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border="0" onload=""></a></td> <td><a href="mailto:empf@aciusa.org" target="_top" onClick="MM_nbGroup('down','group1','contact','',1)" onMouseOver="MM_nbGroup('over','contact','../../nav/images/empfasis_nav_06-over.gif','',1)" onMouseOut="MM_nbGroup('out')"><img src="../../nav/images/empfasis_nav_06.gif" alt="" name="contact" width="74" height="34" border="0" onload=""></a></td> </tr> </table> <!-- #EndLibraryItem --></div> <table width="100%" border="0"> <tr> <td width="85%" class="style17">A publication of the National Electronics Manufacturing Center of Excellence</td> <!-- InstanceBeginEditable name="Date" --><td width="15%"><div align="right">September 2010 </div></td> <!-- InstanceEndEditable --> </tr> </table> <table width="100%" border="0"> <tr> <td width="237" valign="top"> <div align="center"> <table width="237" height="1280" border="0" cellpadding="30" cellspacing="0"> <tr> <td width="237" valign="top" background="../../archive/images/left_banner4.jpg"><div id="lft_banner"> <table width="185" border="0" cellspacing="0" cellpadding="0"> <tr> <td><a href="http://www.aciusa.org" target="_blank"><img src="http://www.empf.org/empfasis/archive/images/aci_sm.gif" alt="Go to the ACI website" width="69" height="44" border="0" align="left" longdesc="http://www.aciusa.org"></a></td> <td><a href="http://www.empf.org" target="_blank"><img src="http://www.empf.org/empfasis/archive/images/empf_sm.gif" alt="Go to the EMPF website" width="65" height="44" border="0" align="right" longdesc="http://www.empf.org"></a></td> </tr> <tr> <td colspan="2"><div align="center"> <table width="175" border="0" align="center" cellpadding="0" cellspacing="0"> <tr> <td valign="top"><span class="style1"><span class="style24"><br> In This EMPFasis Issue<br> <br> </span></span></td> </tr> <tr> <td valign="top" style="padding-left:10px"><!-- InstanceBeginEditable name="Article_1" --> <p align="left"><a href="rfsemi.html">RF Semiconductor Devices</a></p> <!-- InstanceEndEditable --></td> </tr> 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<hr align="center" size="1"> <br> <a href="http://store.aciusa.org"><img src="http://www.aciusa.org/images/lower-pricing-ad.gif" alt="Discount pricing on IPC training course J-STD-001, 610, 600, 7711, 7712" width="150" height="288" border="1"></a> <a href="http://www.empf.org/empfasis/subscribe.htm"> </a> <p class="style9"><script language="JavaScript"> <!-- function random_imglink(){ var myimages=new Array() myimages[1]="http://www.aciusa.org/wwwaci/html/random/boot.gif" myimages[2]="http://www.aciusa.org/wwwaci/html/random/lead.gif" myimages[3]="http://www.aciusa.org/wwwaci/html/random/help.gif" myimages[4]="http://www.aciusa.org/wwwaci/html/random/service.gif" myimages[5]="http://www.empf.org/empfasis/archive/images/subscribe2.gif" var imagelinks=new Array() imagelinks[1]="http://www.aciusa.org/courses/train_boot.htm" imagelinks[2]="http://www.empf.org/empfasis/leadfree.htm" imagelinks[3]="http://www.empf.org/helpline/helpline.htm" imagelinks[4]="http://www.aciusa.org/ana/ana_home.htm" imagelinks[5]="http://www.empf.org/empfasis/subscribe.htm" var ry=Math.floor(Math.random()*myimages.length) if (ry==0) ry=1 document.write('<a href='+'"'+imagelinks[ry]+'"'+'><img src="'+myimages[ry]+'" border=0></a>') } random_imglink() //--> </script></p> </div></td> </tr> <tr> <td colspan="2"><div align="center"><span class="style5">ACI Technologies Inc.</span><br> One International Plaza<br> Suite 600 <br> Philadelphia, PA 19113 <br> (610) 362-1200 <br> <span class="style6">FAX: </span>(610) 362-1290<br> <span class="style6">HELPLINE: </span>(610) 362-1320<br> <span class="style6">WEBSITE: </span><a href="http://www.empf.org">www.empf.org</a><br> <a href="http://www.aciusa.org">www.aciusa.org</a></div></td> </tr> </table> <p>&nbsp;</p> <p><br> <br> </p> <div align="center"> <p align="center" class="style7">Michael D. Frederickson<br> <strong><em>EMPF Director </em></strong><br> <br> Barry Thaler, PhD.<br> bthaler@aciusa.org <br> <strong><em>Empfasis Technical Editor<br> </em></strong><br> Paul Bratt<br> pbratt@aciusa.org <br> <strong><em>Empfasis Editor</em></strong><br> </p> <p align="center" class="style7"><img src="http://www.empf.org/empfasis/archive/images/iab_sm.gif" alt="IAB" width="100" height="52"><br> <span class="style9">Industrial Advisory Board</span><br> <span class="style14"><em>Gerald R. Aschoff</em>, The Boeing Company<br> <em>Dennis M. Kox</em>, Raytheon<br> <em>Gregory X. Krieger</em>, BAE Systems<br> <em>Edward A. Morris</em>, Lockheed Martin<br> <em>Jane Krueger </em>, Rockwell Collins<br> <em>Gary Kirchner</em>, Honeywell<br> <em>Andrew Paradise</em>, Northrop Grumman<br> <em>Richard Kidwell </em>, ITT Industries</span></p> </div> <p align="center" class="style7"><br> </p> </div> </td> </tr> </table> </div></td> <!-- InstanceBeginEditable name="Body1" --><td width="70%" rowspan="2" valign="top"><div class="body_style" id="body_content"> <p><img src="images/bgatraining.gif" alt="title"></p> <p class="body_text"><span class="style20">B</span>Ball grid array (BGA) packaged components have many design advantages when compared to equivalent components with external leads, such as higher I/O density, lesser termination inductance, and the ability to design reliefs into the substrate to improve thermal performance. While these advantages are significant for design activities, there are some unique challenges encountered when assembling and soldering BGA packages to printed circuit boards (PCBs). The EMPF offers a course on BGA Manufacturing, Inspection, and Rework that addresses the challenges that exist in the BGA assembly process.</p> <p>The course begins with information on the various types of BGA packages and their advantages and disadvantages. The most common type is the plastic BGA (PBGA), which is constructed by molding over a substrate with a die attached and wirebonded (Figures 6-1 and 6-2). The substrate is typically a glass epoxy material and may be exposed or completely contained within the plastic molded body of the PBGA. These parts are typically lower in cost than other package types. Since the coefficient of thermal expansion (CTE) is similar to PCB materials, lower stresses occur between the BGA and the PCB during temperature changes. PBGAs can be sensitive to moisture exposure and package fracturing during reflow if not stored and handled properly.</p> <p align="center"><img src="images/fig6-1.gif"></p> <p align="center"><img src="images/fig6-2.gif"></p> <p>Ceramic BGAs (CBGAs), an alternative to PBGAs, can be hermetically sealed and thus are not sensitive to moisture. Since the CTE of a CBGA is significantly lower than epoxy glass PCB base materials, stresses on the soldered connection can result during temperature changes. A CBGA also has a significantly higher thermal mass than an equivalent PBGA which makes reflow oven profiles more difficult to develop.</p> <p>Assembly concerns are the next topic presented during the course. This section exposes the student to some of the difficulties that can be present during BGA assembly processes. Storage and handling of BGAs, PCBs, and the solder paste used to install them is discussed with a focus on humidity exposure and defects that can occur as a result of improper storage. The use of solder mask defined (SMD) lands and the advantages of non-solder mask defined (NSMD) lands in the design of the PCB is discussed. The effects of CTE mismatch on reliability are also presented.</p> <p>The manufacturing process to install and solder BGAs is discussed. Control of the solder paste application process is stressed as a means to ensure a quality solder joint. The effects of improper paste volume and alignment of the stencil to the PCB are demonstrated and actions that can be taken to prevent or eliminate these issues are discussed. Strategies for alignment of BGAs to the PCB, such as mechanical alignment fixtures and vision alignment systems, are compared and contrasted. The self-centering effect of BGAs during solder reflow is demonstrated via a short movie during the lecture presentation.</p> <p>Rework of BGA components through the use of hot air and infrared radiation equipment is discussed. A focus on obtaining the correct reflow temperatures is stressed. Reballing techniques, such as the use of paper preforms or loose balls and fixtures, are presented with a focus on the advantages and disadvantages of each method. The proper way to prepare a PCB site during BGA removal and replacement is presented (Figure 6-3) with a focus on preventing damage to the PCB surface.</p> <p align="center"><img src="images/fig6-3.gif"></p> <p>The various methods of inspection of soldered BGAs are the final topic of focus during the course. The use of endoscopic camera systems is presented. The capabilities and limitations of inspection endoscopes are highlighted through the use of images taken using such a system. The use of X-ray to inspect the workmanship of a soldered BGA is presented, highlighting the advantages and limitations of the various types of X-ray systems.</p> <p>The students are also given the opportunity to reinforce the lecture materials through the use of the EMPF Demonstration Factory. Students are given the opportunity to assemble BGAs to PCBs using an automated solder screen printer, SMT placement equipment, and reflow oven. These assemblies are then inspected using both the endoscope and transmissive X-ray systems in the Demonstration Factory. Students remove and replace a BGA on their PCB using hot air rework systems. The students can then inspect the replaced components to demonstrate the differences in quality between a BGA assembled using a fully automated process and one using a rework process. The instructor also demonstrates a variety of defects that can be identified during inspection and measures that can be taken to prevent those defects from occurring in the first place.</p> <p>For more information about the BGA Manufacturing, Inspection, and Rework course  or to develop a customized BGA course that can provide training at your facility, on your equipment  contact the EMPF Registrar by calling 610.362.1295 or via email at registrar@empf.org. Information and schedules can also be obtained at the EMPF website: www.empf.org.</p> <p class="body_text"><img src="../../archive/updated/jfullerton.gif"></p> </div> </td> <!-- InstanceEndEditable --> </tr> <tr> </tr> </table> <br> <table width="100%" border="0"> <tr> <td colspan="2"><div align="center"> <p><em>The EMPF is a U.S. Navy-sponsored National Electronics Manufacturing Center of Excellence focused on the development,<br> application, and transfer of new electronics manufacturing technology by partnering with industry,<br> academia, and government centers and laboratories in the U.S</em></p> </div></td> </tr> <tr> <td class="footer">ACI Technologies, Inc. - - <a href="http://www.aciusa.org">www.aciusa.org</a> - - (610)362-1200</td> <td><div align="right"><a href="http://www.navymantech.com"><img src="http://www.empf.org/empfasis/archive/images/mantech.gif" width="144" height="42" border="0"></a></div></td> </tr> </table> <div align="right"> <!-- Start of StatCounter Code --> <script type="text/javascript" language="javascript"> var sc_project=350643; var sc_partition=1; </script> <script type="text/javascript" language="javascript" src="http://www.statcounter.com/counter/counter.js"></script> <noscript> <a href="http://www.statcounter.com/free_hit_counter.html" target="_blank"><img src="http://c2.statcounter.com/counter.php?sc_project=350643&amp;amp;java=0" alt="hit counter" border="0"></a> </noscript> <a href="http://www.empf.org/sitemap.htm"><em>[site map] </em></a> <!-- End of StatCounter Code --> <!-- Start of StatCounter Code --> <script type="text/javascript" language="javascript"> var sc_project=1902214; var sc_invisible=1; var sc_partition=17; var sc_security="759b802c"; </script> <script type="text/javascript" language="javascript" src="http://www.statcounter.com/counter/counter.js"></script><noscript><a href="http://www.statcounter.com/" target="_blank"><img src="http://c18.statcounter.com/counter.php?sc_project=1902214&java=0&security=759b802c&invisible=1" alt="website statistics" border="0"></a> </noscript> <!-- End of StatCounter Code --> </div> </body> <!-- InstanceEnd --></html>