Within the past year, nearly 1500 calls were received through the EMPF Helpline with topics ranging from training to coatings, as well as issues related to assembly and cleaning processes, component solderability, and materials. Figure 4-1 shows the breakdown of the calls by category.

The EMPF Helpline saw an increase in calls regarding training and operator certification services, comprising 41.6% of the total Helpline calls received during the past year. This was likely a result of companies adopting a quality system for their manufacturing processes. Assembly and rework standards, such as the criteria established by IPC, have forced organizations to certify their operators, inspectors, and rework technicians. In addition, companies that have conducted their own training and certification programs in the past are being forced to reduce these programs in an effort to reduce overhead costs. As an end result, businesses have begun outsourcing the training required to meet the needs of their quality systems.

The remaining 58.4% of the calls were related to manufacturing, test, or technology issues. Test and evaluation services offered by the EMPF made up nearly 17% of the total calls received this year, resulting in EMPF-performed services such as failure analysis, spectroscopy, and reliability testing. Some of the most common evaluations involved the investigation of chip components and through-hole solder joints. These investigations often included scanning electron microscopy (SEM) and microsectioning. In addition, other services that were performed at the EMPF were more diverse in scope, involving issues ranging from substrate delamination to solder joint fractures to component failures at the die level.

Reflow profiling and the transition to advanced packaged components led to nearly 16% of the calls related to the assembly process. Many manufacturers new to Ball Grid Array (BGA), Chip Scale Packaging (CSP), and Flip Chip manufacturing had issues establishing their time and temperature profiles. This led to common defects such as voiding, insufficient reflow, and inconsistent ball-to-pad connections. Many of these problems were discovered for customers at the EMPF using state-of-the-art X-ray transmission and endoscopic inspection technology. Profiling suggestions were then made by the EMPF’s experienced manufacturing engineers and, in many cases, repaired using the latest in rework equipment.

Cleaning process issues comprised 6% of all calls. A number of automobile and aerospace electronics manufacturers contacted the EMPF Helpline to solve contamination and corrosion problems. Techniques such as scanning electron microscopy (SEM), Fourier transform infrared spectroscopy (FTIR), ion chromatography (IC), and energy dispersive spectroscopy (EDS) were used to identify the contamination on assemblies, bare boards, components, and conformal coatings. Corrosion and contamination found during these investigations have been shown to have devastating effects on the reliability of their assemblies, causing field failures and returns. This in turn has compromised the reputation and profitability of the companies involved.

The EMPF Helpline offers to the electronics manufacturing community a no-cost initial consultation with our manufacturing specialists, which often results in a quick solution or recommended course of action. If a more detailed service is required, the Helpline specialists will guide you through the process to reach a cost-competitive solution to your problem. Whether you have a complex failure or a common electronics manufacturing defect, please call the Helpline at (610) 362-1320. You can also send e-mail to helpline@aciusa.org or visit us at our website at www.empf.org and click on the “Helpline” link. Here you will find many of the common industry questions being asked, as well as monthly case histories. The Helpline is open for calls Monday through Friday from 7:30 a.m. to 5:30 p.m., EST