The demand for smaller and faster circuitry has made SMT (Surface Mount Technology) manufacturing the most popular electronics manufacturing technology today. Due to the reduction in component size and circuitry, installation and rework of SMDs (Surface Mount Devices) must be performed with a high degree of skill and accuracy. Proper workforce training will provide the operators and technicians with the skills and techniques required to perform SMT rework, pad preparation, and reinstallation of SMDs without the costly expense of damage to the electronic assemblies. Operators that are properly trained in the various SMT installation and rework techniques will be less likely to cause damage such as lifted or removed pads, damaged circuitry, burnt laminate, and component damage.

Companies utilizing SMT in their production need to evaluate their need for operator training. Selection of SMT rework personnel needs to be based not only on an operator’s soldering ability, but also on their ability to exercise good judgment. Too often, damage occurs when rework is acted upon without consideration for preheating, cleaning, material compatibility, and damage to adjacent components and circuitry.

IPC 7711 certification training at the EMPF provides a structured program that focuses on a variety of SMT installation, rework, and pad/land preparation methods. Students will gain the experience and knowledge needed to successfully perform non-destructive SMT removal, pad preparation, and reinstallation without causing damage to assemblies. Participants who successfully complete the course will gain a proficiency in the various rework methods.

The course consists of 9 modules, which allows participants to select training in the areas that are relevant to their production environments. In addition to learning the installation and rework techniques, the acceptability requirements of IPC-A-610 are reinforced during the course. Correct identification of acceptable and defective soldered assemblies, based on the requirements of IPC-A-610, is a requirement for certification.

Module 1 is a required prerequisite for Modules 2-9 and provides a foundation for participants to properly interpret the specifications and to gain an understanding of the general requirements of IPC 7711/7721. Proper handling techniques and ESD (electro-static discharge) prevention, baking and preheating procedures, and cleaning methods are introduced during this module. Participants are required to demonstrate proficiency through a written exam.

Modules 4, 5, and 6 focus on SMT rework, pad preparation, and reinstallation of the most commonly used SMDs. The following identifies the modules relevant to SMT installation and removal:

Module 4: Chip and MELF Components
Module 5: SOIC and SOT Components
Module 6: J-Lead and Gull Wing Components

The IPC 7711 program promotes several rework techniques used for each surface mount component type. Students will use a variety of soldering hand-pieces and tips on each type of component. Hot air removal, specialty tips, and tweezer techniques are demonstrated for all of the components. Students receive ample lab time during the course to practice the learned techniques. Students who successfully demonstrate competency will be awarded a certificate for each module, which is valid for 2 years.

Workforce training of SMT rework techniques will help optimize production throughput and minimize repair and scrap. The EMPF Training Center offers SMT Rework, IPC7711/7721, Certified IPC Specialist (CIS), and SMT Rework training at the EMPF or at your facility. Also available is a full certification program. This includes Module 2: Wire Splicing Procedures 8.1.1 to 8.1.4; Module 3: Through-Hole Components; Module 7: PWB Circuit Repair; Module 8: Laminate Repair; and Module 9: Conformal Coating Identification, Removal, and Replacement. For more details, visit our website at www.empf.org or contact the EMPF Registrar at 610-362-1320 or e-mail: registrar@empf.org.