Current EMPF Projects ALQ 99 Jammers APODS MMIC Environmental Coating Lead Free Manufacturing MEMS IMU MMIC SDV TRENT Completed Projects Link-16 Program AMPS PEBB EMMA TWT Surface Spectroscopy Electronics Suite Upgrade for the EA-6B
ALQ 99 Jammers APODS MMIC Environmental Coating Lead Free Manufacturing MEMS IMU MMIC SDV TRENT
Link-16 Program AMPS PEBB EMMA TWT Surface Spectroscopy Electronics Suite Upgrade for the EA-6B
Helpline Question Form
Lead Free Articles from the EMPFasis July EMPFasis 2006 Power Electronics and Packaging Facility Lead-Free Training Die Attachment Technology Ask the EMPF Helpline! Cable Shielding Troubleshooting Wire Bonding High Temperature Packaging for Power Devices Orthodyne PowerRibbon Wire Ribbon Bonder Upcoming EMLC Courses June 2006 EMPFasis Hermetic Coatings Overview 7711 / 7721 Flip Chip Underfill Processing Ask the EMPF Helpline! Liquid Crystal Polymer Packages Tech Tips: Flip Chip Assembly Manufacturer’s Corner - Oxford XRF Upcoming EMLC Courses May 2006 EMPFasis Advanced Sensor Installation at NSWC Philadelphia DFM Vibration / Shock & Thermal Testing Ask the EMPF Helpline! Tech Tips... How to Test for Hermaticty Current Sensor Comparison Manufacturer’s Corner - SEICA ATE Upcoming EMLC Courses April 2006 EMPFasis Design, Manufacturing, and Packaging in Sustainment IPC/WHMA-A-620 Analysis and Restoration of Storm Damaged Boards Ask the EMPF Helpline! Tech Tips... Hardware Restoration PRC-112 Battery & Charger Synopsis Manufacturer’s Corner - Technical Devices Upcoming EMLC Courses March 2006 EMPFasis GEIA Program Manager's Handbook Custom Training Lead-free Conversion: Surface Finishes Ask the EMPF Helpline! GEIA Tin Whisker Industry Standard Manufacturer's Corner - Niton XRF Analyzer Tech Tips... BGA Repair for Mixed Assemblies Upcoming EMLC Courses February 2006 EMPFasis Integrated Power Systems Failure Analysis Training Profiling of Power Printed Circuit Boards (PCBs) Ask the EMPF Helpline! Tech Tips... High Power Training and Safety Open Systems Qualification Manufacturer's Corner - DynamicIR for Lead-Free Rework Upcoming EMLC Courses January 2006 EMPFasis Re-engineering and Re-packaging of the AN/TRN-30 Beacon Boot Camp Printed Wiring Board (PWB) Repair Techniques: 7721 Ask the EMPF Helpline! Tech Tips... IPC-J-STD-001 Vendor Survey Wide Band Gap Devices in Power Systems Manufacturer's Corner - McDry Air Drying Cabinet Upcoming EMLC Courses Special End of Year EMPFasis 2005 Improving Battery Logistics for the Warfighter IPC-7711/7721 – Rework, Repair, and Modification Training and Certification Cleaning PCBs Exposed to High Humidity and Storm Damage Ask the EMPF Helpline! Tech Tips... Vendor Qualification Checklist Seal Delivery Vehicle Battery Project Manufacturer’s Corner: JBC Advanced Series Soldering Irons Upcoming EMLC Courses September 2005 EMPFasis Thermal Battery Development Project Design for Manufacturability X-Ray Flourescence in Electronics Manufacturing Ask the EMPF Helpline! Tech Tips... Preparation for MIL-STD-461 Testing (Electromagnetic Interference) Meeting Interface requirements and Specifications with a COTS R&D Effort Manufacturer’s Corner: Concoat Systems Upcoming EMLC Courses August 2005 EMPFasis Lead-Free Design Conversion IPC-A-610 - Acceptability of Electronics Assemblies Flying Probe Tester Ask the EMPF Helpline! Tech Tips... Implementing a Lead-Free Evaluation or Certification Test Plan Reliability Modeling of Lead-Free Soldering Manufacturer's Corner: X-Ray Flourescence Analyzers Upcoming EMLC Courses July 2005 EMPFasis Tin Whiskers and the Impending RoHS Conversion to Lead-Free Failure Analysis and Reliability Testing Ball Grid Array Inspection Equipment Ask the EMPF Helpline! Tech Tips... Ball Grid Array Optical Inspection Condition Based Maintenance for CVN-21 and DD(X) Manufacturer's Corner: Lead-Free Soldering with Pace TW-50 and NF500 Upcoming EMLC Courses June 2005 EMPFasis Cost Reduction of IMUs for Precision Guided Weapons Revision D for IPC-A-610 and J-STD-001 Shock Testing of Battery Cases Ask the EMPF Helpline! Survey on High-G Testing Methodology Tech Tips- Cable Assembly: Insulation Displacement Connections Manufacturer’s Corner: Phoenix X-Ray Upcoming EMLC Courses May 2005 EMPFasis EMPF MMIC Environments Coating Project - Functional Hermaticity for DoD RF Applications Chip Scale Packaging Board Level Sealants Ask the EMPF Helpline! Tech Tips: Wire Bonding: Ball Bonding vs. Wedge Bonding New Materials in Hermetic Isolinear Chips Manufacturers’ Corner - I Systems: Three-Dimensional Surface Profiling Upcoming EMLC Courses April 2005 EMPFasis Fiber Optic Implementation of Condition Based Maintenance (CBM) Cable and Wire Harness Assembly Training Lead Free Hand Soldering Ask the EMPF Helpline! Tech Tips: Reflow Encapsulating (No-Flow Reflow) Optical Current and Voltage Sensors for Busbar-Monitoring of Navy Switchboards Manufacturers’ Corner: APE Rework Stations Upcoming EMLC Courses March 2005 EMPFasis Re-engineering of Aging Army Radio Beacon Custom Training Catastrophic Failure Ask the EMPF Helpline! Tech Tips: Environmental Stress Screening (ESS) through Mechnanical Shock Testing Upgrading Aging Radio Frequency (RF) Systems Manufacturers’ Corner: Aqueous Technologies Upcoming EMLC Courses February 2005 EMPFasis Manufacturability of Bumped RF Devices for DoD Applications Rework and Repair of Electronic Assemblies Failure of Bumped Devices Ask the EMPF Helpline! Tech Tips: Ball Grid Array (BGA) Repair Lighter, Less Expensive Radio Frequency (RF) Packaging Materials Manufacturers’ Corner: SonoTek SonoFlux 9500 Ultrasonic Spray Fluxing Machine Upcoming EMLC Courses January 2005 EMPFasis Lead Free Manufacturing for Navy Systems New Courses at the EMPF Addresses Lead Free Soldering Lead Free Analytical Services Ask the EMPF Helpline! Tech Tips: Lead Free Rework and Repair of Ball Grid Arrays (BGAs) Lead Free Solder Process Audit Manufacturers’ Corner: Technical Devices - Wave Soldering Systems Upcoming EMLC Courses December 2004 EMPFasis High-G MEMS IMU for Precision-Guided Munitions Electronics Manufacturing Boot Camp Conformal Coating Failures Ask the EMPF Helpline! Tech Tips: Improving Chip on Board Assembly The Use of Scanning Acoustics Microscopy in Electronics Manufacturing Applications Manufacturers’ Corner: Dazor speckFINDER Electronics Video Microscopy Upcoming EMLC Courses November 2004 EMPFasis Technology Refresh Planning Aids in Sustainment of Military Systems Training for BGA: Manufacturing, Rework, and Repair Reverse Engineering Key to Sustaining Undocumented Printed Circuit Board Assemblies Ask the EMPF Helpline! Tech Tips: Thermal Cycling for Non-Destructive Product Screening Analysis of RF Signals for Sustainment Manufacturers’ Corner: Essemtec Upcoming EMLC Courses October 2004 EMPFasis Power and Energy Solutions for Survival SMT Installation and Rework Failure Analysisfor Reliability and Manufacturability Ask the EMPF Helpline! Tech Tips: Correct Application of Solder Paste Reducing Battery Dependency Through Energy Harvesting Manufacturers’ Corner: EVS International Upcoming EMLC Courses September 2004 EMPFasis Next Generation Aircraft Carrier Power Initiatives Ask the EMPF Helpline Failure Analysis and Reliability Testing Course Manufacturers’ Corner:Finding the Right Marking System Tech Tips: Selection of Small Gage Wire Condition Based Maintenance in Power Applications X-ray analysis Upcoming EMLC Courses August 2004 EMPFasis Use of Commercial Technology in DoD RF Modules Ask the EMPF Helpline Packaging Technologies for C-band and Above PWB Qualification: Peel Testing Tech Tips: Failure Analysis 101 Manufacturers’ Corner: NuClean In-Line Aqueous Cleaner Characteristic Properties of Materials Used in Electronics Manufacturing Upcoming EMLC Courses July 2004 EMPFasis Beyond Form, Fit, and Function- New Considerations for Legacy Systems Ask the EMPF Helpline The Advantages of Environmental Stress Screening in Reliability Verification of Reliability in Components Tech Tips: Wire Bonding Techniques Manufacturers’ Corner: METCAL- BGA Visual Inspection System Custom Training Upcoming EMLC Courses June 2004 EMPFasis AN/ ARS-6 UpgradeProgram Electronics Manufacturing Boot Camp Intermetallics in Electronic Soldering Ask the EMPF Helpline Tech Tips - BGA Rework RF Modeling of Ruggedized Assemblies Manufacturers’ Corner: Flying Probe Testing- SPEA Upcoming EMLC Courses May 2004 EMPFasis EMPF Program Supports Technology Upgrades For Navy Advanced Power Applications Modular Approach to Certification Training Analysis of Device Longevity Manufacturing with High Temperature Solder Paste Thermal Profiling The Use of Fuel Cells in Navy Energy Sources Manufacturers’ Corner: MIMOT - Flexibility and Automation in SMT Assembly Ask the EMPF Helpline Upcoming EMLC Courses April 2004 EMPFasis Electronics Manufacturing Improvements For Precision Guided Weapons Characteristic Properties of Materials Used in Electronic Assemblies Solderability Testing and the Transition from Lead to Lead-Free Solders Reflow Encapsulating (No-Flow Underfilling) Use of COTS Components in DoD Applications Manufacturers’ Corner: BTU Oven Ask the EMPF Helpline Upcoming EMLC Courses March 2004 EMPFasis Failure Analysis of Advanced Electronic Packages Qualifying No-Clean Solder Paste Consideration of Using Ball Grid Array (BGA) Sockets Thermal Management in RF Packages Manufacturers’ Corner: Automated Optical Inspection (AOI) Ask the EMPF Helpline Upcoming EMLC Courses February 2004 EMPFasis Link-16 Acceptability Criteria for Cable and Wire Harness Assemblies Tech Tips - No Clean Process Optimization SIR Testing Wide Band Gap - Thermal Considerations Manufacturer's Corner - Beamworks Process Ask the EMPF Helpline Upcoming EMLC Courses January 2004 EMPFasis Synchro Assembly Upgrades for Navy Ships Design for Manufacturability Component Failure Analysis Open System Architecture Manufacturer’s Corner - R29 Printer Ask the EMPF Helpline Tech Tips: BGA Optical Inspection Upcoming EMLC Courses November 2003 EMPFasis Seal Delivery Vehicle Rapid Prototyping Tin Whiskers III PWB Panelization Thermal Cycling Manufacturer’s Corner -Beamworks Ask the EMPF Helpline Upcoming EMLC Courses October 2003 EMPFasis Technology Refresh Chip Scale PC Board Qualification Tin Whiskers II Reballing BGA Manufacturer’s Corner - McDry Cabinet Ask the EMPF Helpline Upcoming EMLC Courses September 2003 EMPFasis Lead Free Processing Lead Free Manufacturability Tin Whiskers Lead Free Rework 2004 EMLC Course Schedule Manufacturer’s Corner - Phoenix X-Ray Ask the EMPF Helpline Upcoming EMLC Courses August 2003 EMPFasis ARS 6 - P. Beshenich Lead Free - L. Whiteman Ask the EMPF Helpline - S. Pepe Sustainment Interfaces - B. Johnson Design for Sustainability - A. Anderson Manufacturer’s Corner - Metcal - J. Stong EMLC Course Schedule July 2003 EMPFasis MMIC Program - M. Allemang Nanotechnology - A.Vigliotti Custom Training - G. Ramsey SMT Rework - M. Morrison Manufacturer’s Corner - J.Stong Essemtec Expert Ask the EMPF Helpline - J.Butler Upcoming EMLC Courses June 2003 EMPFasis MEMS IMU Flex Connector Cleanliness Testing Tech Tips: X-Ray Inspection 2002 Lead Free Soldertec Award Manufacturer’s Corner: Alpha Metals’ Tetra Stencil Management System Ask the EMPF Helpline Upcoming EMLC Courses May 2003 EMPFasis Cutting Through the Haze of Saltfog Testing Tech Tips: Electrostatic Discharge (ESD) Control Manufacturer’s Corner: BTU Paragon 98 Ask the EMPF Helpline! EMLC Course Schedule March / April 2003 EMPFasis Aged Aircraft: Cost of Total Ownership Chip Scale Manufacturing IPC-7711 & 7721: Rework & Repair Chemical Testing at the EMPF Lead Free Soldering for Sustainment BGA Manufacturing, Inspection and Rework Industrial Alliance Board Manufacturer’s Corner: Hepco Tech Tips: Removing Conformal Coatings J-STD-001 and IPC-A-610 Compared Ask the EMPF Helpline! Upcoming EMLC Courses January / February 2003 EMPFasis Link-16 Manufacturability & Affordability of Power Modules Electronics Manufacturing Boot Camp Solder Paste Inspection State-of-the-Art Batteries COTS for Communication Electronics Ion Chromatography Training in Failure Analysis & Reliability Testing Manufacturer’s Corner: Concoat Systems Tech Tips: Re-balling BGAs EMPF Helpline 2001-2002 Summary Ask the EMPF Helpline! December 2002 EMPFasis Packaging Thermoelectric Modules for Demanding Environments September 2002 EMPFasis Tech Tips: Implementing Lead-Free Soldering June 2002 EMPFasis Manufacturer's Corner: Zestron February 2002 EMPFasis COTS Parts Qualification X-Ray Inspection Techniques for BGA and Flip Chip Packages Electronics Manufacturing Boot Camp Tech Tips: Flip Chip Underfill EMLC Course Schedule January 2002 EMPFasis Power Electronics - Motor Controllers A Passive Embedded Strain Detection System Design for Manufacturability Tech Tips: Contamination and Cleanliness Testing Manufacturer's Corner: EFD BGA Process Refinements Increase Production Yields Ask the EMPF Helpline! EMLC Course Schedule July 2001 EMPFasis Microsectioning of Lead-Free Solder Joints February 2001 EMPFasis Pb-Free Issues and the EPA EMMA January 2001 EMPFasis Energy Dispersive Spectroscopy for Electronics Failure Analysis Power Electronics Teaching Factory What's New in the IPC-A-610-C Mastering the Solderability Issue Tech Tips: CSP Rework - part 2 Manufacturer's Corner: Paragon 98 Ask the EMPF Helpline EMLC Course Schedule
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