manufacturing requirements.
This course is ideal for individuals who possess strong reasoning capabilities and above average soldering skills (Figure 6-1). An IPC certification is valid for two years is earned upon successful completion of the course, with endorsement blocks indicating the specific modules completed. Additional optional modules can be added at a later date to facilitate training around a hectic production schedule. Please contact the Registrar by phone at 610.362.1295 or via email at registrar@empf.org for more details.
1 IPC Professional Training and Certification Program Policies and Procedures. V1.2. Clause 2.0.2. Bannockburn: IPC Association Connecting Electronic Industries, 2007.
