The Naval Research Laboratory (NRL) developed a new thermal management material technology which employs graphite fibers as a heat conductor. The NRL has shown that their Novel Cooling Technology (NCT) can conduct heat from heat sources more efficiently than conventional methods. The NRL, using an H-60 Helicopter Transformer Rectifier Unit (TRU) as a demonstration vehicle, proved that by weaving carbon sheets into the transformer windings, it was possible to remove excessive heat from the transformer. The new TRU assembly experienced a 30% weight reduction while maintaining 5Kw output power, which was required for this application.
The EMPF is considering applying NCT, and other thermal management materials, as a replacement for the thermal grease used in the PCM units. If successful in the PCM application, this technology will improve the thermal management and maintainability of PCM units in the field, where operators would have to apply new layers of thermal grease when maintenance is performed on specific units.
A concept being developed will integrate the quick disconnect fixtures, the new thermal management materials, and the graphite cold plate with the Insulated Gate Bipolar Transistors (IGBT) housing assembly. This concept will reduce the size of the IGBT housing assembly while improving its producibility and thermal management. An additional advantage will be its modularity, which will make the PCM units easier to manufacture in production and maintain in the field.
2) Fiber Optics/ Condition Based Maintenance:
The EMPF will evaluate fiber optic sensors and related networks to monitor power levels and to provide input to be utilized by a condition based maintenance system. This condition based maintenance system effort is a key element of Phase II. The thrust of the fiber optics effort will be to identify best methods used for implementation within the electric generation and distribution system of a ship.
The initial phase of the fiber optics task will focus on specification development and system design. The EMPF will concentrate their efforts on the fiber optic and sensor packaging. PCM parameters to be measured include temperature, input and output voltage, input and output current, unit resistance, transformer inductance, and output power. Optical current and voltage sensors are commercially available, and will be employed as part of the hardware monitoring strategy. The second part will involve the production and testing of a prototype system to demonstrate the feasibility of the use of fiber optic sensors in monitoring ship board power distribution unit performance.
The fiber optic condition based maintenance system will be integrated into the Navy’s Integrated Mission Support System (IMSS) and Automated Maintenance Environment System (AME). These systems have been developed, demonstrated, and deployed by the Navy.
3) Cabinet Manufacturing Analysis:
The goal of this task is to improve the producibility of PCM cabinets. A major cost driver is the cabinet design. REPTILE Phase I Manufacturing and Standards activities proved that applying a frame and partition cabinet design concept could reduce PCM cabinet manufacturing costs. The EMPF will incorporate the frame and partition concept into the new PCM unit cabinet design. Working with the 901D Company, with inputs from the PCM manufacturers, a cabinet will be developed to perform MIL-STD 901D shock testing (barge test). Components and sub-assemblies identified by the various PCM manufacturers and NSWC-Philadelphia will be tested depending upon availability. The EMPF will work with the 901D Company to design and test a small-scale cabinet.
The EMPF will review and analyze high cost components (inductors, transformers, etc), with the goal being to develop a universal mounting fixture. The EMPF will review the cold plate design for the drawer and quick disconnect/flexible hose for 901D barge test. Failure analysis of failed components from the PCM manufacturers and NSWC-Philadelphia will be performed on an as needed basis.
4) Wide Band Gap Technology:
Wide Band Gap (WBG) technology offers unique opportunities for high power applications. WBG semiconductor devices operate safely at higher temperatures, frequencies and voltages than current devices. The EMPF’s goal is to determine the best method to integrate WBG high power devices into current PCM units.
The EMPF will assess the availability of WBG power devices. WBG component manufacturers and industrial consortiums will be consulted. The output of this will be a roadmap of WBG high power devices. In parallel, the EMPF will identify high power applications and requirements from NSWC-Philadelphia and the PCM manufacturers.
Upon completion, high power WBG devices will be obtained for a demonstration test. This test will verify the capabilities of WBG devices in naval high power applications. A suitable demonstration vehicle will be developed. Testing will be tentatively performed at the high power test facility developed by the REPTILE Phase I Program at NSWC-Philadelphia.
Future Naval High Power Application Activities
The EMPF will continue to use the REPTILE Program as the vehicle to introduce advanced electronic packaging and advanced electronics manufacturing concepts to naval high power electronics. Two examples of future naval high power applications under consideration are explained below:
1) Electronic Packaging:
The EMPF has improved the packaging of the Emitter Turn-Off (ETO) device previously mentioned. The EMPF plans to leverage the packaging insights from the ETO to repackage the Insulated Gate Bipolar Transistors (IGBTs) used in the PCM units. A potential goal will be to introduce these new packaging schemes into the current PCM units.
2) Lead Free Soldering:
The EMPF plans to investigate the effects Lead Free solders have on high power devices. The European Union’s WEEE and RoHS directives require hardware to be Lead Free by July 1, 2006. Commercial components manufacturers are beginning to convert their production lines from tin-lead (SnPb) finishes to Lead Free finishes. However, there has been minimum investigation into performance of Lead Free solders and finishes when introduced into high power applications. The EMPF will investigate whether use of Lead Free solders and finishes in high power applications represents a risk to hardware reliability.
REPTILE represents the EMPF’s introduction of advanced manufacturing technologies into high power naval applications. REPTILE Phase I identified material costs reductions, hardware design improvements, and completed design requirements for specific applications. REPTILE Phase II continues power electronics technical investigative efforts for naval applications in thermal management, fiber optics and condition based maintenance, cabinet manufacturing processes, and Wide Band Gap device introduction. The results of these efforts can be applied to future power electronics endeavors on programs such as the DD(X) Program. |