Ion Chromatography:
The EMPF performs ion chromatography (IC) analysis on electronic assemblies. This technique is used to measure cleanliness of assemblies, components, and bare board with precision. IC can determine the precise amount of F, Cl, Br, NO2, NO3, PO4, and SO4, down to 0.5 mg/cm2. A common test method employed by the EMPF is the IPC TM-650 2.3.28. The EMPFhas analyzed thousands of assemblies, components, and bare boards using this technique.


Resistivity of Solvent Extract (ROSE):
The EMPF performs Resistivity of Solvent Extract (ROSE) analysis on electronics assemblies. This technique is used to measure the cleanliness of assemblies, components, and bare boards. Bulk ionics are measured according to their conductivity in solution and referenced to a sodium chloride standard. A common test method employed by the EMPF is the IPC TM-650 2.3.25. The EMPF has analyzed thousand of assemblies, components and bare boards using this technique.

Fourier-Transform Infrared (FT-IR) Spectroscopy:
The EMPF performs FT-IR spectroscopy on a variety of sample types using both transmission and reflective modes as well as FT-IR microscopy on a routine basis. This technique is an excellent tool for examining organic materials such as adhesives, polymers, plastics, etc. The EMPF can obtain FT-IR spectra on surfaces, powders, liquids, and semi-solids. Common test methods include IPC TM-650 2.3.39B and ASTM methods. The spectra that are generated can then be analyzed against thousands of compounds in our spectral database and commercial spectral databases. This library search can be used to identify the compound being sampled.

Ultraviolet-Visible (UV-Vis) Spectroscopy:
The EMPF performs both transmission as well as reflective UV-Vis spectroscopy on liquids and surfaces. UV-Vis spectroscopy is a technique that measures the amount of UV-Vis light absorbed by the sample of interest. Our spectrometer can operate from 230 - 1100 nm and is calibrated against a NIST traceable white reference standard. The EMPF has developed UV-Vis chemometric techniques that are applicable to the electronics and aerospace industries.

Sequential Electrochemical Reduction Analysis (SERA):
The EMPF has the equipment to analyze the surface oxides and sulfides on metals using sequential electrochemical reduction analysis (SERA). Any metal oxides or sulfides that are present on the surface can be identified and a thickness determined (within 50 angstroms). This technique can be used to identify and differentiate between SnO, SnO2, Cu2O, CuO2, CuxSnyOz, Ag2S, etc. The EMPF participated in the development of this technology and continues to employ this technology in failure analysis and surface analysis.

Reduced Oxide Solderability Activation (ROSA):
The EMPF has a process available that removes any metal oxides that may be contaminating a surface, Reduced Oxide Solderability Activation (ROSA). This technique was developed to remove the oxides and sulfides that inhibit solderability such as, tin (II), tin (IV), copper (I), copper (IV), and silver oxides and sulfides. The process is electrochemical and takes place in an aqueous solution. The process is rapid, a typical treatment takes less than one minute. The samples are rinsed in deionized water and are immediately available for processing. The EMPF has reconditioned thousands of components and printed wire boards that have been used in assembly of various military and commercial systems.

Wetting Balance Testing:
Solderability is vital to producing quality electronic assemblies. The EMPF performs quantitative solderability testing as well as qualitative dip-and-look tests. The tests can be performed on leaded components, chip components, wires, and coupons, with the results compared to established evaluation standards such as the J-STD 002 and 003, as well as IEC-68-2-69 among others.

Optical Microscopy:
Optical microscopy at the EMPF is often coupled with digital imaging and analysis. ACI performs such tasks as dimensioning, annotation, archiving, and standardized inspections (e.g. IPC, MIL spec, and JEDEC). The EMPF specializes in bright field illumination and metallic contrast imaging using an inverted stage metallograph. Using various forms of optical microscopy, the EMPF examines components, circuit boards, solder, material microstructure, contamination, defects and anomalies, and other electronic materials at 2 to 1500 times magnification.

Metallurgy:
Using SEM, EDS, optical microcopy, and SERA, EMPF engineers investigate many of the metallurgical issues involved in electronics packaging. Metallurgy is used to study diffusion, intermetallic formation and growth, contamination, morphology, thermodynamics, and kinetics involving a number of electronics related metals, ceramics, composites, and semiconductors. This information can be used to study failure modes.

For additional information or to request a quotation for any ACI service, please contact our HELPLINE at (610) 362-1320 or E-mail us helpline@empf.org.