Projects   /   Completed

S2153 — High-g Packaging and Miniaturization of Electronics for Deeply Integrated Inertial Guidance Units

PERIOD OF PERFORMANCE: September 2006 to December 2009

Objective

Honeywell’s BG1930G deeply integrated Inertial Navigation System – Global Positioning System with Anti-Jam capability (INS-GPS/AJ) product has been baselined as the primary production navigation, flight control, and mission computer for Lockheed Martin’s Long Range Land Attack Projectile (LRLAP) utilized in conjunction with the Navy’s Advanced Gun System (AGS) for the DDG 1000 destroyer. This project studied the packaging of the BG1930G or similar product to assess its survivability to different gun launch environments and suggest improvements to the design. Another aspect of this project was the application of multi-chip module (MCM) technology to the discrete semiconductor approach used in the BG1930G. System-On-a-Chip (SOC) technology is used for developing the next generation mission processor. The MCM approach combined the mission processor, inertial sensor assembly interface, digital antijam functions, user serial interface, and corresponding electronics functions onto a single substrate. Development and incorporation of MCM technology effectively eliminated an entire printed wiring board from the product baseline.

Payoff

In the past, projectiles and components have been designed to a specification of “survive x-thousand G’s”, which has resulted in program extensions and overruns, and advances in modeling and simulation have proven this method of specification insufficient. An improved method of specifying design criteria is to specify a representative load curve (with margin) that includes the dynamics of the system. This project applied this design methodology to the simulation of components for the Deeply Integrated Navigation and Guidance Unit (DIGNU) to determine survivability to gun launch and also made recommendations for design improvements. This project also sought to determine the survivability of some MEMS sensors to the high shock of gun launch. These recommendations would improve survivability. The application of SOC and MCM technologies reduced INS/GPS unit cost and the INS/GPS size to fit more DOD weapon applications. The SOC technology provided a greater than 2x improvement over the present processor platform, and consumed less power while handling a wider temperature range. The use of MCM technology will eliminate an entire printed wiring board from the product baseline and enable the achievement of aggressive Average Unit Production Pricing objectives, producibility, reliability, weight, and volume objectives mandated by LRLAP and other Joint Navy / USAF program applications.

Implementation

The effort detailed in this project was independent of an insertion target platform. The simulations performed, while dependent on the details of the individual IMU being modeled, formed the basis for a methodology for improving the shock resistance of MEMS sensors and electronics modules for other precision guided munitions. At the conclusion of this ManTech effort, the memory system, processors and custom interface functions were successfully integrated into a single 29mm x 29 mm package, and both its functionality and suitability for gun-hard applications, such as the BG1930 and BG1940 family in INS-GPS/AJ products will have been confirmed. At this point, the Technology Readiness Level (TRL) of the SOC will be TRL 6—suitable for integration into the LRLAP used on DDG 1000.

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