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| A publication of the National Electronics Manufacturing Center of Excellence | January 2005 |
1. Solder recovery. The greatest cost savings can be gained through the use of a solder recovery system. As much as 75 percent of the solder bath (depending on pump design) can oxidize over time to become dross, the main component of which is pure solder. Manufacturers can process their own dross and reap the financial benefits in the form of reduced solder expenditures. With every dollar counting, this money-saving procedure 2. Lead free process control. One of the major contributors to defects, such as bridging, icicling, and insufficient topside fillets, is poor heating of the printed circuit board (PCB) assembly during the preheat stage. Too much heat is just as bad as too little, a fact that is especially true in a lead free process. In fact, preheating must be more exact in lead free applications simply because of the higher temperatures involved. Some lead free solders will require melting temperatures near 700°F. In contrast, the most energy-efficient method to heat a PCB is by using low-watt-density black-body IR heating strips. These IR units emit long IR wavelengths that are easily absorbed by the board. Hence, the Delta T between the heat source and the board is much lower than that produced by lamps, tubes, etc. Black-bodied IR radiant emitters direct heat at the PCB with absorption rates as high as 85 percent. 4. Preheater design. Most wave soldering machines offer a variety of preheater configurations. The optimum design for a preheating system should include more than one type of heater – e.g., a system that includes black-body IR heating strips on the bottom, coupled with forced-air convection from above. Another contributing factor to heating the board evenly and gradually is the physical design of the preheater. For example, if there are gaps between the end of the preheater and the beginning of the wave, cooling will occur. Similarly, the distance between the board and the heat source as it travels on the conveyor can play a role in how the board is heated. Ideally, the board should get closer to the heat source as it approaches the wave. In addition, because lead free solder will be at a higher temperature together with the PCB upon entering the wave bath, the most efficient preheating system should minimize defects and the cost of repair and replacement, while yielding longer production runs to meet quantity goals. |
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A different alloy in every pot Besides the financial benefits, there are other reasons for not using lead free solder exclusively. It does not wet as well as tin lead and yields a duller surface finish. This may cause a higher percentage of good boards to be rated as defective, increasing rework time using current pass/fail criteria. Controlling parameters As new, lead free processes continue to evolve, wave soldering machines are adapting to the new parameter requirements. While economic resources are tight for most companies, wave soldering continues to be an efficient and cost-effective tool for production.
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| The American Competitiveness Institute - - www.aciusa.org - - (610)362-1200 |