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One method reduces the weight and size of the current heavy, bulky transformers used in legacy power distribution systems by replacing them with a solid-state transformer. By leveraging the increased operating frequency of the power electronics, a transformer can be used that is reduced in size. The new Wide Band Gap (WBG) semiconductors, principally SiC, operate at higher frequencies, higher temperatures, and require less cooling than silicon devices. The lower switching loss at high frequencies and the higher blocking voltages of SiC devices allow for the use of smaller transformers and inductors. The increased operating frequency of the SiC enables major size reductions (up to 60%) compared to systems designed for silicon-based solid state technology. The higher breakdown voltage levels offered by SiC power electronics meet voltage levels presently managed by electromechanical switch technology. Improved thermal management of semiconductors and passive components through upgraded packaging will allow more current to be handled by a given device and lead to improved power density designs. Power conversion equipment developed using SiC technology is projected to significantly reduce the workload and maintenance requirements for current and future carriers and is considered a critical step in achieving CVN 78 compliance with Key Performance Parameters for weight reduction and ship stability. Current power electronics packaging cannot meet the Department of Defense (DOD) metrics for High Power Electronics. The objective of this project was to develop and demonstrate the reliability of a high temperature packaging methodology that is applicable to current power devices / modules as well as readily adaptable to future power device technology. The development of a 2.7 MVA Solid State Power Substation (SSPS) was identified as a first demonstration vehicle.</p> <p align=left><b>Payoff</b></p> <p align=left>This Navy ManTech project has resulted in a packaging technology that advances the overall power components industry with high temperature (150  200ºC) and high voltage (>10 kV) capabilities and allows for decreased weight, decreased size, and lower cooling requirements. This packaging effort will enable the Navy to realize the high temperature operation potential of WBG semiconductor materials with packaging materials technology that meets SSPS operational specifications not currently offered by the power electronics industry. The power electronics components produced using this new manufacturing technology will enable the design and development of power distribution systems that are 60% smaller with reduced weight (>2Ton/MW), improved voltage regulation, unity power factor (20% increase in power), and fast fault detection, protection, and restoration.</p> <p align=left><b>Implementation</b></p> <p align=left>The transition strategy for this project was governed by the  Memorandum of Agreement between DARPA, ONR, and PEO Carriers regarding the use of Wide Band Gap Semiconductors for a ship s high power distribution system. At the conclusion of the project, the manufacturing technology will be implemented at Powerex Inc. for use in the manufacturing of power electronics modules specified by the SSPS program, as well as components required for other DOD program.</p> <br /><br /><br /> </div> </td> </tr> </table> <!-- InstanceEndEditable --></td> </tr> <tr align="left"> <td height="51" valign="top"><table width="200" border="0" cellpadding="1" bordercolor="#003366" bgcolor="#003366"> <tr> <td bgcolor="#003366"><p align="center"><img src="http://www.empf.org/images/shim.gif" width="200"> </td> </tr> </table></td> </tr> <tr> <td height="2%" colspan="2">&nbsp;</td> </tr> </table> <table width="100%" border="0" align="center"> <tr> <td><div align="left"><a href="http://www.onr.navy.mil/"><img src="http://www.empf.org/images/onrlogo.gif" alt="The Office of Naval Research" width="144" height="66" border="0"></a></div></td> <td><div align="right"><a href="http://www.onr.navy.mil/Science-Technology/Directorates/Transition/Manufacturing-ManTech.aspx"><img src="http://www.empf.org/images/mantech.gif" alt="Navy Mantech" width="144" height="42" border="0"></a></div></td> </tr> </table> <table width="100%" border="0" align="center"> <tr> <td width="84%" class="small"> ACI Technologies, Inc. - - One International Plaza - Suite 600 -- Philadelphia, PA 19113 - - <a href="http://www.aciusa.org" target="_blank">www.aciusa.org</a> - - (610)362-1200</td> <td width="16%" class="small"><div align="right"><a href="http://www.empf.org/sitemap.htm">[sitemap]</a></div></td> </tr> </table> <map name="Map"> <area shape="rect" coords="62,43,123,77" href="http://www.aciusa.org" target="_blank" alt="ACI Technologies, Inc. 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