Electronics Manufacturing Boot Camp courses are designed to provide students with the knowledge and the understanding of all the steps involved in the manufacturing of electronic assemblies. This program is ideal for those in the electronics manufacturing industry that need a thorough understanding of through-hole surface mounted electronic assemblies, and all the processes involved in the manufacturing of these technologies. The classroom lectures are reinforced during the unique hands-on lab exercises in which students have the opportunity to utilize state-of-the-art electronic manufacturing equipment to build an electronic assembly. The core curriculum consists of 40% in-class lecture accompanied by 60% hands-on laboratory experimentation. Participants will acquire a clear understanding of the many steps involved in electronic assembly process. The primary areas of focus covered in the two week program are discussed below.

Boot Camp teaches students the basics of circuit board fabrication and general considerations in the Design For Manufacturability (DFM) module. Students are introduced to the applicable industry specifications currently used in various circuit board designs. Future design considerations such as flip-chip, chip on board, wire bonding, micro-vias, and component embedding are discussed as well. Students gain an important and basic understanding of proper circuit design. This enables them to improve current or future designs, and to reduce the amount of wasted time.

The Bare Board Fabrication module teaches students the specific details of board fabrication. Students learn about the variety of board materials commonly used in today's industry, the different chemical processes used during fabrication, the solder resist application, and drilling processes. The lecture is enhanced by an excursion to a nearby bare board fabricator. Here students have the opportunity to ask questions, and to witness many of the in-process steps as they are being performed.

The Component ID module introduces students to the commonly used components in manufacturing. Component marking, polarity, and orientation are just a few of the lessons taught.

The Materials module addresses the common materials used in industry such as adhesives, solder paste, flux, and solder. Students learn the different classifications and test methods related to some of the more commonly used materials.
In the Inspection/Specifications and Standards module, students are introduced to industry consensus specifications IPC-A-610C and J-STD-001C. They discover how these documents relate to inspection and process control methods. Students also receive a copy of IPC J-STD-001C to be used for future reference.

The importance, understanding, and need to control ESD (Electrostatic Discharge) is demonstrated using some of the more commonly used ESD test equipment. Students will witness the emission of damaging, electrostatic charges from sources commonly found at workstations.

The Design of Experiment module promotes the need for modern methods of experimentation. Lectures are coupled with hands-on laboratory sessions in which students conduct simplified experiments. Students gain the ability to identify areas of opportunity within processes for the use of designed experimentation. They will plan and organize experiments, select appropriate designs for various scenarios, conduct the analysis of those designs, and draw conclusions while confirming their results.

Students are provided with an opportunity to acquire hands-on experience using state-of-the-art manufacturing equipment in the demonstration factory. With this equipment, students will build their own electronic assemblies. This will entail dispensing solder paste, printing, and using component placement equipment, along with thermal profiling, reflow, and wave soldering machines.

In addition to learning about the automated processes, students spend one day in a hand soldering and rework lab. These exercises unify many key points learned throughout the lecture, and instill a clear understanding of the lessons presented.

The Process Control Tools module presents the unique devices used to ascertain the effectiveness of x-ray equipment, inspection equipment, and PCB test systems.

In the Reliability module, students learn the long-term effects these conditions can have. The identification of Surface Mount Technology (SMT) packaging reliability issues, failure mechanisms of SMT packaging, and the introduction of reliability testing equipment methods and models are taught.

In the Cleanliness Testing module, some other areas of focus include the proper cleaning of assemblies, cleanliness testing, and the use of no-clean fluxes. Various cleaning methods and common test methods are presented in class, and precede demonstrations of the frequently used equipment in today's manufacturing facilities. Mechanical and thermal stress, corrosion, and contamination all have a major impact on electronic assemblies.

Who Should Attend?
BOOT CAMP is beneficial to many in the workforce. Design engineers, new hires, technical sales representatives, process engineers, and technicians can greatly benefit from the lessons taught. BOOT CAMP is designed to provide electronics manufacturing personnel with two weeks of intense, hands-on training in every aspect of electronics manufacturing. Upon successful completion, students are able to demonstrate a working knowledge of the electronics manufacturing process.

How to Register
For more information and details on registration, please contact the EMLC Registrar by phone (610-362-1320) or e-mail (registrar@empf.org). Electronics Manufacturing BOOTCAMPS are scheduled for February 2-6, 9-13, May 10-14, 17-21, July 26-30, August 2-6, and October 4-8, 11-15. Please also see the entire class schedule on the last page of this publication for additional classes at the EMPF Learning Center.