In order to minimize raw material scrap and maximize the benefits of PWB panelization it is important to evaluate the board layout and design an array that best suites your manufacturing requirements. More boards per panel may not be the solution you think it is. Below are some key design features to consider during your next panelization project. Additional information can be found in the IPC Standard 2221, is an excellent guideline for PWB panel design.

In order to minimize raw material scrap and maximize the benefits of PWB panelization, it is important to evaluate the board layout and design an array that best suites your manufacturing requirements. More boards per panel may not be the solution you think it is. Below are some key design-for-manufacturability features to consider during your next panelization project. (Additional information can be found in the IPC Standard 2221. This is an excellent guideline for PWB panel design.)

1.) Relate all PWB datum points of each PWB within a panel to the panel datum point. This will reduce tolerance buildup across the panel.

2.) PWB's within a panel should be kept as symmetrical as possible. This will increase panel rigidity during processing.



3.) Manufacturing tolerances accumulate across the entire panel. Industry concensus standards for feature location tolerances, found in IPC-2222, suggest that large panels may reduce solder paste print performance. When the largest X, Y dimension is 12”, expect up to 0.003” movement. This is possibly too much for good yields with 0.020” pitch components.


4.)Breakaways using V Groove panel machining. This method provides increased panel stability over routing/ mousebite machining. It does however impose a "keep out zone" near the board edge. Components and printed features placed near the board edges should be strong enough to withstand the stress of separating the boards from the panel. Without special equipment, V-Scoring subjects the individual boards to more mechanical stress than routed panels with mousebite machining.

5.) Breakaways using mousebite machining are formed by a combination of routing and etching. They impart less component stress during depanelization. However, these panels tend to be less rigid during processing. Place at least two tabs each board edge, and less than one every three inches. See, the IPC-SM-782 for more details associated with the figure below.