ACI has undertaken a Navy ManTech program to develop a highly manufacturable Power Amplifier Interface (PAI) unit for the Link-16 terminal. The PAI unit will incorporate state-of- the-art technology while fulfilling the low cost requirements.

ACI will focus on key electronics manufacturing issues resulting in the cost reduction / technology upgrade of an essential military communication system. The knowledge gained from this project will also be transferred to industry, and government agencies in support of the U.S. Navy's Manufacturing Technology (ManTech) Program at the National Electronics Manufacturing Center of Excellence, the EMPF.

Link-16 is a data and communications and navigation system that significantly enhances the platform's survivability and lethality, and is designed to meet the most stringent requirements of modern combat by providing reliable situational awareness (SA) for fast moving forces. Link-16 compatible hardware has a definitive impact on major Navy weapon systems (i.e., F/A-18, EA-6B, P-3C, S-3, Ships, E/F-18) and future Naval capabilities. Link-16 systems are extremely sophisticated radio terminals. Their unique mix of capabilities in voice, data communications, real time navigation, self-identification, totally distributed network operations and super-high resistance to self interference jamming or enemy jamming, all in hardware that meets military performance requirements, represents a significant challenge to industry.

This project proposes to re-partition, re-layout, and repackage the 200 Watt PAI portion of the Link-16 Terminal Multifunction Information Distribution System, that is currently employed on F/A-18 and F-16 platforms, to reduce cost and position the equipment for inclusion in smaller size terminals. MIDS LVT, jointly developed by the U. S. Government and Industry, is among the second generation of Link-16 hardware. MIDS is compatible with first generation terminals known as Joint Tactical Information Distribution System (JTIDS). The purpose of the proposed PAI affordabilities work is: to use industry state-of-the-art technologies in circuit boards, semiconductor packaging, heat-transfer, and to incorportate new technologies (including Wide Band Gap (WBG) semiconductor devices) that enable low/no tune strategies to enhance the producibility and significantly reduce the cost of the PAI. Additionally, the purpose of this work is to demonstrate transferability of this PAI into smaller form factors.

ACI's set technical tasks include:

1. Perform Technology Assessments of the following areas to ensure that the redesign incorporates the latest "state-of-the-art" technology with knowledgeable decisions made in cost/performance tradeoffs:

• WBG high power semiconductor devices (SiC being the leading candidate). ACI arranged and participated in technical exchange meetings between WBG device suppliers and the MIDS LVT PAI power amplifier design engineers.
• Semiconductor packaging and level 2 interconnects with emphasis on modular construction of standardized designs.
• Thermal modeling and finite element analysis of components, subassemblies & modules, and the complete MIDS PAI unit. Theoretical calculations, FEA modeling, and empirical experimental results are the three techniques that are planned..
• Organic materials applicable for use in the PAI unit including conformal coatings, conductive adhesives, under-fills, and encapsulates.
• Small signal electronics: digital, analog, FPGA's, ASIC's, etc.
• Mechanical assembly and fabrication techniques
• Process analysis of the testing and tuning adjustments required during the manufacturing cycle.

2. Fabrication and evaluation of "test vehicles" to validate the designs and processes developed for the redesigned PAI unit. ACI will manufacture and test components, materials, subassemblies / modules, and manufacturing processes that result from the early design concepts.

3. Do a Technology Transfer of the "lessons learned" on this project (exclusive of any detailed subcontractor proprietary information) for the benefit of other Navy / military programs and the electronics manufacturing community in general.

Upon completion of this project, the US Navy will have a new affordable, miniaturized PAI, validated through independent testing by ACI, and the EMPF (Navy Center Of Excellence for Electronics), and ready to be qualified for use in current and future MIDS terminals. Additionally, this PAI will be size-positioned for new smaller terminals which will better fit disadvantaged users such as UCAV, patrol boats, armored vehicles, and rotary platforms. The MIDS IPO is currently asking industry to study options for size reduction of Link-16 terminals as part of their "MIDS Migration to JTRS" program.

This program will also be among the first implementations of WBG semiconductor technology. The advantages of using WBG technology include:

• Advanced interconnect technologies for RF devices.
• Major cost reduction by enabling no/low tune manufacturing process.
• Miniaturization, permitting use of the PAI on volume- limited weapons such as missiles and torpedoes.
• Creation of a critical insertion path for inclusion of Link-16 capabilities into other Navy programs.

Additionally, all US Government equipment programs will benefit from the semiconductor, packaging, and manufacturing technology that is being advanced and transferred across industry. Specifically, MDA programs desiring the use of WBG semiconductors will benefit by an earlier implementation of this technology for various communication and RADAR architectures. ACI will promulgate industry standardization of modular and WBG packaging methods based on lessons learned during execution of the program. This effort will include evaluation of various methodologies to mitigate the thermal challenges that accompany WBG devices.