- EMPF MMIC Environments Coating Project - Functional Hermaticity for DoD RF Applications
The EMPF, in partnership with Raytheon and Dow Corning, is working on a MMIC Environmental Coating project which will research the application of functional hermeticity for Department of Defense (DoD) Radio Frequency (RF) applications (Figure 1-1). This project will help the DoD benefit from the current reliability without hermeticity (RWOH) movement in commercial electronics, which promotes the use of lower cost, lighter weight RF electronic assemblies. [Full Article]
- Chip Scale Packaging
The use of chip scale packaging raises many issues and concerns for electronic manufacturers. Reduced package size, component weight, and fine pitch leads are a few areas of concern when manufacturing with chip scale components. Design reviews must be thorough, process control methodologies must be in place, and properly trained operators and technicians will help achieve acceptable process yields. The EMPF offers a 3-day Chip Scale Manufacturing course that will benefit companies already manufacturing with chip scale packages as well as those ready to begin. This article discusses some of the common concerns and issues related to chip scale manufacturing that are covered in the EMPF course. [Full Article]
- Board Level Sealants
Sealants are polymeric materials that protect or isolate the printed wiring board (PWB) surface, underlying traces, and components from contamination and prevent unwanted process steps from occurring. They are widely used in the electronics industry and are a significant reason for the high reliability and longevity of current printed wiring assemblies (PWAs). [Full Article]
- Ask the EMPF Helpline!
A customer called into the Helpline concerned with the proper drying of an assembly on which corrosion had been observed at a 100KW resistor (Figure 3-1). The customer requested examination of a representative sample of assemblies and a detailed report of any findings. [Full Article]
- Tech Tips: Wire Bonding: Ball Bonding vs. Wedge Bonding
Wire bonding is the most prevalent and robust die interconnection method used today. However, even with its popularity and status as the preferred die/lead-frame interconnection, there can be significant differences in the performance of wire bonds. In this month’s Tech Tips, the differences between ball and wedge wire bonding techniques are examined. [Full Article]
- New Materials in Hermetic Isolinear Chips
Moisture and organic and ionic contamination are major contributors to semiconductor isolinear chip (IC) device failures. Traditionally, these effects have been mitigated through the use of hermetic packaging. Traditional materials for hermetic packages are ceramic packages and glass-to-metal seals. Studies have shown that hermetic packages have the fewest failures per cycle than other packaging, in particular plastic. [Full Article]
- Manufacturers’ Corner - I Systems: Three-Dimensional Surface Profiling
Achieving consistency in the process of visually inspecting SMT board assemblies can be problematic. Many of the manual inspection tools in use (magnifiers, eye loupes, etc.) do not facilitate consistency as an individual or group of inspectors moves from board to board. To address this challenge, the EMPF uses the I Systems SMD-3D semi-automatic inspection system. It is primarily used in the Demonstration Factory for solder paste inspection and verification. It is also utilized in Boot Camp training, BGA Rework and Repair, and Advanced Packaging classes to illustrate the necessity of 3D inspection systems.
[Full Article]
- Upcoming EMLC Courses
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Empfasis is a publication of the American
Competitiveness Institute and the EMPF. The EMPF is the U.S. Navy’s
National Center of Excellence dedicated to advancing the state-of-the-art
in electronics and increasing domestic productivity in electronics manufacturing.
Our efforts in the field of electronics manufacturing, analytical services,
and our work with government and industry, yield the knowledge that we present
to you here.
