Fiber Optic Implementation of Condition Based Maintenance (CBM)
An operational requirement for new ship and carrier construction is automatic monitoring and control of the electrical systems, such as generators, power converters, load centers, and circuit breakers. Present current and voltage sensors are large and heavy, which will result in significant increases in weight and space if legacy sensors are used. One of the EMPF goals is to evaluate fiber optic sensors and related networks to monitor power levels and to provide input to be utilized by a condition based maintenance system. Specifically, this will demonstrate the feasibility of fiber optic technology for use in monitoring the shipboard power conversion module (PCM). [Full Article]

Cable and Wire Harness Assembly Training
At the request of industry, the EMPF is now offering operator proficiency training for IPC/WHMA-A-620. This course provides companies with training in a variety of wire and cable harness assembly topics. The course is divided into 18 sections, and companies can select the modules which best suit their assembly requirements. [Full Article]

Lead Free Hand Soldering
Hand soldering remains an important element of electronics manufacturing. First-piece soldering, rework, and repair
operations are performed using manual soldering irons, as shown in Figure 2-1. With the introduction of lead free solder alloys, operators performing hand soldering will have to become familiar with the differences between tin lead (SnPb) and lead free solders. The lead free soldering process requires more care and patience by the operator. [Full Article]

Ask the EMPF Helpline!
Recently, the Helpline responded to a call concerning residue and contamination on the solder joints of a circuit board. The customer complained of a white residue on the solder joints, but the circuit boards passed ionic cleanliness testing. The EMPF worked with the caller to identify the source of this residue and prevent its recurrence.
Typically, when the Helpline team answers a residue and contamination question, the solution is related to ionic contamination. Ionic contamination can cause corrosion and intermittent short circuits, particularly in fine pitch board designs. Common sources of ionic contamination are flux residue, perspiration, and plating chemistry. Many ionic contamination issues can be resolved by making changes in materials and to the cleaning process. [Full Article]

Tech Tips: Reflow Encapsulating (No-Flow Reflow)
This month’s Tech Tips focuses on some of the dispense parameters and patterns, die placement, reflow profile settings, and storage and handling steps used when processing flip chip (FC) or chip scale packaging (CSP) components with a reflow encapsulant (also known as no-flow reflow). This material combines both tacky flux and underfill, creating a one-step dispensing process. As seen in Figure 4-1 below, 4 of the 7 process steps are eliminated, requiring only a single dispensing step instead of two. In addition, only a single-pass reflow is required, using a standard SnPb profile to solder the eutectic bumps and cure the underfill epoxy. [Full Article]

Optical Current and Voltage Sensors for Busbar-Monitoring of Navy Switchboards
The U.S. Navy has put into motion a series of events which will revolutionize the U.S. Naval Fleet, namely, the introduction of the “all-electric” ship. For this vision to become reality, the electric ship will have all-electric drive and integrated power distribution and conversion systems. An estimate from shipboard designers at Naval Surface Warfare Center Carderock Division, Philadelphia, indicates that these ships could require at least 10,000 current sensors per ship to properly monitor and regulate electrical power flow. This simply is not achievable with conventional wire-wound toroidal or Hall-effect transducers due to weight, size, and safety limitations. [Full Article]

Manufacturers’ Corner: APE Rework Stations
At the EMPF, the potential rework of an expensive PCB assembly or component is carefully considered. For SMT production, specific attention is paid to board mass and area, so that the proper heating cycle and times can be reasonably estimated for proper solder joint formation over the entire area of the circuit board. [Full Article]

Upcoming EMLC Courses
Check out up coming courses available from the EMPF.