- Thermal Battery Development Project
The EMPF recently initiated a Thermal Battery Development Project in conjunction with Alliant Techsystems (ATK). This U.S. Navy ManTech program formed in response to military demand for batteries with longer shelf lives. The program goals are to demonstrate thermal battery manufacturability and facilitate the entry of a new company into the thermal battery market. The focus of this plan is to use the DSU-33 Proximity Sensor’s thermal battery (Figures 1-1 and 1-2) as an initial test platform. The DSU-33 has been identified as having an immediate need and will benefit from having an alternate U.S.-based supplier. Additionally, the battery designed for the DSU-33 can be implemented into other applications because of common size and power requirements.[Full Article]
- Design for Manufacturability
The EMPF offers a popular one-day Design for Manufacturability (DFM) training course for design and manufacturing personnel. This course is based on the IPC-2220 series of design documents (“Design Standards for Printed Circuit Boards”). It deals with the attributes of a printed circuit board (PCB) design which determine whether it will be relatively easy or virtually impossible for the factory to build. This course reveals the many issues that can account for this difference.[Full Article]
- X-Ray Flourescence in Electronics Manufacturing
With the selection of lead-free solder alloy replacements for SnPb (tin-lead) coming into focus, much of the recent discussion about the lead-free transition has been about demonstrating compliance with the legislation that initiated the conversion. The European WEE and RoHS directives define specific amounts of toxic materials allowed for use in electronic equipment. These include lead (Pb), cadmium (Cd), mercury (Hg), hexavalent chromium (Cr6+), and multiple forms of bromine (Br). Conforming to the legislation may require quantifying the amount of these banned substances in solder joints, components, connectors, board materials, and the completed assembly.[Full Article]
- Ask the EMPF Helpline!
A customer contacted the EMPF Helpline after observing adhesion failure of chip components that were bonded with conductive epoxy.
EMPF staff evaluated the adhesion failures. The components were bonded to a gold-plated ceramic substrate. Adhesion failure was observed after the device was hermetically sealed and operating in the field. Failures were also observed on devices that were not in service. Two assemblies were provided for analysis. Both experienced adhesion failure where the chip component separated from the board, as seen in Figures 3-1 and 3-2.[Full Article]
- Tech Tips... Preparation for MIL-STD-461 Testing (Electromagnetic Interference)
MIL-STD-461 establishes the requirements for the control of electromagnetic interference (emission and susceptibility) characteristics of electronic, electrical, and electromechanical equipment and subsystems designed or procured for use by activities and agencies of the Department of Defense (DoD).[Full Article]
- Meeting Interface Requirements and Specifications with a COTS R&D Effort
Survival radios are the lifelines for warfighters placed in critical situations. By increasing the energy capacity and allowing for replacement and recharging of the battery cells, these lifelines can literally be extended. By giving the warfighter extended energy capability, this gives them a higher chance of survival and recovery. The sustainment redesign of the battery packs (Figure 5-1) for the AN/PRC-112D survival radios required clear definition of and adherence to interface requirements and specifications. In addition, significant cost and logistics benefits were achieved by incorporating several commercial off-the-shelf (COTS) components into the redesign [Full Article]
- Manufacturer's Corner: Concoat Systems
Conformal coating technology has become a vital part of many electronics manufacturing operations. Coatings ensure reliability and long-life operation of the finished electronic assembly under adverse conditions. A conformal coating (a dielectric material) protects the circuit assemblies against contamination. These coatings provide a secure envelope around a circuit board and its components while acting as a barrier against moisture, fungus, dust, salt spray, and other environmental contaminates. The coating materials also act to immobilize various types of particulate on the surface of the PCB assembly and function as a protective barrier. When applied properly, conformal coatings also enhance a circuit’s reliability by elimination of detrimental conditions (such as leakage from high impedance) while allowing for the tighter spacing of circuit traces required by high component densities.[Full Article]
- Upcoming EMLC Courses
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Empfasis is a publication of the American
Competitiveness Institute and the EMPF. The EMPF is the U.S. Navy’s
National Center of Excellence dedicated to advancing the state-of-the-art
in electronics and increasing domestic productivity in electronics manufacturing.
Our efforts in the field of electronics manufacturing, analytical services,
and our work with government and industry, yield the knowledge that we present
to you here.
