Due to the increasing popularity of lead-free finishes, the EMPF is now offering the IPC-7711/7721 Rework, Repair, and Modification Training and Certification Program using both lead and lead-free printed circuit assemblies. The addition of a lead-free printed circuit assembly will accommodate companies that have converted to the use of lead-free alloys. The workmanship kits used in the course contain two fully-populated, mixed-technology board assemblies, one with a HASL finish, and the other with an ENIG finish.

The IPC-7711/7721 Application Specialist course consists of nine modules, covering the most commonly used procedures for board restoration. The modular approach to workforce training allows companies to select the appropriate amount of training for each individual employee.

The first module is a prerequisite for the rest of the course modules. In Module One, students learn how to interpret the procedures in terms of skill level, level of conformance, and product classification. This module also teaches students the basic considerations used to analyze rework and repair, tool and material considerations, auxiliary and primary heating methods, proper handling techniques (including basic ESD precautions), and basic cleaning procedures used in IPC-7711/7721. Students are required to pass a 20-question, open book exam with a minimum score of 70 percent.

Module Two of IPC-7711 covers the four most commonly used splicing procedures: mesh, wrap, hook, and lap. Students are required to demonstrate each of these procedures using both lead and lead-free solders.

During the remainder of the IPC-7711 Rework portion of the course, students learn how to correctly adjust preheat and reflow temperatures to avoid damage of both the circuit boards and the components. Demonstration of proficiency includes removal of a variety of through-hole and surface mount devices, including 16-leaded DIPs, and 20-mil pitch quad flat pacs. During the course, students are required to remove over 50 components from two PCBs. Once the boards are component-free and all pad areas and plated through-holes are cleaned up and free of solder, students are required to replace a variety of each component type. Students must assess their boards for damage using the acceptability criteria based on IPC-A-610.

The following modules can be selected for training in IPC-7711:

Module 2: Wire Splicing (5 hours)
Module 3: Through-Hole Technology (7 hours)
Module 4: Chips and MELFs (6 hours)
Module 5: SOIC and SOTs (6 hours)
Module 6: J-Lead and Gull Wing (8 hours)

During the IPC-7721 repair section, students must demonstrate proficiency in the replacement of traces, eyelets, and pads and in the installation of jumper wires. Another section of the repair course covers the replacement of laminate materials. Students will learn how to replace damaged laminate using the epoxy fill method.

Conformal coating removal methods are included in IPC-7721 Repair Procedures. Participants learn how to correctly identify various conformal coatings, learn the preferred methods of removal for each type, and demonstrate proficiency using various removal techniques. The following modules can be selected for training in IPC-7721:

Module 7: PWB Circuit Repair (8 hours)
Module 8: Laminate Repair (6 hours)
Module 9: Conformal Coating (5 hours)

This course is ideal for individuals who possess strong reasoning capabilities and above average soldering skills. Successful training in rework and repair operation can usually be accomplished after 3 to 10 days of training. The entire IPC-7711/7721 course can be completed in nine days by personnel with above-average soldering skills.

The addition of the lead-free assembly will enable all types of manufacturers to obtain the necessary training for their workforce. With the 2006 lead-free implementation deadlines fast approaching, rework operators need to be properly trained for lead-free rework. Please contact the EMPF registrar at (610) 362-1320 for more details.