- Tin Whiskers and the Impending RoHS Conversion to Lead-Free
As a part of the Lead-Free Manufacturing for Navy Systems project, the EMPF is evaluating the impact of tin whiskers on the long-term reliability and manufacturability of DoD electronics. The current, universally used tin-lead component finishes do not meet the lead (Pb) limits imposed by the Restriction of Hazardous Substances (RoHS) directive, and the July 1, 2006 compliance deadline is fast approaching. As a result, many electronic component manufacturers have chosen to switch to pure tin or one of two tin alloys – SnBi (tin bismuth) or SnCu (tin copper). However, historically, tin electroplated finishes have proven unreliable. They are cited in many well documented system failures. [Full Article]
- Failure Analysis and Reliability Testing
The continuous miniaturization of components and increasing board complexity make it crucial to understand which techniques and equipment provide the resolution required for accurate analysis. To address this need, the EMPF Training Center offers a Failure Analysis and Reliability Testing course, which addresses the most prevalent electronic component, manufacturing, and packaging issues. The course includes updated information on lead-free solder, RF plasma etching, and micro-probing of integrated circuits. Participants will be taught the techniques necessary to make informed decisions when troubleshooting an electronics manufacturing problem. They will gain the knowledge necessary to understand and work within an analytical or failure analysis lab. [Full Article]
- Ball Grid Array Inspection Equipment
As ball grid array (BGA) manufacturing grows in popularity, replacing many gull wing fine-pitch packaged components, the demand increases for inspection equipment which can verify and maintain solder joint integrity in BGA devices. This adds a step to the inspection process and increases manufacturing costs.[Full Article]
- Ask the EMPF Helpline!
A customer called the EMPF Helpline with questions regarding electrical shorts on a component. The component was experiencing check sum errors and was needed for a high-performance product for military and aerospace applications.. [Full Article]
- Tech Tips... Ball Grid Array Optical Inspection
There are several types of Ball Grid Array (BGA) inspection systems on the market today. These Tech Tips are for optical inspection systems which use endoscope or bore-scope technologies with a backlighting system. These systems use an adjustable magnification collar which allows a technician to focus on a joint that is located a few rows into the BGA.[Full Article]
- Condition Based Maintenance for CVN-21 and DD(X)
In the near future, the U.S. Navy plans to construct the next generation of aircraft carriers and destroyers – the CVN-21 and DD(X) classes, respectively. Construction of the CVN-21 class is slated to begin in 2007. This class of aircraft carriers will use the basic hull design of the USS Nimitz-class carriers, but the similarities end there. The DD(X) class remains in the design phase and will be unlike any other surface combatant vessel at sea today, utilizing new revolutionary composite materials and integrated power systems. These vessels will have the newest, state-of-the-art power and electronics systems, incorporating the latest features – electromagnetic catapults, permanent magnet motors, advanced induction motors, new solid-state power electronic transformers, and stealth features that reduce radar and electromagnetic signatures. The Navy believes that with the advent of modern electrical equipment and systems, along with extensive automation technologies, they will be able to significantly reduce the total construction costs and manpower requirements to run and maintain these vessels. [Full Article]
- Manufacturer's Corner: Lead-Free Soldering with Pace TW-50 and NF500
Because lead-free solders do not behave or look like their lead-containing counterparts, individual PCB assemblers will need to address several issues related to hand soldering and rework.
[Full Article]
- Upcoming EMLC Courses
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Empfasis is a publication of the American
Competitiveness Institute and the EMPF. The EMPF is the U.S. Navy’s
National Center of Excellence dedicated to advancing the state-of-the-art
in electronics and increasing domestic productivity in electronics manufacturing.
Our efforts in the field of electronics manufacturing, analytical services,
and our work with government and industry, yield the knowledge that we present
to you here.
