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Current EMPF Projects
| SiGe System-on-Chip (SoC) |
The SiGe System-on-Chip (SoC) ManTech project includes development and demonstration of a receive antenna that will provide the capability to meet the low cost, weight and reliability requirements for phased array antenna solutions on the DDG1000 and MMA (Multi-Mission Maritime Aircraft).
[more]
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| Power Packaging Lab |
The goals of the Power electronics lab are to develop manufacturing capabilities in assembly technology that can exploit the advantages of advanced materials. Furthermore, the laboratory will transfer advanced manufacturing technologies to military and commercial vendors who will deliver advanced electronics and power system to future US Navy surface ship platforms. [more]
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| High G Packaging |
Advanced weapon systems such as the Long Range Land Attack Projectile (LRLAP) must meet stringent mission requirements in the areas of lethality and collateral damage. The Land Attack Projectile (LRLAP) utilized in conjunction with the Navy’s Advanced Gun System (AGS) – critical to the overall success of the DDG 1000. The trends in electronics of ever increasing miniaturization on top of a generally decreasing cost curve can be exploited in the precision guided munitions (PGM) arena. Therefore, it is of supreme importance to develop packaging techniques that allow electronics modules to withstand the high-g forces encountered during a gun launch. [more]
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| Power Electronic Module |
| The current configuration of warships separates their propulsion system from their weapons and auxiliary systems. This confines a large amount of power in the mechanical drive train, which is not available for other uses. Future all-electric warships will change this situation, allowing large amounts of energy to be shared among different systems, such as pulsed power weapons and sensors, on a prioritized, as needed basis. This paradigm shift to an integrated all-electric design will significantly improve efficiency, effectiveness, and survivability while simultaneously increasing design flexibility, and reducing costs. [more] |
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