- Cost Reduction of IMUs for Precision Guided Weapons
Recent conflicts have demonstrated the decisive role of precision guided weapons in modern warfare. With their improved accuracy over conventional weapon systems, PGMs increase the percentage of enemy targets being destroyed, while reducing collateral damage. Therefore, guided munitions are currently the weapon of choice, and ongoing DOD projects are aimed at developing a new generation of smaller weapons having improved accuracy. [Full Article]
- Revision D for IPC-A-610 and IPC J-STD-001
The long awaited release of Rev D for IPC-A-610 and IPC J-STD-001 happened in February 2005 at the APEX Convention in Anaheim, CA. The IPC Committees have engaged in an effort to create better documents for the benefit of the entire electronics manufacturing industry. There is now full coverage for lead free connections and several new SMT termination styles. Along with the new specification revisions, IPC course materials for Instructor and Specialist training have been updated. This article addresses some some of the commonly asked questions received by the EMPF Helpline. [Full Article]
- Drop Testing of the AN.PRC-112D Rechargeable Battery Pack
Environmental testing is important for devices deployed in a hostile environment. Some typical environmental tests consist of immersion, drop, shock, vibration. Drop testing can be an important test to characterize the durability of a device.[Full Article]
- Ask the EMPF Helpline!
Background: A customer requested a stain on their PWB (Figure 1) be identified in order to establish what detriment it would be to the final assembly. The customer stated that the SMT step was being sub-contracted out and had actually taken place without issue. [Full Article]
- Survey on High-G Testing Methodology
The EMPF recently conducted a survey on High-G testing methodology. This survey was part of an ongoing program to improve the manufacturing of Inertial Measurement Units (IMUs) that incorporate MEMS sensors. This survey gathered information covering two areas: 1) High-G (~15,000g's) packaging and/or high-G electronics issues and needs, and 2) long term storage testing methods. The High-G testing methodology survey investigated 7 test methods. From the responders, the five most common test approaches were rail gun, air gun, drop test, centrifuge test and pneumatic shock test. The remaining 2 tests in the survey were live fire and "others". [Full Article]
- Tech Tips... Cable Assemblies: Insulation Displacement Connections
This month's Tech Tips focuses on Flat Ribbon Cables which are also know as Insulation Displacement Connections (IDCs).[Full Article]
- Manufacturer's Corner: Phoenix X-Ray
Achieving consistency in the process of visually inspecting SMT board assemblies can be problematic. Many of the manual inspection tools in use (magnifiers, eye loupes, etc.) do not facilitate consistency as an individual or group of inspectors moves from board to board. To address this challenge, the EMPF uses the I Systems SMD-3D semi-automatic inspection system. It is primarily used in the Demonstration Factory for solder paste inspection and verification. It is also utilized in Boot Camp training, BGA Rework and Repair, and Advanced Packaging classes to illustrate the necessity of 3D inspection systems.
[Full Article]
- Upcoming EMLC Courses
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Empfasis is a publication of the American
Competitiveness Institute and the EMPF. The EMPF is the U.S. Navy’s
National Center of Excellence dedicated to advancing the state-of-the-art
in electronics and increasing domestic productivity in electronics manufacturing.
Our efforts in the field of electronics manufacturing, analytical services,
and our work with government and industry, yield the knowledge that we present
to you here.
