News
from the EMPF....
New Wide Band Gap Initiative from The EMPF
PHILADELPHIA, PA - February 16th, 2005 - - As part of a Memorandum of Agreement between DARPA, ONR and PEO Carriers regarding the use of Wide Band Gap Semiconductors for Ship’s High Power Distribution, a multi-year program has been established to focus the research and development efforts. The ultimate goal of this program is the realization of a Solid State Power Substation (SSPS) operating at 2.7 MVa and 20 KHz. The first demonstration vehicle is a 10Kv, 110A SiC based Power Module for insertion in the SSPS. By applying WBG technology to the SSPS, increased functionality and power management can be achieved with significant reductions in weight and size. This will not only benefit the new CVN 21 carrier platform, but will also be applied to the DD(X) program.
The EMPF and the Penn State Electro-Optical Center, as the Navy’s Centers of Excellence for electronics and optical technology, are teamed together to work with the selected vendors and provide guidance and assistance to evaluate and mitigate the risks associated with a new technology development program.
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New 2005 Initiative from EMPF - - APODS - Enhanced Optical Sensors
PHILADELPHIA, PA - February 8th, 2005 - - The EMPF, working with Airak, Inc., has taken on the task of bringing new optical sensor technology from the laboratory environment to actual demonstration in the form of a prototype current and voltage monitoring and control system to be used on new U.S. Navy ships and carriers.
Optical current and voltage sensors that weigh only ounces occupy cubic inches of space and can perform the task of sensors that weigh hundreds of pounds and are several cubic feet in size have been developed for the commercial industry under US Dept. of Energy SBIR funding. Widespread use of these sensors will enable automatic damage assessment of critical ship loads by being able to remotely determine the location of opens or shorts in electrical supply cables as well as abnormal supply levels. These sensors have been developed for this application by Airak, Inc.
The project is being managed through an Integrated Product Team, consisting of representatives from the Program Executive Office for Carriers, PEO-Ships, COMNAVSEASYSCOM, the Office of Naval Research, Naval Surface Warfare Center-Carderock ( Philadelphia branch), Airak and ACI. The IPT will be chaired by PEO-Carriers and will oversee the efforts necessary to develop, test and evaluate the sensors top determine their suitability for applications in combat ships, especially CVN-21.
ACI/EMPF Employees Receive Electronics
Awards
NORTHBROOK, Ill., March 10, 2004--
IPC-Association Connecting Electronics Industries
recently honored two employees of ACI/EMPF at its co-located IPC
SMEMA Council’s APEX®/IPC Printed Circuits Expo®/IPC
Designers Summit exhibition and conference, held February 24-26,
in Anaheim, Calif.
For their leadership and significant contributions in the development
of J-STD-001CS, Space Applications Electronics Hardware Addendum
to Requirements for Soldered Electrical and Electronic Assemblies,
Leopold A. Whiteman, Jr. and Guy
M. Ramsey were presented IPC Distinguished Committee
Service Awards, which are given to IPC committee members who have
made an exceptional contribution to a specific standard, guideline,
round robin test program or other IPC program.
Ramsey also received a second IPC Distinguished Committee Service
Award for his leadership and significant contributions in the
development of IPC-7912A, End-Item DPMO for Printed Circuit
Board Assemblies.
Additionally, IPC presented Ramsey with an IPC Special Recognition
Award for his significant contributions in developing the IPC
Professional Training and Certification Policies and Procedures.
This award is given to individuals who have made recent exceptional
contributions to an IPC program.
For more information on these awards, contact Joe
Dudeck, IPC communications manager, at JoeDudeck@ipc.org
or 847-790-5371.
About IPC
IPC is a Northbrook, Ill.-based trade association dedicated to
the competitive excellence and financial success of its more than
2,200 member companies, which represent all facets of the electronic
interconnection industry, including design, printed circuit board
manufacturing and electronics assembly. As a member-driven organization
and leading source for industry standards, training, market research
and public policy advocacy, IPC supports programs to meet the
needs of a $40 billion U.S. industry employing more than 350,000
people. IPC maintains offices in Taos, N.M.; Washington, D.C.;
Garden Grove, Calif.; and Shanghai, China. For more information,
visit www.ipc.org.
Affordable Microwave Packaging
Systems (AMPS)
Problem/Objective
Active phased radar arrays provide a distinct advantage for
our armed forces. This radar allows multiple beams for communication
from a single aperture. As a result, multiple targets can be tracked
simultaneously and independently. In order to affordably produce
active phased array radar and communication systems, advanced,
lightweight, and reliable microwave transmit/receive (T/R) modules
need to be manufactured with manufacturing costs significantly
less than that incurred using traditional technology and practices.
Producing T/R modules with traditional ceramic solid-state technology
is too costly for high volume production. The Affordable Microwave
Packaging Systems (AMPS) program is focused on developing new
packaging technology and processing methods that drastically reduce
the cost of high volume T/R module manufacture.
Approach/Business Strategy
One partial remedy for the high cost of T/R module production
came about from the use of GaAs monolithic microwave integrated
circuits (MMICs) in place of discrete components and transistors
in the T/R modules. AMPS is focused on improving the packaging
of the MMICs in multi-chip module (MCM) devices in terms of reliability,
production capacity, and cost. The approach is to package the
MMICs using a chip-on-flex (COF) form of high density interconnect
(HDI). Use of HDI eliminates chip connections using wire bonds,
which are considered a reliability liability. Using HDI also results
in a module that has a higher speed, is more compact, and is lighter
in weight. In addition, a plastic material will replace the expensive
ceramic substrate and housing traditionally used in MCMs. Finally,
an integrated production environment will be designed and implemented
to help reduce touch labor and allow for process optimization.
Accomplishments/Payoff
-
Twelve prototype T/R modules were fabricated
to demonstrate process enhancements developed under the AMPS
program.
-
The build achieved a 100% fabrication yield.
-
The touch labor metrics obtained from the
build, extrapolated to the higher production volume goal of
100,000 modules and using an established learning curve percentage,
indicates that the program goal of reducing touch labor by
93% for high volume T/R module manufacturing will be achieved
and even surpassed.
-
The ablated air bridge protection process
developed for the AMPS program involved laser ablating pockets
in the overlaying adhesive layer over air bridges and other
sensitive areas of the GaAs MMICs. The success of the process
was proven by no decrease in electrical performance of the
modules in the prototype build. A substantial savings in touch
labor is also achieved with this process compared to the previously
utilized method.
-
An advanced component mapping system used
on the prototype build proved eight times faster than the
previously used system, allowing for increased throughput.
-
A new dam and fill plastic molding process
was successfully demonstrated on the prototype build. This
process is key to transitioning to large format carriers to
increase production quantities as well as drive down fabrication
costs.
-
Certain MMIC devices used on the prototype
build were successfully attached to shims using a newly developed
high volume manufacturing process using Au/Sn (80/20) solder.
In this die attach process, a pin-less fixture is used in
conjunction with external gas pressure that compresses the
solder during reflow.
| Timeline/Milestones |
| |
Passive Circuit Integration |
3/99 |
|
| |
Wet Process Development |
4/99 |
|
| |
Process Modeling: Issue Plastic HDI Model |
4/99 |
|
| |
Final Report: Die Attach Optimization |
4/99 |
|
| |
Advanced GaAs AB Protection: Design Demonstration
Vehicle |
10/99 |
|
| |
Efficient Laser Processing |
4/00 |
|
| |
High Throughput Metalization |
4/00 |
|
| |
Final Report: High Volume HDI Processing |
4/00 |
|
| |
Final Report: Virtual Kitting |
9/01 |
|
| |
Issue Automated Test Final Report |
9/01 |
|
| |
Issue Integrated Production Final Report |
9/01 |
|
| |
Data Analysis and Final Report on Pre-production
Build |
9/01 |
|
Funding
- ManTech: $6,685,000
- Industry cost share: $41,300,000
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Flexible Manufacture of Microwave Vacuum Devices
Problem/Objective
All service branches have applications for high power microwave
devices. Historically, these devices have been tubes, such as
the Traveling Wave Tube (TWT). Since there are few uses for the
TWT outside of the military sector, the commercial industry has
not been the driving force for cost and performance of these devices.
Currently, the military purchases approximately 2/3 of the total
tubes sold. There is continuing work to develop higher power Radio
Frequency (RF) semiconductors, but for the frequency and power
required, the TWT is the device of choice for applications from
1 to 100 GHz. TWTs are used in over 200 existing weapon systems
and supporting these systems alone would require TWTs through
the year 2030.
The Army and Navy jointly funded the TWT project
with a significant amount of industry cost share. Among the programs
expected to benefit from the TWT effort are the Navy Cooperative
Engagement Capability (CEC), Air Force MFEWCM, Army Patriot Advanced
Capability (PAC-3), and Tri-service Global Broadcast System (GBS).
The objective of the project was to improve the manufacturing
efficiency through the concept of flexible manufacture. Flexible
manufacture is the use of one or a small number of manufacturing
lines to produce a large variety of products, in this case a variety
of different TWTs.
Approach/Business Strategy
In phase I of the project, a manufacturing improvement program
involving several manufacturers was established. Each participant
in the program would work in a different part of the frequency
spectrum, but would share their work through frequent "tech talks."
The participants would focus on manufacturing improvements which
would reduce the cost of tube manufacture. Improvements centered
on the concept of flexible manufacture and included manufacturing
automation, new assembly techniques and test automation. The results
were then presented to the participants and interested parties.
Accomplishments/Payoff
During Phase II, each of the following three manufacturers worked
on improvements focusing on different frequencies and technologies.
Northrop Grumman, working on C Band devices, focused
on the reduction of touch labor and direct material. Each part
of the tube was evaluated for low cost implementation and streamlined
manufacturing methods. Standardized methods were worked out for
piece/part processing and assembly fixturing. Additionally, automated
test methods were developed. The existing C Band tube was used
as a baseline for new process work and detailed cost comparisons
were maintained. A cost reduction of over 40% was realized for
the C Band tube and, because of flexible manufacture, much of
these savings are applicable to other tubes.
Teledyne focused on the industry-wide issues in
helix, barrel and support rod fabrication for Ka Band devices.
The initial study showed that application and measurement of support
rod loss patterns are the critical issues in a high yield, low
cost manufacturing environment. Several techniques for loss pattern
deposition were evaluated, while the key problem of reducing the
reject rate was addressed using improved measurement equipment.
CPI Inc. developed manufacturing improvements for
a coupled cavity millimeter wave tube. Their tasks included improved
process layout, redesigned RF window, modified assembly methods
for the RF circuit assembly, redesigned magnet assembly, collector
and gun assemblies and a new automated test station. New process
documentation was developed as part of the flexible manufacture.
The documentation was picture-oriented to reduce assembly errors
and enhance manufacture of different tubes on the same manufacturing
line. This particular tube is to be used in the PAC-3 missile
and 100% payback is expected on the 50th unit.
Phase III, which started in the first quarter of
2001, will verify the manufacturing improvements with the test
build of a candidate tube. The tube chosen is a millimeter device
used by the PAC-3 missile system. During the test build, data
will be collected to determine the actual savings in money and
time resulting from the Phase II improvements.
The TWT project team, under the leadership of the
American Competitiveness Institute (ACI), recently received the
2000 Defense Manufacturing Technology Achievement Award for work
on the Flexible Manufacture of Microwave Vacuum Devices Project.
This honor is presented each year by Deputy Under Secretary of
Defense for Science & Technology, Dr. Delores M. Etter, and the
Joint Defense Manufacturing Technology Panel. The award is made
for a specific innovative manufacturing technology achievement
that has had a significant impact on one or more of the following:
rapid transition of defense-essential or defense-unique technologies,
affordability, cycle time, readiness, quality and/or decoupling
cost from volume.
| Timeline/Milestones |
| |
Concept Development |
10/97 |
|
| |
Flexible Manufacturing Methods Development |
9/98 |
|
| |
Helix Tube Manufacturing Improvements Demonstrated
(Teledyne) |
2/00 |
|
| |
Completed Flexible Manufacturing Improvements
(Northrup Grumman) |
4/00 |
|
| |
Production Readiness Review |
8/01 |
|
| |
PAC-3 TWT Test Articles Complete |
11/01 |
|
| |
Test Article Acceptance Test |
12/01 |
|
| |
Final Report |
4/02 |
|
Funding
-
Navy: $1.2 M
-
Army: $2.0 M
-
Cost Share: $6+ M
| Participants |
| |
Navy CEC |
| |
Air Force MFEWCM |
| |
Army PAC- 3 |
| |
Tri service GBS |
| |
CPI |
| |
Teledyne |
| |
Northrup Grumman |
| |
ACI, Philadelphia, PA |
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American Competitiveness Institute Establishes
Power Electronics Teaching Factory
The American Competitiveness Institute (ACI), a
scientific research and development corporation headquartered
in Philadelphia, through an agreement with the US Office of Naval
Research as a part of the Department of Defense Dual Use Science
& Technology program, has established a Power Electronics Teaching
Factory (PETF). The Teaching Factory will develop the technology
to produce power electronic devices at high volumes and will support
Power Electronic Building Block (PEBB) concepts and technologies.
A PEBB is a universal power processor, which is able to convert
a wide range of electrical power input to any desired form of
voltage, current or frequency output.
The PETF will incorporate classroom curriculum,
along with a hands-on automated manufacturing line to instruct
and train engineers, technicians and manufacturing personnel in
methods of manufacturing power electronic modules. In addition,
the teaching factory will be used to evaluate and demonstrate
new designs, materials and manufacturing methods. Several power
electronics prototype devices are currently being transitioned
to manufacturable products.
The PETF power electronics course, Design Concepts
for Power Electronics, is a three-day course and is the first
of a four course series focusing on the manufacture of power electronics.
The remaining three courses are Materials for Power Electronics,
Packaging and Assembly Techniques for Power Electronics and Thermal
Management and Electrical Performance. These courses will provide
the class participants with a fundamental understanding of the
basic concepts of the design and manufacture of power electronic
assemblies. The participants will learn to make informed decisions
about design and manufacturing related issues for power electronics.
Classes will consist of a mix of classroom and laboratory activity.
This first series of courses will undergo its beta-testing period
during the early summer.
The American Competitiveness Institute (ACI) was
established in 1992 as a scientific research corporation dedicated
to the advancement and integration of leading edge technologies
in electronics manufacturing and related engineering applications.
ACI is uniquely qualified to address research and development
activities, including applied research, product and process development,
prototype demonstration, product evaluation, reverse engineering
and obsolescence mitigation, technology transfer and commercialization
activities for both military and industrial-driven technologies.
ACI has design, development, analysis, and prototyping capabilities
and maintains a staff of highly experienced technical personnel
whose expertise covers the entire spectrum of the electronics
industry. The ACI facility is located in an office campus adjacent
to the Philadelphia International Airport. The facility houses
a 10,000 square foot demonstration factory, fully equipped classrooms
with multimedia training aids, an analytical laboratory for materials
and environmental testing, conference and lecture rooms with video
conferencing capabilities, and a fully functional technical library.
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Rapid Response
Projects
Four new rapid response projects are underway at ACI. The projects
include:
-
F/A-18E/F Flat Panel Displays
The objective of this project is to identify technical difficulties
surrounding domestic production of Active Matrix Liquid Crystal
Display (AMLCD) glass.
-
Investment Strategies for Integrated Power
Systems
The objective of this project is to develop
a Strategic Investment Plan to address the electronics manufacturing
and testing issues associated with Navy Integrated Power Systems
(IPS) and Electric Propulsion Systems (EPS).
-
Standoff Land Attack Missile - Expanded
Response
The objective of this project is to support the Standoff Land
Attack Missile - Expanded Response (SLAM-ER) Total Ownership
Cost Reduction Initiative.
-
Standard Missile II - Block IVA
The objective of this project is to assist Raytheon in eliminating
vibration induced fatigue failures of the multi-chip module
(MCM) on the SM2-Block IVA digital signal processing circuit
card.
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EMPF Success Story: the EA-6B Program
The first program managed by ACI supported the EA-6B
program. In 1995, the DOD made the decision to retire the Air
Force F-111 and to transfer all tactical air electronic warfare
responsibilities to the Navy EA-6B. This required a 20-year service
life extension to that aircraft and upgrade of the EW electronics
suite on all aircraft to the most recent (block 89A) configuration.
The all-digital Universal Encoder Upgrade (UEU) and the Computer
Interface Unit and Encoder (CIU/E) were required on all 540 aircraft.
The UEU had been developed, but never produced, and the CIU/E
had been out of production for over ten years. The objective of
the program was to provide a technology refresh to legacy electronics
hardware and manufacturing processes. In an Integrated Product
Team (IPT) format with representatives from industry, ACI (as
managers of the EMPF), and the Acquisition Program Manager (Stakeholder),
studied, matured and transitioned manufacturing technologies to
the factory floor at both AIL Systems and Litton.
The re-engineered units are in production at a unit
price that will provide over $20 million in cost reduction relative
to the price of the original units. The cost savings are due to
the introduction of state-of-the-market, automated manufacturing
and inspection processes and the use of current electronic component
replacements for obsolete parts packaged in the most recent (e.g.
ball grid array format) configurations. The return on investment
(ROI) was 3:1.
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