The EMPF Training Center provides a wide range of skill- based certifications related to the manufacturing of electronics. With the IPC expanding their offerings on a regular basis, the EMPF is keeping pace by adjusting their course offerings to meet the needs of the manufacturing community.

The IPC-7711 and IPC-7721 Certified IPC Specialist (CIS) program has, for all practical purposes, superseded the EMPF SMT Rework Skills Certification Program. However, achieving CIS status requires nearly a week and a half of training. Most companies cannot afford to give-up a key technician for two weeks. Fortunately, it is possible to achieve certification in steps, as CIS status can be granted module by module. Figure 2-1 shows some of the learning materials utilized in the course.

The EMPF Training Center has added a number of new courses to take advantage of the IPC’s modular format. Offerings are structured to provide two, three or five day sessions.

Companies that are manufacturing or servicing products that use Through Hole Technology (THT) may be time limited for extended off-site training. One of the course offerings is designed to provide IPC CIS for IPC-7711 Rework of Electronic Assemblies applied to THT. This brief experience at the EMPF introduces the IPC-7711 procedures for removing and replacing electronic components on Printed Circuit Board Assemblies where leads pass through holes in the board.

Students learn how to use the standard properly, how to identify which procedures most closely conform to original process results, and what procedures are applicable to rigid printed boards, flexible printed boards, discrete wiring boards and ceramic boards. Students are assisted in determining the skill level recommended for success with the procedures, proper workstations, inspection aids, lighting, as well as heating methods. Students are taught the requirements for handling electronic assemblies and cleaning electronic assemblies, which are common to all rework and repair procedures. Finally, students receive careful instruction and supervised hands-on experience removing and installing various types of THT components using several different techniques.

Students demonstrating appropriate proficiency, as defined by the IPC, are awarded CIS certificates as objective evidence of their acquired knowledge and skill.

Companies that are manufacturing or servicing products employing SMT (Surface Mount Technology) may select a three-day course. The Training Center staff has selected modules that allow students to learn a variety of procedures applicable to the rework of leadless and leaded SMT packages. The program covers procedures that are common to all rework and then focuses on specific SMT components, discrete chip capacitors and resistors, MELFs, J-Lead devices, and Ribbon Lead QFPs.

The EMPF offers a five-day program that covers both THT and SMT Rework. This program offers students a higher level of hands on experience. This program is better suited to students with limited soldering experience. The Training Center has also scheduled a two day session for anyone interested in CIS for Printed Wire Board (PWB) Circuit Repair. There is also a program that combines SMT rework and PWB Circuit Repair.

All of these course offerings can be found on the Training Center calendar. Currently under consideration is the combining of modules across standards. CIS training modules could be combined from the J-STD-001, IPC-A-620 and IPC-7711/21. Modules from these programs could be configured to provide nearly limitless options. Two other possibilities could be CIS for quality auditors in the electronics industry or rework of conformal coating.

Please contact the Training Center through the EMPF Helpline or the Registrar to discuss your unique needs.