As the needs and demands of a very complex industry increase, so does the offerings found in the EMPF. To meet these challenges, the EMPF’s power packaging lab develops manufacturing capabilities in assembly technology that can exploit the advantages of advanced materials. The lab contains equipment which enables flip chip assembly, hybrid bonding, wire bonding, and hermetic packaging of electronics devices, and surface mount chips and components.
The model 626 by Hybond is a deep access, long reach, manual wire bonder that can operate as a wedge bonder (wedge-wedge), ball bonder (ball-wedge), peg bonder (for tacking down pre-aligned leads, ribbons and bare or insulated wires), and a bump bonder (gold stud bumping) without having to remove or replace any electrical or mechanical machine component. Conversion time from ball bonder to wedge bonder or back is the same as the time spent replacing a used tool.
With servomotor control, touch sensor, and linear vertical movement, the 626 bond head can move and bond within a 0.750" vertical range without the need to readjust the work stage or bonder platform height. It also has memory for storage up to 75 different schedules (or “recipes”) and independent first and second bond digital parameter settings.
The 626 can be used for wire diameters from 0.7 to 2.0 mil gold wire when in ball bonder configuration or 0.5 to 3.0 mil and ribbon up to 1.0 x 12.0 mil (25 x 300 µm) when in wedge or peg bonding mode.
It was specifically designed for applications that require bonding at extreme height differences between first and second bond and for bonding wires to sensitive devices such as gallium arsenide field-effect transistors (FETs) and light emitting diodes (LEDs). The motorized wire feed and wire/ribbon clamping system provide superior control and allow the operator to increase or decrease tail length in 1 mil increments at a touch of a switch.
The 626 shows actual units for the set up of bond parameters. Change over from ball bonder to wedge bonder requires only a press of a button to turn EFO power to zero and to change from capillary to wedge tool. The 626 can also operate in bump or peg bonding modes.
The wire bonder is not only portable, but versatile. As a manual wire bonder, it more than proves its value on each application. For more information related to this article or to see a demonstration of the model 626 bonder by Hybond, please contact Ken Friedman at 610.362.1200 extension 279 or via email at kfriedman@aciusa.org.
