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border="0" onload=""></a></td> <td><a href="mailto:empf@aciusa.org" target="_top" onClick="MM_nbGroup('down','group1','contact','',1)" onMouseOver="MM_nbGroup('over','contact','../../nav/images/empfasis_nav_06-over.gif','',1)" onMouseOut="MM_nbGroup('out')"><img src="../../nav/images/empfasis_nav_06.gif" alt="" name="contact" width="74" height="34" border="0" onload=""></a></td> </tr> </table> <!-- #EndLibraryItem --></div> <table width="100%" border="0"> <tr> <td width="85%" class="style17">A publication of the National Electronics Manufacturing Center of Excellence</td> <!-- InstanceBeginEditable name="Date" --><td width="15%"><div align="right">September 2010 </div></td> <!-- InstanceEndEditable --> </tr> </table> <table width="100%" border="0"> <tr> <td width="237" valign="top"> <div align="center"> <table width="237" height="1280" border="0" cellpadding="30" cellspacing="0"> <tr> <td width="237" valign="top" background="../../archive/images/left_banner4.jpg"><div id="lft_banner"> 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align="center" size="1"> <br> <a href="http://store.aciusa.org"><img src="http://www.aciusa.org/images/lower-pricing-ad.gif" alt="Discount pricing on IPC training course J-STD-001, 610, 600, 7711, 7712" width="150" height="288" border="1"></a> <a href="http://www.empf.org/empfasis/subscribe.htm"> </a> <p class="style9"><script language="JavaScript"> <!-- function random_imglink(){ var myimages=new Array() myimages[1]="http://www.aciusa.org/wwwaci/html/random/boot.gif" myimages[2]="http://www.aciusa.org/wwwaci/html/random/lead.gif" myimages[3]="http://www.aciusa.org/wwwaci/html/random/help.gif" myimages[4]="http://www.aciusa.org/wwwaci/html/random/service.gif" myimages[5]="http://www.empf.org/empfasis/archive/images/subscribe2.gif" var imagelinks=new Array() imagelinks[1]="http://www.aciusa.org/courses/train_boot.htm" imagelinks[2]="http://www.empf.org/empfasis/leadfree.htm" imagelinks[3]="http://www.empf.org/helpline/helpline.htm" imagelinks[4]="http://www.aciusa.org/ana/ana_home.htm" imagelinks[5]="http://www.empf.org/empfasis/subscribe.htm" var ry=Math.floor(Math.random()*myimages.length) if (ry==0) ry=1 document.write('<a href='+'"'+imagelinks[ry]+'"'+'><img src="'+myimages[ry]+'" border=0></a>') } random_imglink() //--> </script></p> </div></td> </tr> <tr> <td colspan="2"><div align="center"><span class="style5">ACI Technologies Inc.</span><br> One International Plaza<br> Suite 600 <br> Philadelphia, PA 19113 <br> (610) 362-1200 <br> <span class="style6">FAX: </span>(610) 362-1290<br> <span class="style6">HELPLINE: </span>(610) 362-1320<br> <span class="style6">WEBSITE: </span><a href="http://www.empf.org">www.empf.org</a><br> <a href="http://www.aciusa.org">www.aciusa.org</a></div></td> </tr> </table> <p>&nbsp;</p> <p><br> <br> </p> <div align="center"> <p align="center" class="style7">Michael D. Frederickson<br> <strong><em>EMPF Director </em></strong><br> <br> Barry Thaler, PhD.<br> bthaler@aciusa.org <br> <strong><em>Empfasis Technical Editor<br> </em></strong><br> Paul Bratt<br> pbratt@aciusa.org <br> <strong><em>Empfasis Editor</em></strong><br> </p> <p align="center" class="style7"><img src="http://www.empf.org/empfasis/archive/images/iab_sm.gif" alt="IAB" width="100" height="52"><br> <span class="style9">Industrial Advisory Board</span><br> <span class="style14"><em>Gerald R. Aschoff</em>, The Boeing Company<br> <em>Dennis M. Kox</em>, Raytheon<br> <em>Gregory X. Krieger</em>, BAE Systems<br> <em>Edward A. Morris</em>, Lockheed Martin<br> <em>Jane Krueger </em>, Rockwell Collins<br> <em>Gary Kirchner</em>, Honeywell<br> <em>Andrew Paradise</em>, Northrop Grumman<br> <em>Richard Kidwell </em>, ITT Industries</span></p> </div> <p align="center" class="style7"><br> </p> </div> </td> </tr> </table> </div></td> <!-- InstanceBeginEditable name="Body1" --><td width="70%" rowspan="2" valign="top"><div class="body_style" id="body_content"> <p><img src="images/helpline.gif" alt="title"></p> <p class="body_text"><i>A customer called the EMPF Helpline with a question regarding which standards apply to thermo-compression attachment of flip-chip components.</i></p> <p class="body_text"><span class="style20">A</span>n EMPF customer contacted the Helpline expressing difficulty in locating a specification for reliability testing of flip chip components using thermocompression attachment. The customer was looking to perform thermal reliability and vibration testing on their assemblies, and needed an applicable specification in order to define the test parameters and pass/fail criteria. Although there are specifications available for seemingly every other attachment method, none exists as of yet for such a unique method as thermocompression attachment.</p> <p>Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as improving device performance. A completed flip chip assembly is much smaller than a traditional chip-and-wire based assembly. The chips sit directly on the printed circuit board (PCB) or substrate, reducing the device footprint. The processing of a flip chip component is similar to conventional integrated circuit (IC) fabrication, with a few additional steps. Near the end of the manufacturing process, the attachment pads are metalized to make them more receptive to solder. A small dot, or bump, of gold is then deposited on each metalized die bond pad. Finally, the chips are cut from the wafer as normal, and the die is directly connected to a PCB or substrate. This bumping and attach process is also preferred over the traditional chip-and-wire bond, as its short bond path exhibits much lower inductance, reducing parasitics and allowing higher speed signals.</p> <p>The thermocompression attachment method is a means of attaching a bumped flip chip IC to its PCB or substrate. It is much more robust than attaching the IC bumps to the substrate pads using a conductive epoxy. In thermocompression bonding, temperatures in the range of 300ºC to 400ºC are required to bond the bump to the substrate pad. This heat is applied either by a heated capillary or by mounting the substrate to a heated stage. Figure 2-1 graphically represents this process. Heat, time, and pressure (force) are the major determining factors in the formation of a thermocompression bond. A robust thermocompression bond typically results in a flattened ball appearance. </p> <p align="center"><img src="images/fig2-1.gif"></p> <p>Reliability testing determines whether an attachment technology meets specified performance requirements by testing to more severe conditions than those that would be used for normal screening of an assembly. In this instance, the customer was interested in performing thermal reliability testing on their flip chip assemblies. Thermal reliability testing involves rapidly cycling between temperatures that are far above and below what the assembly would actually see in the field. This accelerated exposure can provide the equivalent of several years of assembly operation in the field in only a few days inside a thermal chamber.</p> <p>Currently there is no standard available for flip chip thermocompression attachment reliability. Of the many standards available for reference, the JESD22-A104-D and IPC-9701 standards were written for reliability of solder joints of surface mount components and appear to be the most applicable for thermocompression attachment. By referencing these two standards, and also taking into account limitations of the thermal chambers available to the customer, the following criteria were recommended for evaluating the thermal reliability of the customer's flip chip thermocompression attached assemblies.</p> <p>Based on JESD22-A104 (test condition G) and IPC-9701 (test condition TC3) the following criteria were applied:</p> <ul> <li>Maximum temperature: +125ºC +15/-0ºC</li> <li>Minimum temperature: -40ºC +0/-10ºC</li> <li>Preferred soak (dwell) time: 10 minutes</li> <li>Ramp rate: less than 15ºC/minute</li> <li>Test duration: 1,000 cycles or 50% cumulative failures, whichever occurs first</li> <li>Testing to 63% cumulative failures is preferred to characterize the failure distribution</li> </ul> <p>The customer performed thermal cycling to the above conditions and felt confident in the reliability results obtained.</p> <p>For more information on JESD or IPC training or certification, please contact the registrar at 610.362.1295, via email at registrar@empf.org, or find course descriptions on the web at www.aciusa.org/courses. For any other information regarding flip chip attach or thermocompression bonding, please contact the EMPF Helpline at 610.362.1320.</p> <p class="body_text"><img src="../../archive/updated/nfardella.gif"></p> </div> </td> <!-- InstanceEndEditable --> </tr> <tr> </tr> </table> <br> <table width="100%" border="0"> <tr> <td colspan="2"><div align="center"> <p><em>The EMPF is a U.S. Navy-sponsored National Electronics Manufacturing Center of Excellence focused on the development,<br> application, and transfer of new electronics manufacturing technology by partnering with industry,<br> academia, and government centers and laboratories in the U.S</em></p> </div></td> </tr> <tr> <td class="footer">ACI Technologies, Inc. - - <a href="http://www.aciusa.org">www.aciusa.org</a> - - (610)362-1200</td> <td><div align="right"><a href="http://www.navymantech.com"><img src="http://www.empf.org/empfasis/archive/images/mantech.gif" width="144" height="42" border="0"></a></div></td> </tr> </table> <div align="right"> <!-- Start of StatCounter Code --> <script type="text/javascript" language="javascript"> var sc_project=350643; var sc_partition=1; </script> <script type="text/javascript" language="javascript" src="http://www.statcounter.com/counter/counter.js"></script> <noscript> <a href="http://www.statcounter.com/free_hit_counter.html" target="_blank"><img src="http://c2.statcounter.com/counter.php?sc_project=350643&amp;amp;java=0" alt="hit counter" border="0"></a> </noscript> <a href="http://www.empf.org/sitemap.htm"><em>[site map] </em></a> <!-- End of StatCounter Code --> <!-- Start of StatCounter Code --> <script type="text/javascript" language="javascript"> var sc_project=1902214; var sc_invisible=1; var sc_partition=17; var sc_security="759b802c"; </script> <script type="text/javascript" language="javascript" src="http://www.statcounter.com/counter/counter.js"></script><noscript><a href="http://www.statcounter.com/" target="_blank"><img src="http://c18.statcounter.com/counter.php?sc_project=1902214&java=0&security=759b802c&invisible=1" alt="website statistics" border="0"></a> </noscript> <!-- End of StatCounter Code --> </div> </body> <!-- InstanceEnd --></html>