News
from the EMPF....
EMPF Receives Navy ManTech Contract to Reduce Cost of T/R Modules
PHILADELPHIA, PA - April 4th, 2011 - - The packaging of RF multi-chip modules for military applications traditionally employs ceramic substrates that are subsequently hermetically sealed. Although these packaging schemes have proven to be highly robust in a variety of environments, they also carry a significantly higher cost than non-hermetic alternatives. Working with Lockheed Martin, ACI Technologies will develop a T/R module for an S-Band Radar using Monolithic Microwave Integrated Circuits (MMICs) in plastic Quad Flat No-Lead (QFN) packages. These devices are subsequently assembled to a PCB constructed of industry-standard RF laminate materials and assembled using commercially available surface mount processes. Overall performance of this design will be measured, and environmental testing will be performed to verify the robustness of the plastic QFN packaging approach. When implemented, this solution will significantly reduce the T/R Module cost for the system.
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