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Materials used in Electronics Assemblies</a></p></td> </tr> <tr><td valign="top"><p align="left">&nbsp;</p></td></tr> <tr><td valign="top" style="padding-left:10px"> <p align="left"><a href="http://store.aciusa.org">EMTC Online Registration</a></p></td> </tr> <tr><td valign="top"><p align="left">&nbsp;</p></td></tr> <tr><td valign="top" style="padding-left:10px"> <p align="left"><a href="../html/empfasis/emlcupcoming.pdf" target=_blank>Training Center Course Schedule</a></p></td> </tr> </table> <!--link here--> <br> <br> <hr align="center" size="1"> <br> <a href="http://store.aciusa.org"><img src="http://www.aciusa.org/images/lower-pricing-ad.gif" alt="Discount pricing on IPC training course J-STD-001, 610, 600, 7711, 7712" width="150" height="288" border="1"></a> <a href="http://www.empf.org/empfasis/subscribe.htm"> </a> <p class="style9"><script language="JavaScript"> <!-- function random_imglink(){ var myimages=new Array() 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<br> Philadelphia, PA 19113 <br> (610) 362-1200 <br> <span class="style6">FAX: </span>(610) 362-1290<br> <span class="style6">HELPLINE: </span>(610) 362-1320<br> <span class="style6">WEBSITE: </span><a href="http://www.empf.org">www.empf.org</a><br> <a href="http://www.aciusa.org">www.aciusa.org</a></div></td> </tr> </table> <p>&nbsp;</p> <p><br> <br> </p> <div align="center"> <p align="center" class="style7">Michael D. Frederickson<br> <strong><em>EMPF Director </em></strong><br> <br> Barry Thaler, PhD.<br> bthaler@aciusa.org <br> <strong><em>Empfasis Technical Editor<br> </em></strong><br> Paul Bratt<br> pbratt@aciusa.org <br> <strong><em>Empfasis Editor</em></strong><br> </p> <p align="center" class="style7"><img src="http://www.empf.org/empfasis/archive/images/iab_sm.gif" alt="IAB" width="100" height="52"><br> <span class="style9">Industrial Advisory Board</span><br> <span class="style14"><em>Gerald R. Aschoff</em>, The Boeing Company<br> <em>Dennis M. Kox</em>, Raytheon<br> <em>Gregory X. Krieger</em>, BAE Systems<br> <em>Edward A. Morris</em>, Lockheed Martin<br> <em>Jane Krueger </em>, Rockwell Collins<br> <em>Gary Kirchner</em>, Honeywell<br> <em>Andrew Paradise</em>, Northrop Grumman<br> <em>Richard Kidwell </em>, ITT Industries</span></p> </div> <p align="center" class="style7"><br> </p> </div> </td> </tr> </table> </div></td> <!-- InstanceBeginEditable name="Body1" --><td width="70%" rowspan="2" valign="top"><div class="body_style" id="body_content"> <p align=center><img src="images/elec.gif" alt="title"></p> <p class="body_text"><span class="style20">T</span>o be both cost-efficient and effective, it is important for the manufacturing engineer to have a firm knowledge of the properties of the raw materials being used in the manufacturing of electrical and electronic products. The task of making informed choices about material selection, performance, and reliability is critical when establishing manufacturing processes that will ensure high quality product in an increasingly competitive market. The EMPF offers a course titled "Characteristic Properties of Materials used in Electronics Assemblies" which gives an overview of material concerns impacting the manufacture of electronic assemblies. The course focuses on the relationship of the characteristics and properties of the raw materials to the level of quality and manufacturability of the end product.</p> <p>The course is three days in length and covers a wide variety of topics including:</p> <ul style="list-style-image: url('images/bullet.gif')"> <li>Ceramics and composite substrates</li> <li>Board finishes (e.g., ENIG and HASL)</li> <li>Semiconductors</li> <li>Lead materials and plating</li> <li>Plastic packaging versus metal or ceramic packaging</li> <li>Wire bonds</li> <li>Encapsulates, conformal coatings and adhesives</li> <li>Solder alloys (tin-lead and lead-free; Figures 6-1 and 6-2)</li> <li>Fluxes ("H" type, "M" type, and "L" type)</li> <li>Viscosity</li> <li>Contaminants</li> <li>Corrosion</li> <li>Diffusion</li> </ul> <p align="center"><img src="images/fig6-1.gif"></p> <p align="center"><img src="images/fig6-2.gif"></p> <p>The student will become familiar with the following areas:</p> <p><i>Material Behavior. </i>The course includes discussions of material properties (e.g., mechanical, electrical, and thermal) and how these properties impact the chemistry and physics that influence product yield, reliability, and quality. The observed reaction of materials to a variety of conditions may deviate significantly from what is theoretically expected. By examining the effects of environmental conditions such as humidity and temperature, as well as process induced anomalies such as contamination or thermal damage, the participant gains the ability to correct material issues and perhaps avoid them.</p> <p><i>Material Selection. </i>It is essential to match the right material with the process at hand. The only way to ensure reliable performance of a product is to depend upon the ability of the design engineer to accurately interpret the material's data sheets and assess the material's impact on the performance of the product. Successful participants in this course will be given the technical foundation needed to make informed decisions regarding the selection of fluxes, pastes, adhesives, substrates, cleaning materials, conformal coatings, and other common interconnect materials.</p> <p><i>Methods of Measuring. </i>Only through the gathering of objective evidence provided by testing can an accurate assessment be made of the interaction of materials within in a given process. To ensure the quality of incoming and outgoing products, material testing serves as the basis for performing failure analysis and process verification. Inspection test equipment and the associated inspection techniques are demonstrated for a wide range of materials and assemblies. This provides the participants with both the knowledge of the common failure modes observed in electronics manufacturing and the proper technique for evaluating them.</p> <p>Throughout the course there are a number of hands-on laboratory exercises and demonstrations to further enhance the understanding of the topics and relate them to actual manufacturing situations. These laboratory exercises include:</p> <ul style="list-style-image: url('images/bullet.gif')"> <li>Shear Testing</li> <li>Sequential Electrochemical Reduction Analysis (SERA)</li> <li>Wetting Balance</li> <li>Differential Scanning Calorimetry</li> <li>Ion Chromatography</li> <li>Scanning Electron Microscopy</li> </ul> <p>Engineers, quality managers, technicians, and designers have attended this course to gain an understanding of the fundamentals of material properties and interactions, and how they affect the manufacturing process. The course curriculum was developed to translate complicated concepts into useful knowledge to assist in product development and production support.</p> <p>If you would like more information regarding the "Characteristic Properties of Materials used in Electronics Assemblies" course, please call 610.362.1295 or email registrar@empf.org for a custom quote.</p> <p class="body_text"><img src="../../archive/updated/rdillman.gif"></p> </div> </td> <!-- InstanceEndEditable --> </tr> <tr> </tr> </table> <br> <table width="100%" border="0"> <tr> <td colspan="2"><div align="center"> <p><em>The EMPF is a U.S. Navy-sponsored National Electronics Manufacturing Center of Excellence focused on the development,<br> application, and transfer of new electronics manufacturing technology by partnering with industry,<br> academia, and government centers and laboratories in the U.S</em></p> </div></td> </tr> <tr> <td class="footer">ACI Technologies, Inc. - - <a href="http://www.aciusa.org">www.aciusa.org</a> - - (610)362-1200</td> <td><div align="right"><a href="http://www.navymantech.com"><img src="http://www.empf.org/empfasis/archive/images/mantech.gif" width="144" height="42" border="0"></a></div></td> </tr> </table> <div align="right"> <!-- Start of StatCounter Code --> <script type="text/javascript" language="javascript"> var sc_project=350643; var sc_partition=1; </script> <script type="text/javascript" language="javascript" src="http://www.statcounter.com/counter/counter.js"></script> <noscript> <a href="http://www.statcounter.com/free_hit_counter.html" target="_blank"><img src="http://c2.statcounter.com/counter.php?sc_project=350643&amp;amp;java=0" alt="hit counter" border="0"></a> </noscript> <a href="http://www.empf.org/sitemap.htm"><em>[site map] </em></a> <!-- End of StatCounter Code --> <!-- Start of StatCounter Code --> <script type="text/javascript" language="javascript"> var sc_project=1902214; var sc_invisible=1; var sc_partition=17; var sc_security="759b802c"; </script> <script type="text/javascript" language="javascript" src="http://www.statcounter.com/counter/counter.js"></script><noscript><a href="http://www.statcounter.com/" target="_blank"><img src="http://c18.statcounter.com/counter.php?sc_project=1902214&java=0&security=759b802c&invisible=1" alt="website statistics" border="0"></a> </noscript> <!-- End of StatCounter Code --> </div> </body> <!-- InstanceEnd --></html>