The oldering PCBs in a reflow oven is the most commonly used assembly method in the electronics industry today. While all ovens can perform reflow soldering and the curing of components, time inside the oven can be limited by the thermal specifications set by the solder paste manufacturer and due to the conveyorized transport system.

The EMPF uses the ESSEMTEC RO06-Plus batch oven for the following:

• Small quantity board prototyping
• PCB and component “burn-in”
• PCB and component drying (before rework)
• Curing
• Most lead-free solder applications

ESSEMTEC’s RO06-Plus offers the ability to run test cycles with a programmed thermal duration for up to 18 hours of continuous operation. This function is used mainly in the area of component or material testing for special curing applications, or for thermal cycling of components with temperature ranges up to 300°C.

The RO06-Plus also has the capability to solder PCBs with standard or lead-free solder pastes. The integrated, full-convection chamber can achieve low Delta-T temperature values and maintain the narrow process windows necessary for lead-free solder applications. The compact design allows use in space-limited locations.

Two standard Type K thermal couple ports allow the operator to attach multiple thermocouples to the application, set the desired profile parameters, then execute the profile based on the temperature of the PCBs rather than ambient air temperature. The LCD will display the temperature, and the profile will execute based on that reading. A large viewing window allows monitoring of the reflow process, helping to ensure trouble-free soldering while prototyping.

The motorized drawer automatically transports the PCB into the heating chamber when the programmed profile temperature is reached. After the temperature cycles are completed, the automatic drawer system moves the PCB to an integrated cooling zone to complete the process. An additional N2 connection with an integrated flow meter allows oven operation with an inert atmosphere. The PCB holder provides for a single PCB up to 400 x 300 mm in size or the soldering of many small PCBs at the same time (Figure 7-1).

Both small and large ovens require the same reflow profiles. The RO06-Plus offers convection heating, which allows programming of accurate profiles through microprocessor control. Its compact size allows for portable use where needed. An optional software package records real-time temperature profiles of the PCBs and the oven itself. Protocols from the software can be saved, printed, and compared with original profiles.

If you would like a demonstration of the RO06-Plus, please contact Jeff Stong at the EMPF at 610-362-1200, extension 224 or jstong@aciusa.org.