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<table width="185" border="0" cellspacing="0" cellpadding="0"> <tr> <td><a href="http://www.aciusa.org" target="_blank"><img src="http://www.empf.org/empfasis/archive/images/aci_sm.gif" alt="Go to the ACI website" width="69" height="44" border="0" align="left" longdesc="http://www.aciusa.org"></a></td> <td><a href="http://www.empf.org" target="_blank"><img src="http://www.empf.org/empfasis/archive/images/empf_sm.gif" alt="Go to the EMPF website" width="65" height="44" border="0" align="right" longdesc="http://www.empf.org"></a></td> </tr> <tr> <td colspan="2"><div align="center"> <!--link here--> <table width="175" border="0" align="center" cellpadding="0" cellspacing="0"> <tr> <td valign="top"><span class="style24"><br>In This EMPFasis Issue<br><br></span></td> </tr> <tr><td valign="top" style="padding-left:10px"> <p align="left"><a href="advanced.html">Advanced Materials for TPV Devices</a></p> </td> </tr> <tr><td valign="top">&nbsp;</td></tr> <tr><td valign="top" style="padding-left:10px"> <p align="left"><a href="help-0211.html">Ask the EMPF Helpline!</a></p> </td> </tr> <tr><td valign="top"><p align="left">&nbsp;</p></td></tr> <tr><td valign="top" style="padding-left:10px"> <p align="left"><a href="materials.html">Materials Testing for High Efficiency Electronics</a></p> </td> </tr> <tr><td valign="top"><p align="left">&nbsp;</p></td></tr> <tr><td valign="top" style="padding-left:10px"> <p align="left"><a href="tech-tips-0211.html">Tech Tips: Soldering Iron Tip Care</a></p> </td> </tr> <tr><td valign="top"><p align="left">&nbsp;</p></td></tr> <tr><td valign="top" style="padding-left:10px"> <p align="left"><a href="manf-corner-0211.html">Manufacturer&rsquo;s Corner: Test Research, Inc.</a></p></td> </tr> <tr><td valign="top"><p align="left">&nbsp;</p></td></tr> <tr><td valign="top" style="padding-left:10px"> <p align="left"><a href="electronic.html">Electronic Packaging for Efficiency</a></p></td> </tr> <tr><td valign="top"><p align="left">&nbsp;</p></td></tr> <tr><td valign="top" style="padding-left:10px"> <p align="left"><a href="http://store.aciusa.org">EMTC Online Registration</a></p></td> </tr> <tr><td valign="top"><p align="left">&nbsp;</p></td></tr> <tr><td valign="top" style="padding-left:10px"> <p align="left"><a href="../html/empfasis/emlcupcoming.pdf" target=_blank>Training Center Course Schedule</a></p></td> </tr> </table> <!--link here--> <br> <br> <hr align="center" size="1"> <br> <a href="http://store.aciusa.org"><img src="http://www.aciusa.org/images/lower-pricing-ad.gif" alt="Discount pricing on IPC training course J-STD-001, 610, 600, 7711, 7712" width="150" height="288" border="1"></a> <a href="http://www.empf.org/empfasis/subscribe.htm"> </a> <p class="style9"><script language="JavaScript"> <!-- function random_imglink(){ var myimages=new Array() myimages[1]="http://www.aciusa.org/wwwaci/html/random/boot.gif" myimages[2]="http://www.aciusa.org/wwwaci/html/random/lead.gif" myimages[3]="http://www.aciusa.org/wwwaci/html/random/help.gif" myimages[4]="http://www.aciusa.org/wwwaci/html/random/service.gif" myimages[5]="http://www.empf.org/empfasis/archive/images/subscribe2.gif" var imagelinks=new Array() imagelinks[1]="http://www.aciusa.org/courses/train_boot.htm" imagelinks[2]="http://www.empf.org/empfasis/leadfree.htm" imagelinks[3]="http://www.empf.org/helpline/helpline.htm" imagelinks[4]="http://www.aciusa.org/ana/ana_home.htm" imagelinks[5]="http://www.empf.org/empfasis/subscribe.htm" var ry=Math.floor(Math.random()*myimages.length) if (ry==0) ry=1 document.write('<a href='+'"'+imagelinks[ry]+'"'+'><img src="'+myimages[ry]+'" border=0></a>') } random_imglink() //--> </script></p> </div></td> </tr> <tr> <td colspan="2"><div align="center"><span class="style5">ACI Technologies Inc.</span><br> One International Plaza<br> Suite 600 <br> Philadelphia, PA 19113 <br> (610) 362-1200 <br> <span class="style6">FAX: </span>(610) 362-1290<br> <span class="style6">HELPLINE: </span>(610) 362-1320<br> <span class="style6">WEBSITE: </span><a href="http://www.empf.org">www.empf.org</a><br> <a href="http://www.aciusa.org">www.aciusa.org</a></div></td> </tr> </table> <p>&nbsp;</p> <p><br> <br> </p> <div align="center"> <p align="center" class="style7">Michael D. Frederickson<br> <strong><em>EMPF Director </em></strong><br> <br> Barry Thaler, PhD.<br> bthaler@aciusa.org <br> <strong><em>Empfasis Technical Editor<br> </em></strong><br> Paul Bratt<br> pbratt@aciusa.org <br> <strong><em>Empfasis Editor</em></strong><br> </p> <p align="center" class="style7"><img src="http://www.empf.org/empfasis/archive/images/iab_sm.gif" alt="IAB" width="100" height="52"><br> <span class="style9">Industrial Advisory Board</span><br> <span class="style14"><em>Gerald R. Aschoff</em>, The Boeing Company<br> <em>Dennis M. Kox</em>, Raytheon<br> <em>Gregory X. Krieger</em>, BAE Systems<br> <em>Edward A. Morris</em>, Lockheed Martin<br> <em>Jane Krueger </em>, Rockwell Collins<br> <em>Gary Kirchner</em>, Honeywell<br> <em>Andrew Paradise</em>, Northrop Grumman<br> <em>Richard Kidwell </em>, ITT Industries</span></p> </div> <p align="center" class="style7"><br> </p> </div> </td> </tr> </table> </div></td> <!-- InstanceBeginEditable name="Body1" --><td width="70%" rowspan="2" valign="top"><div class="body_style" id="body_content"> <p align="center"><img src="images/electronic.gif" alt="title"></p> <p class="body_text"><span class="style20">T</span>he Navy has mandated cost reduction or cost savings for systems slotted for implementation on ships, submarines, and other naval equipment. Through the use of reliable and high efficiency electronics, the volume and weight can be reduced while increasing the power efficiency at a reduced cost to the taxpayer. The goal of the EMPF is to meet the warfighter requirements with innovative electronic manufacturing technologies.</p> <p>Packaging technologies currently on the market offer some unique advantages over the older, larger, and more energy consuming devices on many of the naval platforms. This reflects not only the miniaturization trends of commercial electronics but also incorporates multiple functionalities.</p> <p><b>System in Package (SiP)</b></p> <p>Manufacturing technologies have made significant progress in areas of system in package (SiP) that maintain the same physical footprint of a single chip with equal power and performance, and at a competitive cost.</p> <p>The advantages of SiP are:</p> <ul style="list-style-image: url('images/bullet.gif')"> <li>Combined mixed technologies by integrating several dies into a module such as logic, memory, mixed signals and passives</li> <li>Maximized interaction between the IC, interconnect, and the package</li> </ul> <p>The SiP is able to accomplish this through high density integration - chip on chip technology and chip on substrate technology integrated into a proprietary silicon substrate or laminate. Essentially, SiP acts as a full sub-system enabling a modular architecture. Applications requiring radio frequency (RF) compatibility is an example where the modular approach produces benefits over the single packed IC. The current technology of applying packaged ICs and discrete components directly on the printed wiring board still exhibits the challenges of parasitics and isolation. SiP with integrated passive components and RF ICs, allow for high reactance to resistance ratio (Q) isolation substrates, which means low phase noise, lower power consumption, and excellent isolation, with fewer RF components. The result is a complete RF, baseband, and memory module that can be used in global positioning systems (GPS) and wireless local area network (LAN) cards.</p> <p><b>Integrated Passives</b></p> <p>The application of embedded passives as opposed to discrete components on modular assemblies has the added advantage of reducing the volume and weight. The array of devices can include resistors, inductors, and capacitors. Embedded resistors have the advantage of integrating custom shapes and sizes within the restive layers with values as high as 500 k©. Typically, a nickel chrome alloy is used as the material of choice for embedded resistors. In some cases, a tantalum silicon film is used. With a properly controlled lithographic process, a line width variability of ±2 ¼m can be achieved, giving tighter impedance control capability. Embedded high Q and choke conductors can push up to 200 nH of inductance with tolerances as low as 1%. There are now planar Marchand balun devices that can provide balanced inputs for low noise amplifiers (important for differential RF architecture). High Q metal-insulator-metal (MIM) capacitors can give a capacitance of 0.8 pF to 1600 pF with tolerances below 2%. Though these devices may not fully replace all of the discrete passives needed to achieve the performance criteria of many applications, they do reduce the weight and footprint of the assembly.</p> <p><b>Flip Chip Technology</b></p> <p>Flip chip technology has been around for some time, though its reliability in high stress applications where CTE (coefficient of thermal expansion) can play a major role in flip chip failure has impeded its acceptance as a substitute for wirebonding. With the advent of underfill materials (Figure 6-1), and alternate solder bumping methods of attachment, the prospects of failure due to CTE mismatch have diminished. Additionally, with the reworkable nature of the current underfills on the market, flip chip has become a more appealing option in applications where speed, RF performance, weight, and size are of consideration.</p> <p align="center"><img src="images/fig6-1.gif"></p> <p>The EMPF training center has provided our valued customers important training, design, and packaging services to help them make the right electronic manufacturing decisions possible. For more information on training and engineering services, please contact the EMPF Helpline at 610.362.1320, via email at helpline@empf.org or visit our website at www.empf.org.</p> <p class="body_text"><img src="../../archive/updated/cmeola.gif"></p> </div> </td> <!-- InstanceEndEditable --> </tr> <tr> </tr> </table> <br> <table width="100%" border="0"> <tr> <td colspan="2"><div align="center"> <p><em>The EMPF is a U.S. Navy-sponsored National Electronics Manufacturing Center of Excellence focused on the development,<br> application, and transfer of new electronics manufacturing technology by partnering with industry,<br> academia, and government centers and laboratories in the U.S</em></p> </div></td> </tr> <tr> <td class="footer">ACI Technologies, Inc - - <a href="http://www.aciusa.org">www.aciusa.org</a> - - (610)362-1200</td> <td><div align="right"><a href="http://www.onr.navy.mil/Science-Technology/Directorates/Transition/Manufacturing-ManTech.aspx"><img src="http://www.empf.org/empfasis/archive/images/mantech.gif" width="144" height="42" border="0"></a></div></td> </tr> </table> <div align="right"> <!-- Start of StatCounter Code --> <script type="text/javascript" language="javascript"> var sc_project=350643; var sc_partition=1; </script> <script type="text/javascript" language="javascript" src="http://www.statcounter.com/counter/counter.js"></script> <noscript> <a href="http://www.statcounter.com/free_hit_counter.html" target="_blank"><img src="http://c2.statcounter.com/counter.php?sc_project=350643&amp;amp;java=0" alt="hit counter" border="0"></a> </noscript> <a href="http://www.empf.org/sitemap.htm"><em>[site map] </em></a> <!-- End of StatCounter Code --> <!-- Start of StatCounter Code --> <script type="text/javascript" language="javascript"> var sc_project=1902214; var sc_invisible=1; var sc_partition=17; var sc_security="759b802c"; </script> <script type="text/javascript" language="javascript" src="http://www.statcounter.com/counter/counter.js"></script><noscript><a href="http://www.statcounter.com/" target="_blank"><img src="http://c18.statcounter.com/counter.php?sc_project=1902214&java=0&security=759b802c&invisible=1" alt="website statistics" border="0"></a> </noscript> <!-- End of StatCounter Code --> </div> </body> <!-- InstanceEnd --></html>